Mitchell G. Ferrill

Person

Little Meadows, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Technology for temperature sensitive components in thermal processing
- Patent number 9,563,739
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Mitchell G. Ferrill
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Technology for temperature sensitive components in thermal processing
- Patent number 9,317,643
- Issue date Apr 19, 2016
- International Business Machines Corporation
- Mitchell G. Ferrill
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Enhanced-reliability printed circuit board for tight-pitch components
- Patent number 8,819,931
- Issue date Sep 2, 2014
- International Business Machines Corporation
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sandwiched organic LGA structure
- Patent number 7,795,724
- Issue date Sep 14, 2010
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced-reliability printed circuit board for tight-pitch components
- Patent number 7,615,705
- Issue date Nov 10, 2009
- International Business Machines Corporation
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature dependent semiconductor module connectors
- Patent number 7,255,571
- Issue date Aug 14, 2007
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature dependent semiconductor module connectors
- Patent number 7,137,826
- Issue date Nov 21, 2006
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hook interconnect
- Patent number 7,128,579
- Issue date Oct 31, 2006
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal/electrical break for printed circuit boards
- Patent number 6,235,994
- Issue date May 22, 2001
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TECHNOLOGY FOR TEMPERATURE SENSITIVE COMPONENTS IN THERMAL PROCESSING
- Publication number 20160188786
- Publication date Jun 30, 2016
- International Business Machines Corporation
- Mitchell G. Ferrill
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TECHNOLOGY FOR TEMPERATURE SENSITIVE COMPONENTS IN THERMAL PROCESSING
- Publication number 20150342056
- Publication date Nov 26, 2015
- International Business Machines Corporation
- Mitchell G. Ferrill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT FORMATION UNDER LOAD
- Publication number 20120300423
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Gerald G. Advocate, JR.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SANDWICHED ORGANIC LGA STRUCTURE
- Publication number 20090057865
- Publication date Mar 5, 2009
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED-RELIABILITY PRINTED CIRCUIT BOARD FOR TIGHT-PITCH COMPONENTS
- Publication number 20080271314
- Publication date Nov 6, 2008
- International Business Machines Corporation
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Enhanced-Reliability Printed Circuit Board for Tight-Pitch Components
- Publication number 20080014419
- Publication date Jan 17, 2008
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Temperature dependent semiconductor module connectors
- Publication number 20070010111
- Publication date Jan 11, 2007
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE DEPENDENT SEMICONDUCTOR MODULE CONNECTORS
- Publication number 20060205273
- Publication date Sep 14, 2006
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Mitchell G. Ferrill

Person

Patents Grantslast 30 patents

Technology for temperature sensitive components in thermal processing

Technology for temperature sensitive components in thermal processing

Enhanced-reliability printed circuit board for tight-pitch components

Sandwiched organic LGA structure

Enhanced-reliability printed circuit board for tight-pitch components

Temperature dependent semiconductor module connectors

Temperature dependent semiconductor module connectors

Hook interconnect

Thermal/electrical break for printed circuit boards

Patents Applicationslast 30 patents

TECHNOLOGY FOR TEMPERATURE SENSITIVE COMPONENTS IN THERMAL PROCESSING

TECHNOLOGY FOR TEMPERATURE SENSITIVE COMPONENTS IN THERMAL PROCESSING

INTERCONNECT FORMATION UNDER LOAD

SANDWICHED ORGANIC LGA STRUCTURE

ENHANCED-RELIABILITY PRINTED CIRCUIT BOARD FOR TIGHT-PITCH COMPONENTS

Enhanced-Reliability Printed Circuit Board for Tight-Pitch Components

Temperature dependent semiconductor module connectors

TEMPERATURE DEPENDENT SEMICONDUCTOR MODULE CONNECTORS