Mitsuru Kimura

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ceramic substrate for semiconductor device
- Patent number 5,757,062
- Issue date May 26, 1998
- NEC Corporation
- Kazuhiro Ikuina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer wiring substrate, and process for producing the same
- Patent number 5,728,470
- Issue date Mar 17, 1998
- NEC Corporation
- Ichiro Hazeyama
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Process for producing a silica sintered product for a multi-layer w...
- Patent number 5,714,112
- Issue date Feb 3, 1998
- NEC Corporation
- Ichiro Hazeyama
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Via-structure of a multilayer interconnection ceramic substrate
- Patent number 5,576,518
- Issue date Nov 19, 1996
- NEC Corporation
- Akinobu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding circuit boards
- Patent number 5,545,281
- Issue date Aug 13, 1996
- NEC Corporation
- Koji Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mutlilayer glass ceramic substrate and method of fabricating the same
- Patent number 5,506,058
- Issue date Apr 9, 1996
- NEC Corporation
- Kazuhiro Ikuina
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Element joining pad for semiconductor device mounting board
- Patent number 5,485,352
- Issue date Jan 16, 1996
- NEC Corporation
- Akinobu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding circuit boards
- Patent number 5,318,651
- Issue date Jun 7, 1994
- NEC Corporation
- Koji Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a multichip package with increased adhesive...
- Patent number 4,874,721
- Issue date Oct 17, 1989
- NEC Corporation
- Mitsuru Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having at least one fine-wired conductive layer
- Patent number 4,594,473
- Issue date Jun 10, 1986
- NEC Corporation
- Tatsuo Inoue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OLIGONUCLEOTIDE, OMICS ANALYSIS METHOD, AND OMICS ANALYSIS KIT
- Publication number 20220251639
- Publication date Aug 11, 2022
- Kyushu University, National University Corporation
- Shinya OKI
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...

Mitsuru Kimura

Person

Patents Grantslast 30 patents

Ceramic substrate for semiconductor device

Multi-layer wiring substrate, and process for producing the same

Process for producing a silica sintered product for a multi-layer w...

Via-structure of a multilayer interconnection ceramic substrate

Method of bonding circuit boards

Mutlilayer glass ceramic substrate and method of fabricating the same

Element joining pad for semiconductor device mounting board

Method of bonding circuit boards

Method of manufacturing a multichip package with increased adhesive...

Substrate having at least one fine-wired conductive layer

Patents Applicationslast 30 patents

OLIGONUCLEOTIDE, OMICS ANALYSIS METHOD, AND OMICS ANALYSIS KIT