Patent Application
20120300423
The present invention relates to an interconnect formation and, more specifically, to a mechanical attachment for an interconnect formation under load.
In surface mount technology (SMT), primary attachment of large body connectors to solder pads of printed circuit boards (PCBs) can rely upon the use of load head fixtures. The connectors include pluralities of wafers (e.g., 120 wafers) that are arranged side-to-side in bays. The wafers each include leads that are to be electrically coupled to corresponding leads arrayed as solder pads on the printed circuit board. The load head fixtures aid in that process.
For example, during the conventional assembly process, the load head fixture is applied to a top of the connector to act as an external load that is applied downwards through the connector and toward the printed circuit board. The connector is then SMT reflowed under this load with the load head fixture in tact, which introduces a high thermal mass to the process that requires extended process time and reduces PCB and intermetallic compound robustness. After reflow, the solder joints are allowed to cool and the load head fixture is removed.
This conventional process requires that the load head fixture be well maintained and due to its mass can make optimizing the thermal reflow profile extremely challenging. A non-optimized thermal profile can result in solder joint defects and may lead to reduced solder joint reliability performance and quality.
According to one embodiment of the present invention, an apparatus is provided and includes a substrate, a connector, including discrete elements, each discrete element having a first end tied to a compliant spine and an opposite second end including a lead and a fastener, which is disposable to extend through the substrate and into the connector, the fastener and the connector being configured such that mechanical interference therebetween caused by fastener operation urges the connector toward the substrate to advance each of the leads toward respective solder positions in a common plane.
According to another embodiment of the invention, an apparatus is provided and includes a substrate, a connector, including discrete elements, each discrete element having a first end tied to a compliant spine and an opposite second end including a lead, each of the leads being disposable at respective initial positions in various non-common planes and a fastener, which is disposable to extend through the substrate and into the connector, the fastener and the connector being configured such that mechanical interference therebetween caused by fastener operation urges the connector toward the substrate to advance each of the leads toward respective solder positions in a common plane.
According to yet another embodiment of the invention, an apparatus is provided and includes a substrate on which leads are arrayed, a connector, including discrete elements, each discrete element having a first end tied to a compliant spine and an opposite second end including a lead, each of the leads to be respectively soldered to corresponding ones of the substrate leads and being disposable at respective initial positions in various non-common planes and a plurality of fasteners, which are each disposable to extend through the substrate and into the connector, the plurality of fasteners and the connector being configured such that mechanical interference therebetween caused by operation of the fasteners urges the connector toward the substrate to advance each of the leads toward respective solder positions in a common plane.
According to yet another embodiment of the invention, a method of assembling a connector to a substrate is provided, the connector including discrete elements, each having a first end tied to a compliant spine and an opposite second end including a lead. The method includes applying a force to the connector through the substrate to urge the connector toward the substrate and continuing the applying to advance each of the leads toward respective solder positions in a common plane.
Additional features and advantages are realized through the techniques of the present invention. Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention. For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings.
The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The forgoing and other features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
The invention embodiments described below minimize residual solder joint stresses and thermal exposure applied during large body connector primary attachment surface mount technology (SMT) assembly by eliminating the use of conventional load head fixtures. More specifically, a back-side stiffening member approach may be utilized to overcome connector coplanarity issues. The invention embodiments further describe a “fixtureless” assembly process that helps to significantly improve overall solder joint reliability performance.
The invention embodiments help to minimize applied stress and thermal mass during assembly of high I/O, high thermal mass connectors. Due to large variation of (incoming supplier) connector lead coplanarity, as well as local non-planarity in large PCBs (i.e., board dish, etc.), conventional printed circuit board assembly (PCBA) processing for such complex connectors requires the use of an external load before and during surface mount technology (SMT) solder joint reflow to ensure sufficient solder joint formation. While the conventional process exhibits drawbacks, as described above, the present invention embodiments employ the use of screw torque force through the connector to apply comparable loads whereby the introduced loads do not lead to the drawbacks of the conventional process.
The embodiments described herein are applicable for high I/O (high density) SMT connectors where coplanarity variation is often very high, but it is to be understood that the principles disclosed herein may be used with many other applications and technologies.
With reference to
The apparatus 10 further includes a connector 40 including discrete elements 50 and a compliant spine 55. The discrete elements 50 may be provided in groups of around 120 or may be divided into sub-groups and are planar, with each discrete element 50 being arranged side-to-side with one or two adjacent discrete element(s) 50. Each of the discrete elements 50 includes a first end 501, which is tied to the compliant spine 55, and a second end 502, which is opposite the first end 501. A lead 56 is disposed on each discrete element 50 at the respective second end 502 and is to be soldered to and thereby electrically coupled to the leads arrayed as solder pads on the upper surface 22 of the substrate 20. As shown in
With reference to
The fastener 70 is disposable at the fastening location 30 with the elongate portion 71 disposed to extend through the through-hole 24 into the connector 40 such that the complementary threading (or other surface features) of the elongate portion 71 and the connector 40 mate or register with one another. The fastener 70 and the connector 40 are thus respectively configured such that mechanical interference occurring between the elongate portion 71 and the connector 40, which is caused by fastener 70 operation, causes an application of pulling force, F (see
The coplanarity of the leads 56 when the leads 56 occupy the respective solder positions in the common plane permits soldering to be commenced.
Where the fastener 70 is, for example, a screw, operation of the fastener 70 may include a rotation of the fastener 70 about a longitudinal axis thereof, which extends along the elongate portion 71. This rotation causes the complementary threading (or other surface features) of the connector 40 and the elongate portion 71 to mate or register with one another, such that the head portion 72 and the connector 40 are drawn to one another. This has an effect of squeezing the substrate 20 between the relatively wide head portion 72 and the connector 40.
As such, as shown in the dotted lines of
As shown in
The through-hole 24, the fastening location 30 and the fastener 70 may each be each plural in number and located at plural corresponding positions. As such, the connector 40 can be pulled toward the substrate 20 at multiple locations along the planar extent of both the connector 40 and the substrate 20 and the coplanarity, as it is defined above, can be maintained during the assembly process. Further, torque can be applied to each fastener 70 simultaneously or selectively and separately such that a selective application of force can be applied to the connector 40 to thereby overcome coplanarity variations. The torque applicable to the connector 40 by way of the fastener 70 may be comparable with the compressive force that would otherwise be provided by the use of the lead head fixture of the conventional reflow process.
With reference to
Among the advantages provided by the present invention, are the selective application of force required to overcome connector coplanarity variation, improved solder joint formation and overall reliability performance, minimization of observed solder joint defects, improved alignment of leads to PCB copper pads, improved registration, minimization of thermal exposure to PCBA during processing, improved throughput during manufacturing production and improved process control and elimination of on-going load head maintenance.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one more other features, integers, steps, operations, element components, and/or groups thereof.
The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated
The diagrams depicted herein are just one example. There may be many variations or operations described therein without departing from the spirit of the invention. All of these variations are considered a part of the claimed invention.
While the preferred embodiment to the invention had been described, it will be understood that those skilled in the art, both now and in the future, may make various improvements and enhancements which fall within the scope of the claims which follow. These claims should be construed to maintain the proper protection for the invention first described.
