Mitsuhiro TACHIBANA

Person

Yamanashi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing method, substrate processing apparatus and sub...
- Patent number 12,237,173
- Issue date Feb 25, 2025
- Tokyo Electron Limited
- Keiko Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method, substrate processing apparatus and sub...
- Patent number 10,903,083
- Issue date Jan 26, 2021
- Tokyo Electron Limited
- Keiko Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Naturally oxidized film removing method and naturally oxidized film...
- Patent number 10,460,946
- Issue date Oct 29, 2019
- Tokyo Electron Limited
- Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 9,991,138
- Issue date Jun 5, 2018
- Tokyo Electron Limited
- Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film formation device, substrate processing device, and film format...
- Patent number 9,583,312
- Issue date Feb 28, 2017
- Tokyo Electron Limited
- Jun Yamawaku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and film deposition apparatus
- Patent number 9,136,156
- Issue date Sep 15, 2015
- Tokyo Electron Limited
- Tadashi Enomoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film deposition apparatus, substrate processing apparatus and film...
- Patent number 9,111,747
- Issue date Aug 18, 2015
- Tokyo Electron Limited
- Jun Yamawaku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a film
- Patent number 8,895,456
- Issue date Nov 25, 2014
- Tokyo Electron Limited
- Mitsuhiro Tachibana
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming tungsten film
- Patent number 7,592,256
- Issue date Sep 22, 2009
- Tokyo Electron Limited
- Kazuya Okubo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
CVD process capable of reducing incubation time
- Patent number 7,063,871
- Issue date Jun 20, 2006
- Tokyo Electron Limited
- Hideaki Yamasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a metal layer using an intermittent precursor gas...
- Patent number 6,924,223
- Issue date Aug 2, 2005
- Tokyo Electron Limited
- Hideaki Yamasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming metal wiring and semiconductor manufacturing appa...
- Patent number 6,913,996
- Issue date Jul 5, 2005
- Tokyo Electron Limited
- Hideaki Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for detecting an end point of a cleaning process
- Patent number 6,737,666
- Issue date May 18, 2004
- NEC Electronics Corporation
- Natsuko Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for cleaning film deposition device
- Patent number 6,660,101
- Issue date Dec 9, 2003
- Tokyo Electron Limited
- Mitsuhiro Tachibana
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten film forming method
- Patent number 6,465,347
- Issue date Oct 15, 2002
- Tokyo Electron Limited
- Hotaka Ishizuka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device fabricating method and system for carrying out...
- Patent number 6,399,484
- Issue date Jun 4, 2002
- Tokyo Electron Limited
- Hideaki Yamasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vapor-phase processing method capable of eliminating particle forma...
- Patent number 6,346,425
- Issue date Feb 12, 2002
- Tokyo Electron Limited
- Natsuko Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of film-forming of tungsten
- Patent number 6,331,483
- Issue date Dec 18, 2001
- Tokyo Electron Limited
- Hotaka Ishizuka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Shower head
- Patent number 6,036,782
- Issue date Mar 14, 2000
- Tokyo Electron Limited
- Sumi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Heat treatment apparatus
- Patent number 5,997,651
- Issue date Dec 7, 1999
- Tokyo Electron Limited
- Kimihiro Matsuse
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film deposition apparatus with anti-adhesion film and chamber cooli...
- Patent number 5,972,114
- Issue date Oct 26, 1999
- Tokyo Electron Limited
- Tomihiro Yonenaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System for continuously washing and film-forming a semiconductor wafer
- Patent number 5,303,671
- Issue date Apr 19, 1994
- Tokyo Electron Limited
- Hiroshi Kondo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ETCHING METHOD AND ETCHING APPARATUS
- Publication number 20230014819
- Publication date Jan 19, 2023
- Tokyo Electron Limited
- Satoshi TODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND SUB...
- Publication number 20210104412
- Publication date Apr 8, 2021
- TOKYO ELECTRON LIMITED
- Keiko HADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NATURALLY OXIDIZED FILM REMOVING METHOD AND NATURALLY OXIDIZED FILM...
- Publication number 20180211844
- Publication date Jul 26, 2018
- TOKYO ELECTRON LIMITED
- Jun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND SUB...
- Publication number 20170200618
- Publication date Jul 13, 2017
- TOKYO ELECTRON LIMITED
- Keiko HADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND ETCHING APPARATUS
- Publication number 20170032990
- Publication date Feb 2, 2017
- TOKYO ELECTRON LIMITED
- Jun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS USING ROTATABLE TABLE
- Publication number 20150240357
- Publication date Aug 27, 2015
- TOKYO ELECTRON LIMITED
- Mitsuhiro TACHIBANA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM DEPOSITION APPARATUS
- Publication number 20150211119
- Publication date Jul 30, 2015
- TOKYO ELECTRON LIMITED
- Yuji ONO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF DEPOSITING A FILM
- Publication number 20140220260
- Publication date Aug 7, 2014
- TOKYO ELECTRON LIMITED
- Jun Yamawaku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DEPOSITING A FILM
- Publication number 20140179122
- Publication date Jun 26, 2014
- TOKYO ELECTRON LIMITED
- Mitsuhiro Tachibana
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMATION DEVICE, SUBSTRATE PROCESSING DEVICE, AND FILM FORMAT...
- Publication number 20140170859
- Publication date Jun 19, 2014
- TOKYO ELECTRON LIMITED
- Jun YAMAWAKU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM DEPOSITION APPARATUS, SUBSTRATE PROCESSING APPARATUS AND FILM...
- Publication number 20130337635
- Publication date Dec 19, 2013
- Jun YAMAWAKU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND FILM DEPOSITION APPARATUS
- Publication number 20130061804
- Publication date Mar 14, 2013
- TOKYO ELECTRON LIMITED
- Tadashi ENOMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING METALLIC FILM AND PROGRAM-STORING RECORDING MEDIUM
- Publication number 20090246373
- Publication date Oct 1, 2009
- Tokyo Electron Limited
- Mitsuhiro Tachibana
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of forming a metal layer using an intermittent precursor gas...
- Publication number 20050069632
- Publication date Mar 31, 2005
- TOKYO ELECTRON LIMITED
- Hideaki Yamasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for depositing metal layers using sequential flow deposition
- Publication number 20050069641
- Publication date Mar 31, 2005
- TOKYO ELECTRON LIMITED
- Tsukasa Matsuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CVD process capable of reducing incubation time
- Publication number 20040025789
- Publication date Feb 12, 2004
- TOKYO ELECTRON LIMITED
- Hideaki Yamasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of forming metal wiring and semiconductor manufacturing appa...
- Publication number 20030003729
- Publication date Jan 2, 2003
- Hideaki Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tungsten film forming method
- Publication number 20020048938
- Publication date Apr 25, 2002
- Hotaka Ishizuka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Mitsuhiro TACHIBANA

Person

Patents Grantslast 30 patents

Substrate processing method, substrate processing apparatus and sub...

Substrate processing method, substrate processing apparatus and sub...

Naturally oxidized film removing method and naturally oxidized film...

Etching method and etching apparatus

Film formation device, substrate processing device, and film format...

Substrate processing apparatus and film deposition apparatus

Film deposition apparatus, substrate processing apparatus and film...

Method of depositing a film

Method of forming tungsten film

CVD process capable of reducing incubation time

Method of forming a metal layer using an intermittent precursor gas...

Method of forming metal wiring and semiconductor manufacturing appa...

Apparatus and method for detecting an end point of a cleaning process

Method and apparatus for cleaning film deposition device

Tungsten film forming method

Semiconductor device fabricating method and system for carrying out...

Vapor-phase processing method capable of eliminating particle forma...

Method of film-forming of tungsten

Shower head

Heat treatment apparatus

Film deposition apparatus with anti-adhesion film and chamber cooli...

System for continuously washing and film-forming a semiconductor wafer

Patents Applicationslast 30 patents

ETCHING METHOD AND ETCHING APPARATUS

SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND SUB...

NATURALLY OXIDIZED FILM REMOVING METHOD AND NATURALLY OXIDIZED FILM...

SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND SUB...

ETCHING METHOD AND ETCHING APPARATUS

SUBSTRATE PROCESSING APPARATUS USING ROTATABLE TABLE

FILM DEPOSITION APPARATUS

SUBSTRATE PROCESSING APPARATUS AND METHOD OF DEPOSITING A FILM

METHOD OF DEPOSITING A FILM

FILM FORMATION DEVICE, SUBSTRATE PROCESSING DEVICE, AND FILM FORMAT...

FILM DEPOSITION APPARATUS, SUBSTRATE PROCESSING APPARATUS AND FILM...

SUBSTRATE PROCESSING APPARATUS AND FILM DEPOSITION APPARATUS

METHOD OF FORMING METALLIC FILM AND PROGRAM-STORING RECORDING MEDIUM

Method of forming a metal layer using an intermittent precursor gas...

Method for depositing metal layers using sequential flow deposition

CVD process capable of reducing incubation time

Method of forming metal wiring and semiconductor manufacturing appa...

Tungsten film forming method