Claims
- 1. A method for manufacturing a multichip package comprising the steps of:
- forming a first polyimide insulating layer on a surface of a ceramic multilayer substrate having a circuit wiring therein;
- forming a first wiring connected to said circuit wiring of said multilayer substrate with a part of said first wiring being exposed at an open surface of said first polyimide insulating layer;
- forming a second polyimide insulating layer on a surface of a semiconductor element;
- forming a second wiring connected with a circuit wiring of said semiconductor element in said second polyimide insulating layer with a part of said second wiring being exposed at an open surface of said second polyimide insulating layer;
- positioning said semiconductor element on said substrate such that said part of said first wiring and said part of said second wiring oppose to each other; and
- applying a predetermined pressure and a predetermined temperature in a predetermined gas atmosphere for a predetermined time period to cause said first and second polyimide insulating layers to be cured and bonded with each other and to cause the parts of said first and second wiring to be connected to each other by thermocompression bonding.
- 2. A method accoding to claim 1, wherein said first and second wiring are made of gold, respectively, and bonded to each other by gold-to-gold thermocompression bonding.
Priority Claims (3)
Number |
Date |
Country |
Kind |
60-250.652 |
Nov 1985 |
JPX |
|
60-250653 |
Nov 1985 |
JPX |
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60-261483 |
Nov 1985 |
JPX |
|
Parent Case Info
This application is a divisional of application Ser. No. 180,697 filed Apr. 8, 1988, which is a continuation of Ser. No. 928,559, filed Nov. 10, 1986 both are abandoned.
US Referenced Citations (14)
Foreign Referenced Citations (4)
Number |
Date |
Country |
0193051 |
May 1981 |
JPX |
0202540 |
Jan 1983 |
JPX |
0212030 |
Jan 1986 |
JPX |
1361400 |
Jan 1974 |
GBX |
Non-Patent Literature Citations (2)
Entry |
"Copper/Polyimide Materials System for High Performance Packaging", Jensen et al., 0569-5503/84/0000/0073, 1984, IEEE, pp. 73-81. |
"The Thin Film Module as a High Performance Semiconductor Package", Ho et al., IBM J. Res. DEVELOP., vol. 26, No. 3, pp. 286-296, (May 1982). |
Divisions (1)
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Number |
Date |
Country |
Parent |
180697 |
Apr 1988 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
928559 |
Nov 1986 |
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