Mitsuhiro TOMIKAWA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thin film capacitor, circuit board incorporating the same, and thin...
- Patent number 11,581,148
- Issue date Feb 14, 2023
- TDK Corporation
- Masahiro Hiraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-incorporating substrate
- Patent number 11,367,626
- Issue date Jun 21, 2022
- TDK Corporation
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric component embedded structure
- Patent number 11,335,614
- Issue date May 17, 2022
- TDK Corporation
- Takaaki Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film capacitor and method for manufacturing thin-film capacitor
- Patent number 11,276,531
- Issue date Mar 15, 2022
- TDK Corporation
- Koichi Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film capacitor
- Patent number 11,114,249
- Issue date Sep 7, 2021
- TDK Corporation
- Koichi Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film capacitor
- Patent number 10,950,389
- Issue date Mar 16, 2021
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting package
- Patent number 10,886,219
- Issue date Jan 5, 2021
- TDK Corporation
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded substrate
- Patent number 10,813,220
- Issue date Oct 20, 2020
- TDK Corporation
- Mitsuhiro Tomikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 10,483,345
- Issue date Nov 19, 2019
- TDK Corporation
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film capacitor
- Patent number 10,340,088
- Issue date Jul 2, 2019
- TDK Corporation
- Koichi Tsunoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 10,278,290
- Issue date Apr 30, 2019
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 10,211,157
- Issue date Feb 19, 2019
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 10,143,092
- Issue date Nov 27, 2018
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 9,955,591
- Issue date Apr 24, 2018
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in electronic component and method for manu...
- Patent number 9,930,791
- Issue date Mar 27, 2018
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 9,872,401
- Issue date Jan 16, 2018
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 9,831,163
- Issue date Nov 28, 2017
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board with built-in electronic component and method for manu...
- Patent number 9,743,534
- Issue date Aug 22, 2017
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and method for manufacturing the same
- Patent number 9,433,097
- Issue date Aug 30, 2016
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method for manufacturing multil...
- Patent number 9,332,657
- Issue date May 3, 2016
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,232,656
- Issue date Jan 5, 2016
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,204,552
- Issue date Dec 1, 2015
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,891,245
- Issue date Nov 18, 2014
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,829,357
- Issue date Sep 9, 2014
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in imaging device and method for manufactur...
- Patent number 8,698,269
- Issue date Apr 15, 2014
- Ibiden Co., Ltd.
- Nobuhiro Hanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,693,209
- Issue date Apr 8, 2014
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD HAVING THE SAME
- Publication number 20250218659
- Publication date Jul 3, 2025
- TDK Corporation
- Yoshiaki HAYAMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD HAVING THE SAME
- Publication number 20250149252
- Publication date May 8, 2025
- TDK Corporation
- Daiki ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED MODULE AND METHOD OF MANUFACTURING EL...
- Publication number 20250125226
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Ryuichiro TOMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...
- Publication number 20250120104
- Publication date Apr 10, 2025
- TDK Corporation
- Yasunori HARADA
Information Patent Application
ELECTRONIC COMPONENT AND APPARATUS
- Publication number 20240203972
- Publication date Jun 20, 2024
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
- Publication number 20230138154
- Publication date May 4, 2023
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230060995
- Publication date Mar 2, 2023
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR, CIRCUIT BOARD INCORPORATING THE SAME, AND THIN...
- Publication number 20210257164
- Publication date Aug 19, 2021
- TDK Corporation
- Masahiro HIRAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC COMPONENT EMBEDDED STRUCTURE
- Publication number 20210057296
- Publication date Feb 25, 2021
- TDK Corporation
- Takaaki MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM CAPACITOR AND METHOD FOR MANUFACTURING THIN-FILM CAPACITOR
- Publication number 20200258690
- Publication date Aug 13, 2020
- TDK CORPORATION
- Koichi TSUNODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE
- Publication number 20200043751
- Publication date Feb 6, 2020
- TDK Corporation
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN-FILM CAPACITOR
- Publication number 20200013554
- Publication date Jan 9, 2020
- TDK CORPORATION
- Koichi TSUNODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC COMPONENT HOUSI...
- Publication number 20190394915
- Publication date Dec 26, 2019
- TDK Corporation
- Mitsuhiro TOMIKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC COMPONENT MOUNTING PACKAGE
- Publication number 20190378791
- Publication date Dec 12, 2019
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM CAPACITOR
- Publication number 20190304701
- Publication date Oct 3, 2019
- TDK Corporation
- Daiki ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM CAPACITOR
- Publication number 20180240599
- Publication date Aug 23, 2018
- TDK Corporation
- Koichi TSUNODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20180233553
- Publication date Aug 16, 2018
- TDK Corporation
- Mitsuhiro TOMIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20180235086
- Publication date Aug 16, 2018
- TDK Corporation
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20180027660
- Publication date Jan 25, 2018
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20170373009
- Publication date Dec 28, 2017
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160268189
- Publication date Sep 15, 2016
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160242293
- Publication date Aug 18, 2016
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN METAL BLOCK AND METHOD FOR MANUFACTURING...
- Publication number 20160143134
- Publication date May 19, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20160105957
- Publication date Apr 14, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20160105966
- Publication date Apr 14, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160021753
- Publication date Jan 21, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160007468
- Publication date Jan 7, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160007451
- Publication date Jan 7, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140153205
- Publication date Jun 5, 2014
- IBIDEN CO., LTD.
- Yukinobu Mikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20130256007
- Publication date Oct 3, 2013
- IBIDEN CO., LTD.
- Toshiki Furutani
- H01 - BASIC ELECTRIC ELEMENTS

Mitsuhiro TOMIKAWA

Person

Patents Grantslast 30 patents

Thin film capacitor, circuit board incorporating the same, and thin...

Electronic component-incorporating substrate

Electric component embedded structure

Thin-film capacitor and method for manufacturing thin-film capacitor

Thin-film capacitor

Thin-film capacitor

Electronic component mounting package

Electronic component embedded substrate

Electronic component embedded substrate

Thin-film capacitor

Electronic component embedded substrate

Electronic component

Circuit substrate and method for manufacturing the same

Circuit substrate and method for manufacturing the same

Wiring board with built-in electronic component and method for manu...

Circuit substrate and method for manufacturing the same

Circuit substrate and method for manufacturing the same

Wiring board with built-in electronic component and method for manu...

Circuit substrate and method for manufacturing the same

Multilayer printed wiring board and method for manufacturing multil...

Wiring board and method for manufacturing the same

Printed wiring board

Printed wiring board

Wiring board and method for manufacturing the same

Wiring board with built-in imaging device and method for manufactur...

Wiring board and method for manufacturing the same

Patents Applicationslast 30 patents

THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD HAVING THE SAME

THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD HAVING THE SAME

ELECTRONIC COMPONENT EMBEDDED MODULE AND METHOD OF MANUFACTURING EL...

THIN FILM CAPACITOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...

ELECTRONIC COMPONENT AND APPARATUS

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR

ELECTRONIC COMPONENT

THIN FILM CAPACITOR, CIRCUIT BOARD INCORPORATING THE SAME, AND THIN...

ELECTRIC COMPONENT EMBEDDED STRUCTURE

THIN-FILM CAPACITOR AND METHOD FOR MANUFACTURING THIN-FILM CAPACITOR

ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE

THIN-FILM CAPACITOR

ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC COMPONENT HOUSI...

ELECTRONIC COMPONENT MOUNTING PACKAGE

THIN-FILM CAPACITOR

THIN-FILM CAPACITOR

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

ELECTRONIC COMPONENT

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD WITH BUILT-IN METAL BLOCK AND METHOD FOR MANUFACTURING...

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...