Mitsuo Osada

Person

Itami, Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of producing a heat dissipation substrate of molybdenum powd...
- Patent number 7,083,759
- Issue date Aug 1, 2006
- A.L.M.T. Corp.
- Mitsuo Osada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor package and method for producing heat-radiating subst...
- Patent number 6,926,861
- Issue date Aug 9, 2005
- Tokyo Tungsten Co., Ltd.
- Norio Hirayama
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor package and method for producing heat-radiating subst...
- Patent number 6,693,353
- Issue date Feb 17, 2004
- Tokyo Tungsten Co., Ltd.
- Norio Hirayama
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Rotary anode for X-ray tube comprising an Mo-containing layer and a...
- Patent number 6,595,821
- Issue date Jul 22, 2003
- Tokyo Tungsten Co., Ltd.
- Masayuki Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink substrate consisting essentially of copper and molybdenum...
- Patent number 6,475,429
- Issue date Nov 5, 2002
- Tokyo Tungsten Co., Ltd.
- Mitsuo Osada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat sink substrate consisting essentially of copper and molybdenum...
- Patent number 6,271,585
- Issue date Aug 7, 2001
- Tokyo Tungsten Co., Ltd.
- Mitsuo Osada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Rotary anode for X-ray tube comprising an Mo-containing layer and a...
- Patent number 6,233,311
- Issue date May 15, 2001
- Tokyo Tungsters Co., Ltd.
- Masayuki Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element-mounting composite heat-sink base
- Patent number 5,481,136
- Issue date Jan 2, 1996
- Sumitomo Electric Industries, Ltd.
- Kenichiro Kohmoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-mounting heat-radiative substrates, a method of makin...
- Patent number 5,451,817
- Issue date Sep 19, 1995
- Sumitomo Electric Industries, Ltd.
- Mitsuo Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiating fin having an improved life and thermal conductivity
- Patent number 5,448,107
- Issue date Sep 5, 1995
- Sumitomo Electric Industries, Ltd.
- Mitsuo Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor-mounting heat-radiative subs...
- Patent number 5,305,947
- Issue date Apr 26, 1994
- Sumitomo Electric Industries, Ltd.
- Mitsuo Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing for semiconductor device
- Patent number 5,275,782
- Issue date Jan 4, 1994
- Mitsuo Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board and a method of manufacturing the ceramic cir...
- Patent number 5,229,549
- Issue date Jul 20, 1993
- Sumitomo Electric Industries, Ltd.
- Akira Yamakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing for semiconductor device with occlusion gas removed
- Patent number 5,132,779
- Issue date Jul 21, 1992
- Sumitomo Electric Industries, Ltd.
- Mitsuo Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing sintered ferrous alloys
- Patent number 4,614,638
- Issue date Sep 30, 1986
- Sumitomo Electric Industries, Ltd.
- Nobuhito Kuroishi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electric contact materials
- Patent number 4,457,780
- Issue date Jul 3, 1984
- Sumitomo Electric Industries, Ltd.
- Mitsuo Osada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
Method of producing a heat dissipation substrate of molybdenum powd...
- Publication number 20060246314
- Publication date Nov 2, 2006
- A.L.M.T. CORP.
- Mitsuo Osada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor package and method for producing heat-radiating subst...
- Publication number 20040056352
- Publication date Mar 25, 2004
- TOKYO TUNGSTEN CO., LTD.
- Norio Hirayama
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Material of heat-dissipating plate on which semiconductor is mounte...
- Publication number 20020191377
- Publication date Dec 19, 2002
- Mitsuo Osada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Heat sink substrate consisting essentially of copper and molybdenum...
- Publication number 20020017346
- Publication date Feb 14, 2002
- Mitsuo Osada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Rotary anode for X-ray tube comprising an Mo-containing layer and a...
- Publication number 20010014568
- Publication date Aug 16, 2001
- Masayuki Itoh
- H01 - BASIC ELECTRIC ELEMENTS

Mitsuo Osada

Person

Patents Grantslast 30 patents

Method of producing a heat dissipation substrate of molybdenum powd...

Semiconductor package and method for producing heat-radiating subst...

Semiconductor package and method for producing heat-radiating subst...

Rotary anode for X-ray tube comprising an Mo-containing layer and a...

Heat sink substrate consisting essentially of copper and molybdenum...

Heat sink substrate consisting essentially of copper and molybdenum...

Rotary anode for X-ray tube comprising an Mo-containing layer and a...

Semiconductor element-mounting composite heat-sink base

Semiconductor-mounting heat-radiative substrates, a method of makin...

Radiating fin having an improved life and thermal conductivity

Method for manufacturing semiconductor-mounting heat-radiative subs...

Housing for semiconductor device

Ceramic circuit board and a method of manufacturing the ceramic cir...

Housing for semiconductor device with occlusion gas removed

Process for producing sintered ferrous alloys

Electric contact materials

Patents Applicationslast 30 patents

Method of producing a heat dissipation substrate of molybdenum powd...

Semiconductor package and method for producing heat-radiating subst...

Material of heat-dissipating plate on which semiconductor is mounte...

Heat sink substrate consisting essentially of copper and molybdenum...

Rotary anode for X-ray tube comprising an Mo-containing layer and a...