MITSUTAKA SATO

Person

KANAGAWA, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive layer forming a capacitor dielectric between semiconductor...
- Patent number 8,097,954
- Issue date Jan 17, 2012
- Fujitsu Semiconductor Limited
- Kaname Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a plurality of semiconductor chips and...
- Patent number 7,759,246
- Issue date Jul 20, 2010
- Fujitsu Semiconductor Limited
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 7,692,294
- Issue date Apr 6, 2010
- Fujitsu Microelectronics Limited
- Yoshitsugu Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of designing circuit board
- Patent number 7,251,801
- Issue date Jul 31, 2007
- Fujitsu Limited
- Kaname Ozawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having a plurality of semiconductor chips and...
- Patent number 7,084,513
- Issue date Aug 1, 2006
- Fujitsu Limited
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 7,064,645
- Issue date Jun 20, 2006
- Fujitsu Limited
- Kazuhiko Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method having a step of applying...
- Patent number 6,967,399
- Issue date Nov 22, 2005
- Fujitsu Limited
- Yoshitaka Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light signal processing system
- Patent number 6,909,181
- Issue date Jun 21, 2005
- Fujitsu Limited
- Yoshitaka Aiba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a device substrate and semiconductor package incl...
- Patent number 6,905,951
- Issue date Jun 14, 2005
- Fujitsu Limited
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device configured to be surface mountable
- Patent number 6,836,025
- Issue date Dec 28, 2004
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
External connection terminal and semiconductor device
- Patent number 6,784,543
- Issue date Aug 31, 2004
- Fujitsu Limited
- Hirohisa Matsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and package including forming pyramid mount pr...
- Patent number 6,781,224
- Issue date Aug 24, 2004
- Fujitsu Limited
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module including a plurality of semiconductor devices...
- Patent number 6,696,754
- Issue date Feb 24, 2004
- Fujitsu Limited
- Mitsutaka Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a plurality of semiconductor elements i...
- Patent number 6,627,479
- Issue date Sep 30, 2003
- Fujitsu, Limited
- Yoshitaka Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method having a step of applying...
- Patent number 6,586,273
- Issue date Jul 1, 2003
- Fujitsu Limited
- Yoshitaka Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
External connection terminal and semiconductor device
- Patent number 6,548,898
- Issue date Apr 15, 2003
- Fujitsu Limited
- Hirohisa Matsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonded device with ball-shaped bonds
- Patent number 6,495,773
- Issue date Dec 17, 2002
- Fujitsu Limited
- Ryuji Nomoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having columnar electrode and method of manufa...
- Patent number 6,476,503
- Issue date Nov 5, 2002
- Fujitsu Limited
- Kazuyuki Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module including a plurality of semiconductor devices...
- Patent number 6,472,744
- Issue date Oct 29, 2002
- Fujitsu Limited
- Mitsutaka Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of producing semiconductor device and...
- Patent number 6,462,424
- Issue date Oct 8, 2002
- Fujitsu Limited
- Masaaki Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with connection terminals in the form of a gri...
- Patent number 6,459,161
- Issue date Oct 1, 2002
- NEC Corporation
- Masayoshi Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for a vertically accumulable semiconductor device with ex...
- Patent number 6,433,418
- Issue date Aug 13, 2002
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device having increased adhesion...
- Patent number 6,383,842
- Issue date May 7, 2002
- Fujitsu Limited
- Akira Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a plurality of semiconductor elements i...
- Patent number 6,348,728
- Issue date Feb 19, 2002
- Fujitsu Limited
- Yoshitaka Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount type semiconductor device and method of producing the...
- Patent number 6,333,564
- Issue date Dec 25, 2001
- Fujitsu Limited
- Yoshitsugu Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,316,838
- Issue date Nov 13, 2001
- Fujitsu Limited
- Kaname Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 6,288,444
- Issue date Sep 11, 2001
- Fujitsu Limited
- Mitsuo Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of producing semiconductor device and...
- Patent number 6,165,819
- Issue date Dec 26, 2000
- Fujitsu Limited
- Masaaki Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device module
- Patent number 6,094,356
- Issue date Jul 25, 2000
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device mounting structure
- Patent number 6,084,309
- Issue date Jul 4, 2000
- Fujitsu Limited
- Toyoshige Kawashima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20080067672
- Publication date Mar 20, 2008
- Fujitsu Limited
- Yoshitsugu KATOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20070138616
- Publication date Jun 21, 2007
- FUJITSU LIMITED
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with built-in capacitor, and method of produci...
- Publication number 20070001298
- Publication date Jan 4, 2007
- FUJITSU LIMITED
- Kaname Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a plurality of semiconductor chips and...
- Publication number 20060246623
- Publication date Nov 2, 2006
- FUJITSU LIMITED
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of designing circuit board
- Publication number 20060040532
- Publication date Feb 23, 2006
- FUJITSU LIMITED
- Kaname Ozawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20050001329
- Publication date Jan 6, 2005
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device substrate and manufacturing method thereof and...
- Publication number 20040224499
- Publication date Nov 11, 2004
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030227095
- Publication date Dec 11, 2003
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method having a step of applying...
- Publication number 20030207574
- Publication date Nov 6, 2003
- FUJITSU LIMITED
- Yoshitaka Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module including a plurality of semiconductor devices...
- Publication number 20030164544
- Publication date Sep 4, 2003
- FUJITSU LIMITED
- Mitsutaka Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device substrate and manufacturing method thereof and...
- Publication number 20030160325
- Publication date Aug 28, 2003
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
External connection terminal and semiconductor device
- Publication number 20030151141
- Publication date Aug 14, 2003
- FUJITSU LIMITED
- Hirohisa Matsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device
- Publication number 20030127704
- Publication date Jul 10, 2003
- Kazuhiko Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light signal processing system
- Publication number 20030094700
- Publication date May 22, 2003
- FUJITSU LIMITED
- Yoshitaka Aiba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
External connection terminal and semiconductor device
- Publication number 20020121709
- Publication date Sep 5, 2002
- FUJITSU LIMITED
- Hirohisa Matsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTION TERMINALS IN THE FORM OF A GRI...
- Publication number 20020105096
- Publication date Aug 8, 2002
- MASAYOSHI HIRATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method having a step of applying...
- Publication number 20020070440
- Publication date Jun 13, 2002
- FUJITSU LIMITED
- Yoshitaka Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a plurality of semiconductor elements i...
- Publication number 20020050639
- Publication date May 2, 2002
- FUJITSU LIMITED
- Yoshitaka Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE INCLUDING A PLURALITY OF SEMICONDUCTOR DEVICES...
- Publication number 20020000645
- Publication date Jan 3, 2002
- MITSUTAKA SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of producing the same
- Publication number 20010052653
- Publication date Dec 20, 2001
- Mitsuo Abe
- H01 - BASIC ELECTRIC ELEMENTS

MITSUTAKA SATO

Person

Patents Grantslast 30 patents

Adhesive layer forming a capacitor dielectric between semiconductor...

Semiconductor device having a plurality of semiconductor chips and...

Semiconductor device and method for fabricating the same

Method of designing circuit board

Semiconductor device having a plurality of semiconductor chips and...

Electronic device

Semiconductor device manufacturing method having a step of applying...

Light signal processing system

Method of forming a device substrate and semiconductor package incl...

Semiconductor device configured to be surface mountable

External connection terminal and semiconductor device

Semiconductor device and package including forming pyramid mount pr...

Semiconductor module including a plurality of semiconductor devices...

Semiconductor device having a plurality of semiconductor elements i...

Semiconductor device manufacturing method having a step of applying...

External connection terminal and semiconductor device

Wire bonded device with ball-shaped bonds

Semiconductor device having columnar electrode and method of manufa...

Semiconductor module including a plurality of semiconductor devices...

Semiconductor device, method of producing semiconductor device and...

Semiconductor device with connection terminals in the form of a gri...

Apparatus for a vertically accumulable semiconductor device with ex...

Method for producing semiconductor device having increased adhesion...

Semiconductor device having a plurality of semiconductor elements i...

Surface mount type semiconductor device and method of producing the...

Semiconductor device

Semiconductor device and method of producing the same

Semiconductor device, method of producing semiconductor device and...

Semiconductor device and semiconductor device module

Semiconductor device and semiconductor device mounting structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor device and manufacturing method of the same

Semiconductor device with built-in capacitor, and method of produci...

Semiconductor device having a plurality of semiconductor chips and...

Method of designing circuit board

Semiconductor device and method for manufacturing the same

Semiconductor device substrate and manufacturing method thereof and...

Semiconductor device and manufacturing method thereof

Semiconductor device manufacturing method having a step of applying...

Semiconductor module including a plurality of semiconductor devices...

Semiconductor device substrate and manufacturing method thereof and...

External connection terminal and semiconductor device

Electronic device

Light signal processing system

External connection terminal and semiconductor device

SEMICONDUCTOR DEVICE WITH CONNECTION TERMINALS IN THE FORM OF A GRI...

Semiconductor device manufacturing method having a step of applying...

Semiconductor device having a plurality of semiconductor elements i...

SEMICONDUCTOR MODULE INCLUDING A PLURALITY OF SEMICONDUCTOR DEVICES...

Semiconductor device and method of producing the same