Mitsuru Nozaki

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin composite electrolytic copper foil, copper clad laminate and...
- Patent number 9,949,371
- Issue date Apr 17, 2018
- Mitsubishi Gas Chemical Company, Inc.
- Mitsuru Nozaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Resin composite copper foil, printed wiring board, and production p...
- Patent number 7,989,081
- Issue date Aug 2, 2011
- Mitsubishi Gas Chemical Company, Inc.
- Mitsuru Nozaki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composite metal foil, laminate and process for the production...
- Patent number 7,892,651
- Issue date Feb 22, 2011
- Mitsubishi Gas Chemical Company, Inc.
- Takabumi Omori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition and prepreg for laminate and metal-clad laminate
- Patent number 7,192,651
- Issue date Mar 20, 2007
- Mitsubishi Gas Chemical Company, Inc.
- Daisuke Ohno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Nonwoven reinforcement for printed wiring base board and process fo...
- Patent number 6,229,096
- Issue date May 8, 2001
- Mitsubishi Gas Chemical Company, Inc.
- Morio Gaku
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Grant
Sheet material for laminate of printed circuit and laminate for pri...
- Patent number 5,692,940
- Issue date Dec 2, 1997
- Mitsubishi Gas Chemical Company, Ltd.
- Hidenori Kinbara
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Grant
Process for producing cyanate ester resin cure product
- Patent number 5,186,880
- Issue date Feb 16, 1993
- Mitsubishi Gas Chemical Company, Inc.
- Morio Gaku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process of producing plastic-molded printed circuit boards
- Patent number 4,764,327
- Issue date Aug 16, 1988
- Mitsubishi Gas Chemical Company, Inc.
- Mitsuru Nozaki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for producing rigid resin molds
- Patent number 4,740,343
- Issue date Apr 26, 1988
- Mitsubishi Gas Chemical Company, Inc.
- Morio Gaku
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND...
- Publication number 20160360615
- Publication date Dec 8, 2016
- Mitsubishi Gas Chemical Company, Inc.
- Mitsuru NOZAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND...
- Publication number 20120189859
- Publication date Jul 26, 2012
- PI R&D CO., LTD.
- Mitsuru Nozaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RESIN COMPOSITE COPPER FOIL
- Publication number 20110281126
- Publication date Nov 17, 2011
- Mitsuru Nozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin composite copper foil, printed wiring board, and production p...
- Publication number 20070172674
- Publication date Jul 26, 2007
- Mitsuru Nozaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin composition and its use
- Publication number 20060093824
- Publication date May 4, 2006
- Mitsuru Nozaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin composite metal foil, laminate and process for the production...
- Publication number 20060054589
- Publication date Mar 16, 2006
- Takabumi Omori
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Curable resin composition and its use
- Publication number 20050277743
- Publication date Dec 15, 2005
- Mitsuru Nozaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin composition and prepreg for laminate and metal-clad laminate
- Publication number 20050042466
- Publication date Feb 24, 2005
- Daisuke Ohno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Mitsuru Nozaki

Person

Patents Grantslast 30 patents

Resin composite electrolytic copper foil, copper clad laminate and...

Resin composite copper foil, printed wiring board, and production p...

Resin composite metal foil, laminate and process for the production...

Resin composition and prepreg for laminate and metal-clad laminate

Nonwoven reinforcement for printed wiring base board and process fo...

Sheet material for laminate of printed circuit and laminate for pri...

Process for producing cyanate ester resin cure product

Process of producing plastic-molded printed circuit boards

Method for producing rigid resin molds

Patents Applicationslast 30 patents

RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND...

RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND...

RESIN COMPOSITE COPPER FOIL

Resin composite copper foil, printed wiring board, and production p...

Resin composition and its use

Resin composite metal foil, laminate and process for the production...

Curable resin composition and its use

Resin composition and prepreg for laminate and metal-clad laminate