Mitsuhiro Aizawa

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Composite wiring substrate and semiconductor device
- Patent number 11,706,877
- Issue date Jul 18, 2023
- Shinko Electric Industries Co., Ltd.
- Shota Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, stacked wiring substrate, and manufacturing metho...
- Patent number 10,959,328
- Issue date Mar 23, 2021
- SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Naoki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery and method for producing the same
- Patent number 10,319,963
- Issue date Jun 11, 2019
- Shinko Electric Industries Co., Ltd.
- Kazuyuki Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card having a wiring substrate
- Patent number 9,488,677
- Issue date Nov 8, 2016
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- G01 - MEASURING TESTING
Information Patent Grant
Probe card
- Patent number 9,476,913
- Issue date Oct 25, 2016
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- G01 - MEASURING TESTING
Information Patent Grant
Probe card
- Patent number 9,470,718
- Issue date Oct 18, 2016
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- G01 - MEASURING TESTING
Information Patent Grant
Interposer and electronic component package
- Patent number 9,374,889
- Issue date Jun 21, 2016
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and light emitting device
- Patent number 9,137,890
- Issue date Sep 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and light emitting device
- Patent number 9,006,894
- Issue date Apr 14, 2015
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip stacked body and method of manufacturing the same
- Patent number 8,394,678
- Issue date Mar 12, 2013
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor inspecting device
- Patent number 7,884,632
- Issue date Feb 8, 2011
- Shinko Electric Electric Industries Co., Ltd.
- Akinori Shiraishi
- G01 - MEASURING TESTING
Information Patent Grant
Method for production of semiconductor package
- Patent number 7,262,076
- Issue date Aug 28, 2007
- Shinko Electric Industries Co., Ltd.
- Mitsuhiro Aizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly of plurality of semiconductor devices
- Patent number 6,433,415
- Issue date Aug 13, 2002
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTO...
- Publication number 20240234278
- Publication date Jul 11, 2024
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTO...
- Publication number 20240136265
- Publication date Apr 25, 2024
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE
- Publication number 20240021556
- Publication date Jan 18, 2024
- Shinko Electric Industries Co., LTD.
- Mitsuhiro Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE
- Publication number 20230317650
- Publication date Oct 5, 2023
- Shinko Electric Industries Co., Ltd.
- Mitsuhiro AIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20220361342
- Publication date Nov 10, 2022
- Shinko Electric Industries Co., Ltd.
- Shota MIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220028774
- Publication date Jan 27, 2022
- SHINKO ELECTRIC INDUSTRIES, CO., LTD.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, STACKED WIRING SUBSTRATE, AND MANUFACTURING METHO...
- Publication number 20210007220
- Publication date Jan 7, 2021
- Shinko Electric Industries Co., Ltd.
- Naoki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180204807
- Publication date Jul 19, 2018
- Shinko Electric Industries Co., Ltd.
- Mitsuhiro Aizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150022230
- Publication date Jan 22, 2015
- Shinko Electric Industries Co., Ltd.
- Ryo FUKASAWA
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150022229
- Publication date Jan 22, 2015
- Shinko Electric Industries Co., Ltd.
- Ryo FUKASAWA
- G01 - MEASURING TESTING
Information Patent Application
BATTERY AND METHOD FOR PRODUCING THE SAME
- Publication number 20140370365
- Publication date Dec 18, 2014
- Shinko Electric Industries Co., Ltd.
- Kazuyuki KUBOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20140293564
- Publication date Oct 2, 2014
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND LIGHT EMITTING DEVICE
- Publication number 20140264417
- Publication date Sep 18, 2014
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND LIGHT EMITTING DEVICE
- Publication number 20140226346
- Publication date Aug 14, 2014
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140151891
- Publication date Jun 5, 2014
- Shinko Electric Industries Co., Ltd.
- Akihito TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140125372
- Publication date May 8, 2014
- Shinko Electric Industries Co., Ltd.
- Ryo FUKASAWA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME
- Publication number 20110062596
- Publication date Mar 17, 2011
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20100320598
- Publication date Dec 23, 2010
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACKED BODY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100133677
- Publication date Jun 3, 2010
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INSPECTING DEVICE
- Publication number 20090206861
- Publication date Aug 20, 2009
- SHINKO ELECTRIC INDUSTRIES, CO., LTD.
- Akinori SHIRAISHI
- G01 - MEASURING TESTING
Information Patent Application
Method for production of semiconductor package
- Publication number 20050277225
- Publication date Dec 15, 2005
- Shinko Electric Industries Co., Ltd.
- Mitsuhiro Aizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040178462
- Publication date Sep 16, 2004
- Hideaki Sakaguchi
- G02 - OPTICS
Information Patent Application
Assembly of plurality of semiconductor devices
- Publication number 20020003296
- Publication date Jan 10, 2002
- Naohiro Mashino
- H01 - BASIC ELECTRIC ELEMENTS

Mitsuhiro Aizawa

Person

Patents Grantslast 30 patents

Composite wiring substrate and semiconductor device

Wiring substrate, stacked wiring substrate, and manufacturing metho...

Battery and method for producing the same

Probe card having a wiring substrate

Probe card

Probe card

Interposer and electronic component package

Wiring board and light emitting device

Wiring board and light emitting device

Semiconductor chip stacked body and method of manufacturing the same

Semiconductor inspecting device

Method for production of semiconductor package

Assembly of plurality of semiconductor devices

Patents Applicationslast 30 patents

INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTO...

INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTO...

CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE

CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE

COMPOSITE WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

WIRING SUBSTRATE, STACKED WIRING SUBSTRATE, AND MANUFACTURING METHO...

SEMICONDUCTOR DEVICE

PROBE CARD AND METHOD OF MANUFACTURING THE SAME

PROBE CARD AND METHOD OF MANUFACTURING THE SAME

BATTERY AND METHOD FOR PRODUCING THE SAME

INTERPOSER AND ELECTRONIC COMPONENT PACKAGE

WIRING BOARD AND LIGHT EMITTING DEVICE

WIRING BOARD AND LIGHT EMITTING DEVICE

SEMICONDUCTOR PACKAGE

PROBE CARD AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR CHIP STACKED BODY AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR INSPECTING DEVICE

Method for production of semiconductor package

Semiconductor device and manufacturing method thereof

Assembly of plurality of semiconductor devices