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Mitsuharu Shimizu
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Nagano, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method for producing a semiconductor package
Patent number
6,074,567
Issue date
Jun 13, 2000
Shinko Electric Industries Co., Ltd.
Fumio Kuraishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for manufacturing metal plane support for multi-layer lead...
Patent number
5,854,094
Issue date
Dec 29, 1998
Shinko Electric Industries Co., Ltd.
Hirofumi Fujii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for producing a semiconductor package
Patent number
5,804,422
Issue date
Sep 8, 1998
Shinko Electric Industries Co., Ltd.
Mitsuharu Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer lead-frame for a semiconductor device
Patent number
5,576,577
Issue date
Nov 19, 1996
Shinko Electric Industries Co., Ltd.
Toshikazu Takenouchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for manufacturing a multi-layer lead frame
Patent number
RE35353
Issue date
Oct 22, 1996
Shinko Electric Ind. Co, Ltd.
Masakuni Tokita
029 - Metal working
Information
Patent Grant
Metal plane support for multi-layer lead frames and a process for m...
Patent number
5,410,180
Issue date
Apr 25, 1995
Shinko Electric Industries Co., Ltd.
Hirofumi Fujii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer lead frame using a metal-core substrate
Patent number
5,389,816
Issue date
Feb 14, 1995
Shinko Electric Industries Co., Ltd.
Mitsuharu Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and lead frame used therein
Patent number
5,293,301
Issue date
Mar 8, 1994
Shinko Electric Industries Co., Ltd.
Masato Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame and semiconductor device using same
Patent number
5,291,060
Issue date
Mar 1, 1994
Shinko Electric Industries Co., Ltd.
Mitsuharu Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for manufacturing a multi-layer lead frame having a ground...
Patent number
5,281,556
Issue date
Jan 25, 1994
Shinko Electric Industries Co., Ltd.
Mitsuharu Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame and semiconductor device using same
Patent number
5,237,202
Issue date
Aug 17, 1993
Shinko Electric Industries Co., Ltd.
Mitsuharu Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer lead frame for a semiconductor device with contact geom...
Patent number
5,235,209
Issue date
Aug 10, 1993
Shinko Electric Industries Co., Ltd.
Mitsuharu Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for manufacturing a multi-layer lead frame
Patent number
5,231,756
Issue date
Aug 3, 1993
Shinko Electric Industries Co., Ltd.
Masakuni Tokita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device using a tape carrier
Patent number
5,070,390
Issue date
Dec 3, 1991
Shinko Electric Industries Co., Ltd.
Mitsuharu Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING EXTERNAL CONNECTING TERMINALS AND PROCE...
Publication number
20030107131
Publication date
Jun 12, 2003
Shinko Electric Industries Co. Ltd
MITSUTOSHI HIGASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device having external connecting terminals and proce...
Publication number
20010028108
Publication date
Oct 11, 2001
Shinko Electric Industries Co., Ltd.
Mitsutoshi Higashi
H01 - BASIC ELECTRIC ELEMENTS