Claims
- 1. An integrated circuit package comprising:an organic substrate having an internal metallurgy system that electrically connects bonding pads on a top surface of the substrate to pin pads on a bottom surface of the substrate; a plurality of input/output pins that are surface mounted to the pin pads; a solder material having a composition that includes at least Sn and Sb, wherein the solder material is disposed between bonding surfaces of each of the plurality of input/output pins, thereby bonding the input/output pins to the pin pads of the substrate, and wherein the solder material has a melting temperature above 230 degrees Celsius; and an integrated circuit located on the top surface of the substrate, the integrated circuit containing a circuit which is electrically connected to the bonding pads.
- 2. The integrated circuit package as claimed in claim 1, wherein the composition of the solder material includes Sb in a range of 4 percent to 10 percent by weight.
- 3. The integrated circuit package as claimed in claim 2, wherein the composition of the solder material includes approximately 5 percent Sb by weight.
- 4. The integrated circuit package as claimed in claim 1, wherein the composition of the solder material is such that it has a melting temperature above a melting temperature of Sn—Pb solder, but below a temperature that would damage the substrate.
- 5. The integrated circuit package as claimed in claim 1, wherein the melting temperature of the solder material is 240 degrees Celsius, plus or minus 3 degrees.
- 6. The integrated circuit package as claimed in claim 1, wherein the melting temperature of the solder material is in a range of 237 to 243 degrees Celsius.
- 7. The integrated circuit package as claimed in claim 1, wherein the melting temperature of the solder material is higher than a melting temperature of a Sn—Pb solder material with a second melting temperature in a range of 190 to 230 degrees Celsius.
- 8. The integrated circuit package as claimed in claim 1, wherein the integrated circuit is a flip-chip that is attached to the bonding pads using Sn—Pb solder bumps.
- 9. An integrated circuit package comprising:an organic substrate having an internal metallurgy system that electrically connects bonding pads on a top surface of the substrate to pin pads on a bottom surface of the substrate; a plurality of input/output pins that are surface mounted to the pin pads; and a solder material having a composition that includes at least Sn and Sb, wherein the solder material is disposed between bonding surfaces of each of the plurality of input/output pins, thereby bonding the input/output pins to the pin pads of the substrate, and wherein the solder material has a melting temperature above 230 degrees Celsius.
- 10. The integrated circuit package as claimed in claim 9, wherein the composition of the solder material includes Sb in a range of 4 percent to 10 percent by weight.
- 11. The integrated circuit package as claimed in claim 10, wherein the composition of the solder material includes approximately 5 percent Sb by weight.
- 12. The integrated circuit package as claimed in claim 9, wherein the melting temperature of the solder material is 240 degrees Celsius, plus or minus 3 degrees.
- 13. The integrated circuit package as claimed in claim 9, wherein the melting temperature of the solder material is in a range of 237 to 243 degrees Celsius.
- 14. The integrated circuit package as claimed in claim 9, wherein the melting temperature of the solder material is higher than a melting temperature of a Sn—Pb solder material with a second melting temperature in a range of 190 to 230 degrees Celsius.
- 15. The integrated circuit package as claimed in claim 9, further comprising:an integrated circuit located on the top surface of the substrate, the integrated circuit containing a circuit which is electrically connected to the bonding pads.
- 16. The integrated circuit package as claimed in claim 15, wherein the integrated circuit is a flip-chip that is attached to the bonding pads using Sn—Pb solder bumps.
- 17. A computer system positioned on a printed circuit board, the computer system comprising:a bus; a memory coupled to the bus; and an integrated circuit package coupled to the bus, including: an organic substrate having an internal metallurgy system that electrically connects bonding pads on a top surface of the substrate to pin pads on a bottom surface of the substrate; a plurality of input/output pins that are surface mounted to the pin pads; a solder material having a composition that includes at least Sn and Sb, wherein the solder material is disposed between bonding surfaces of each of the plurality of input/output pins, thereby bonding the input/output pins to the pin pads of the substrate, and wherein the solder material has a melting temperature above 230 degrees Celsius; and a microprocessor located on the top surface of the substrate, the microprocessor containing a circuit which is electrically connected to the bonding pads.
- 18. The computer system as claimed in claim 17, wherein the substrate is an organic substrate.
- 19. The computer system as claimed in claim 17, wherein the composition of the solder material includes Sb in a range of 4 percent to 10 percent by weight.
- 20. The computer system as claimed in claim 17, wherein the integrated circuit is a flip-chip that is attached to the bonding pads using Sn—Pb solder bumps.
Parent Case Info
This application is a divisional of application U.S. Ser. No. 09/473,447, filed on Dec. 28, 1999 now U.S. Pat. No. 6,413,849.
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