Resin composite copper foil, printed wiring board, and production processes thereof

Abstract

A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an explanatory drawing of a copper-clad laminate used in the present invention.

FIG. 2 is an explanatory drawing of a copper-clad laminate in which a through hole is formed.

FIG. 3 is an explanatory drawing of a laminate of which a resin layer surface is exposed by removing a copper foil.

FIG. 4 is an explanatory drawing of a laminate in which an electroless copper plating layer is formed on the resin layer surface.

FIG. 5 is an explanatory drawing of a laminate in which an electrolytic copper plating layer is formed on the electroless copper plating layer.

FIG. 6 is an explanatory drawing of a printed wiring board in which the electroless copper plating layer and the electrolytic copper plating layer have been selectively removed.

Claims

1. A resin composite copper foil for printed wiring boards, comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil.

2. A resin composite copper foil according to claim 1, wherein the block copolymer polyimide has a structure unit represented by the formula (1) and a structure unit represented by the formula (2),

3. A resin composite copper foil according to claim 1, wherein the resin layer has a thickness of 0.1 μm to 10 μm.

4. A resin composite copper foil according to claim 1, wherein the weight ratio of the block copolymer polyimide and the maleimide compound contained in the resin layer is 10:90 to 90:10.

5. A process for the production of the resin composite copper foil for printed wiring boards as defined in claim 1, comprising applying a resin solution containing the block copolymer polyimide and the maleimide compound to one surface of the copper foil and then heat-treating the resin solution-applied copper foil at 250 to 360° C., to form a resin layer which does not melt at 200° C. or lower.

6. A copper-clad laminate for printed wiring boards, which is obtained by laminating a resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, and a B-stage resin composition layer, and then curing the resultant set.

7. A process for the production of a printed wiring board, which process comprises removing the copper foil of the copper-clad laminate as recited in claim 6 completely by etching, to expose a resin layer surface and obtain a laminate, forming an electroless copper plating layer by electroless copper plating without roughening treatment of the resin layer surface of the laminate, forming an electrolytic copper plating layer on the electroless copper plating layer by electrolytic copper plating, and then selectively removing the electroless copper plating layer and the electrolytic copper plating layer by etching, thereby forming a copper circuit.

8. A process according to claim 7, wherein heat-treatment is carried out at 100° C. to 200° C. after the formation of the electroless copper plating layer or the formation of the electrolytic copper plating layer.

9. A process for the production of a printed wiring board, which process comprises removing the copper foil of the copper-clad laminate as recited in claim 6 completely by etching, to expose a resin layer surface and obtain a laminate, forming an electroless copper plating layer by electroless copper plating without roughening treatment of the resin layer surface of the laminate, then selectively forming an electrolytic copper plating layer on the electroless copper plating layer, and then removing at least the electroless copper plating layer in a portion where the electrolytic copper plating layer is not formed, by etching, thereby forming a copper circuit.

10. A process according to claim 9, wherein heat-treatment is carried out at 100° C. to 200° C. after the formation of the electroless copper plating layer or the formation of the electrolytic copper plating layer.

11. A printed wiring board obtained by the process as recited in claim 7.

12. A printed wiring board obtained by the process as recited in claim 9.