1. Field of the Invention
The present invention generally relates to semiconductor devices and manufacturing methods of the same. More particularly, the present invention relates to a semiconductor device where plural semiconductor elements are mounted on a single supporting board in a coplanar manner and a manufacturing method of the semiconductor device.
2. Description of the Related Art
A BGA (ball grid array) type or LGA (land grid array) type semiconductor device, for example, has a structure where a semiconductor element is mounted on a supporting board. An example of such a BGA type semiconductor device is shown in
As shown in
In the related art semiconductor device like the semiconductor device 1A shown in
However, recently miniaturization or high functionality of electronic device such as a portable type information device has been required. Therefore, a semiconductor device is required to have both a small size and high functionality or large capacity. Because of this, a semiconductor device where plural semiconductor elements are mounted on a single supporting board, such as an MCM (multi-chip module) type or SiP (system in package) type semiconductor device, has been suggested. See, for example, Japanese Laid-Open Patent Application Publication No. 2000-196008.
The semiconductor elements 2A and 2B are connected to the bonding pads 4 formed on the supporting board 3B by the wires 5. Since plural semiconductor elements, namely the semiconductor elements 2A and 2B, are mounted on a single supporting board 3B in a coplanar manner, the position of the semiconductor element 2A on the supporting board 3B is offset from the center position of the supporting board 3B.
In other words, a first wirings arrangement area 12A corresponding to the outer periphery first side 11A, a second wirings arrangement area 12B corresponding to the outer periphery first side 11B, a third wirings arrangement area 12C corresponding to the outer periphery first side 11C, and a fourth wirings arrangement area 12D corresponding to the outer periphery first side 11D are formed. Hereinafter, the first through fourth wirings arrangement areas 12A through 12D are called first through fourth areas 12A through 12D.
In the case of the semiconductor device 1A shown in
Accordingly, in a case where the same number of the wirings 7 arranged in the third area 13C are arranged in the narrowest first area 13A, it is difficult to design and form the arrangement of the wirings 7.
In addition, in order to avoid this problem, the first area 13A may be made larger. However, this may cause an increase of the area of the supporting board 3B so that it may not be possible to respond to the requirement of miniaturization of the semiconductor device 1B.
In order to solve such a problem, as shown in
However, in the examples shown in
Accordingly, embodiments of the present invention may provide a novel and useful semiconductor device and manufacturing method of the same in which one or more of the problems described above are eliminated.
More specifically, the embodiments of the present invention can provide a semiconductor device where arrangement of wirings can be easily made regardless of mounting or arrangement positions of semiconductor elements on a supporting board so that the semiconductor device can be miniaturized, and a manufacturing method of the semiconductor device.
The embodiments of the present invention can also provide a semiconductor device, including a supporting board; and a semiconductor element mounted on a first main surface of the supporting board; wherein the supporting board includes a first electrode formed on the first main surface, a second electrode formed on a second main surface, and an opening or notch forming part; a first electrode pad of the semiconductor element faces and is connected to the first electrode of the supporting board; and a second electrode pad of the semiconductor element and the second electrode of the supporting board are electrically connected via the opening or notch forming part.
In the semiconductor device, the opening or notch forming part may be provided in the vicinity of an edge part of a side or the vicinity of a corner part of the supporting board. The opening or notch forming part may be provided in the vicinity of edge parts of a plurality of sides or the vicinity of a plurality of corner parts of the supporting board. The second electrode pad of the semiconductor element may be connected to the second electrode of the second main surface of the supporting board by a wire passing through the opening or the notch forming part so that the second electrode pad of the semiconductor element and the second electrode of the supporting board are electrically connected to each other. The semiconductor element and the wire may be sealed by resin. The resin sealing the wire may have a projection part, the projection part projecting on the second main surface of the supporting board, and the height of the projection part from the supporting board may be less than the height of an outside terminal projecting from the second main surface of the supporting board. The height of the projection part from the supporting board may be equal to or less than 1/2 of the height of the outside terminal projecting from the second main surface of the supporting board. A wiring layer contacting the second electrode may be formed on the second main surface of the supporting board, and an outside terminal is formed on the wiring layer. A plurality of the semiconductor elements may be mounted over the supporting board. A plurality of the semiconductor elements may be stacked over the supporting board. A dam configured to block leakage of the resin may be provided in the vicinity of an end part or the opening of the second main surface of the supporting board.
The embodiments of the present invention can also provide a manufacturing method of a semiconductor device, including the steps of: forming a supporting board having a first electrode formed on a first main surface of the supporting board, a second electrode formed on a second main surface of the supporting board, and an opening or notch forming part; mounting a semiconductor element on the first main surface of the supporting board so that a second electrode pad of the semiconductor element faces the opening or notch forming part; connecting a first electrode pad of the semiconductor element to the first electrode; and electrically connecting the second electrode pad of the semiconductor element to the second electrode of the supporting board via the opening or notch forming part.
In the manufacturing method of the semiconductor device, the opening or notch forming part may be formed in the vicinity of an edge part of a side of the supporting board or the vicinity of a corner part, in the step of forming the supporting board. The manufacturing method of the semiconductor device may further include the step of sealing the semiconductor element and the opening or notch forming part with resin after the step of connecting the second electrode pad to the second electrode.
According to the embodiments of the present invention, a rear surface of the supporting board is used as an arrangement area of wirings directly connected to an electrode pad of the semiconductor element mounted on the supporting board. Therefore, it is possible to form a miniaturized semiconductor device at low cost without making the supporting board have a multilayer structure.
Other objects, features, and advantages of the present invention will become more apparent from the following detailed description when read in conjunction with the accompanying drawings.
A description will now be given, with reference to
A semiconductor device 30A of a first embodiment of the present invention is discussed with reference to
The first semiconductor element 32 is, for example, a logic chip such as a microprocessor, and the second semiconductor element 33 is, for example, a memory chip such as a flash memory. As shown in
In other words, the first semiconductor element 32 is mounted in the vicinity of the edge part of the supporting board 40 and is situated in a position offset from the center part of the supporting board 40A, so that arranging the wirings into a wiring pattern on the upper surface of the supporting board 40A may be difficult. However, at least a part of the electrode pad of the semiconductor element 32 is connected to the lower surface of the supporting board 40A via the slit forming part (opening part) 50 by the wire 38. Thus, the rear surface of the supporting board 40A is used as a wiring area.
In order to realize this structure, in the semiconductor device 30A of this embodiment, flip-chip bonding projection electrodes 37 and wire bonding pads are selectively provided at the outside connection electrode pad parts provided in the vicinities of four sides of the semiconductor element 32 shown in
That is, in this embodiment, pads (a pad line) 42A situated along the side 41A corresponding to the first area 43A that is narrowest among the wiring areas of the supporting board 40A where the semiconductor element 32 is mounted are used as the wire bonding pads. On the other hand, projection electrodes 37 (not shown in
In other words, the first semiconductor element 32 has an outside connection electrode structure where the first semiconductor element 32 is mounted and arranged on the supporting board 40A by a flip-chip bonding method. A lead can be connected to the selected pad by a wire bonding method.
A wiring pattern and arrangement structure of pads on a front surface 44 and a rear surface 45 of the supporting board 40A where such a semiconductor element 32 is mounted are shown in
The wiring patterns and/or the electrode pads provided on the front and rear surfaces of the supporting board 40A are electrically or mechanically connected to each other through a mutual connection part VIA piercing the plate-shaped board 40A if necessary.
As shown in
A slit forming part 50 piercing the supporting board 40A is provided at a part corresponding to the first area 43A of the supporting board 40A. In other words, when the first semiconductor element 32 is provided and mounted on a designated position on the supporting board 40A, the slit forming part 50 is provided in a position corresponding to the pads 42A of the first semiconductor element 32.
The slit forming part 50 has a configuration and measurements so that the wires 38 can be connected between the pads 42A of the first semiconductor element 32 and the rear surface side bonding pads 46A of the supporting board 40A via the slit forming part 50.
The pads 42B through 42D of the flip chip bonded first semiconductor element 32 are connected to the bonding pads 46B through 46D situated on the front surface 44 of the supporting board 40A via the projection electrodes 37. On the other hand, the wires 39 connecting to the bonding pads of the second semiconductor element 33 are connected to the bonding pads 47. Since the second semiconductor element 33 is a memory chip and arrangement of the outside connection pads of the second semiconductor element 33 is normally normal, the number of pads of the second semiconductor element 33 is smaller than that of the first semiconductor element 32. Accordingly, the second semiconductor element 33 is connected to the bonding pads 47 formed on the supporting board 40A by the wires 39. The second semiconductor element 33 may be connected to the supporting board 40A by a flip-chip bonding method.
Ends of the surface side wirings 49B, whose other ends are connected to the bonding pads 46B and 46D, are connected via through hole forming parts 51 piercing the supporting board 40A. In addition, ends of the surface side wirings 49B, whose other ends are connected to the front surface side bonding pads 46C, are connected to the bonding pads 47. As shown in
On the other hand, as shown in
A part of the outside connection electrodes 48 is electrically connected to the bonding pads 46B and 46D via the through hole forming parts 51 piercing the supporting board 40A. In addition, the outside connection electrodes 48 not connected via the through hole forming parts 51 are not connected are connected to the rear surface side bonding pads 46A. As shown in
In the semiconductor device 30A having the above-discussed structure, the first semiconductor element 32 is provided and mounted on the supporting board 40A where the slit forming part 50 is selectively provided. The selected electrode pads 42A of the first semiconductor element 32 are connected to the rear surface side bonding pads 46A formed on the rear surface of the supporting board 40A via the slit forming part 50 by wire bonding. While the rear surface side bonding pads 46A are connected to the outside connection electrodes 48 by the surface side wiring 49A, the surface side wiring 49A can be formed on the rear surface 45 of the supporting board 40A except forming positions of the outside connection electrodes 48. Therefore, the degree of freedom of arrangement of the rear surface side wiring 49A is high.
In other words, the rear surface 45 of the supporting board 40A is used as an arrangement area of the wirings so that the degree of freedom of arrangement on the front surface 44 is improved. Hence, it is possible to make the semiconductor device 30A miniaturized and have high densities so that accelerating of the semiconductor device 30A can be achieved.
According to this embodiment, since the first semiconductor element 32 is connected to the supporting board 40A by flip chip bonding, it is possible to make the mounting area smaller than a mounting structure by a wire bonding method. Hence, it is possible to save space required for electrically connecting between the first semiconductor element 32 and the supporting board 40A.
The first semiconductor element 32 and the second semiconductor element 33 provided and mounted on the supporting board 40A discussed above are sealed by a sealing resin part 55 as shown in
The sealing resin enters the rear surface 45 of the supporting board 40A via the slit forming part 50 so as to seal the wires 38. The wires 38 are protected by the sealing resin. As shown in
Under this structure, it is possible to prevent the projection part 55A from being an obstacle for mounting the semiconductor device 30A on a mounting board (not shown) installed in an electronic device by using the outside connection terminals 52. It is preferable that the height H2 of the projection part 55A be equal to or less than ½ of the height H1 of the outside connection terminal 52, namely H2 ≦H½.
Next, a second embodiment of the present invention is discussed.
In the second embodiment of the present invention, three semiconductor elements 32 through 34 are provided and mounted on a single supporting board 40B. Under this structure, the first semiconductor element 32 and the third semiconductor element 34 are logic chips having a large number of outside connection pads. The second semiconductor element 33 is a memory chip having a relatively small number of the outside connection pads.
As shown in
Slit forming parts 50A and 50B are formed at left and right parts, respectively, of the supporting board 40A. A wire 38 connects the first semiconductor element 32 to the rear surface of the supporting board 40B via the slit forming part 50A. A wire 38 connects the third semiconductor element 34 to the rear surface of the supporting board 40B via the slit forming part 50B.
Thus, in the case where two semiconductor elements 32 and 34 each having a large number of pads are mounted on a single supporting board, the degree of freedom of arrangement of wirings on the front surface of the supporting board 40A is lower than that of the first embodiment of the present invention. However, in the second embodiment of the present invention, pads corresponding to narrow wirings arrangement areas at end parts of the supporting board 40B among the pads 42A through 42D of the semiconductor elements 32 and 34 are connected to the rear surface of the supporting board 40B by the wires 38 via the slit forming parts 50A and 50B provided in the supporting board 40B.
Under this structure, even if plural semiconductor elements or a semiconductor element having a large number of outside connection pads is provided and mounted on a single supporting board, it is possible to achieve miniaturization or high density of the semiconductor device.
Next, a third embodiment of the present invention is discussed.
In the semiconductor device 30C of the third embodiment of the present invention, as shown in
Under this structure, the semiconductor element 32 is provided so that an edge part of the semiconductor element 32 is situated in the vicinity of an outer periphery edge part of the supporting board 40C or outside the vicinity of an outer periphery edge part of the supporting board 40C. Hence, it is possible to miniaturize the semiconductor device 30C.
Next, a fourth embodiment of the present invention is discussed.
In the semiconductor device 30D of the fourth embodiment of the present invention, as shown in
Next, fifth and sixth embodiments of the present invention are discussed.
In the semiconductor device 30E of the fifth embodiment, a dam 61 configured to block flow of the sealing resin is provided in the vicinity of the slit forming part 50. In the semiconductor device 30F of the sixth embodiment, dams 61 and 62 configured to block flow of the sealing resin are provided in the vicinity of the slit forming part 50.
The dams 61 and 62 are made of the same material as the solder resist 56B and therefore are formed in a lump when the solder resist 56B is formed. Therefore, the manufacturing process does not become complex due to forming the dams 61 and 62.
In the semiconductor device 30E of the fifth embodiment, the dam 61 is provided between the slit forming part 50 and the outside connection terminal 52 on the supporting board 40A. Under this structure, even if the sealing resin enters the rear surface side of the supporting board 40A via the slit forming part 50 when the sealing resin 55 is formed, the flow of the sealing resin is blocked by the dam 61. Accordingly, it is possible to prevent the sealing resin from reaching the forming position of the outside connection terminals 52, namely the outside connection electrodes 48, and therefore the outside connection terminals 52 can be securely formed on the outside connection electrodes 48.
On the other hand, in the semiconductor device 30F shown in
Next, seventh through ninth embodiments of the present invention are discussed.
In the semiconductor device 30G shown in
In the semiconductor device 30H shown in
In the semiconductor device 30I shown in
The decoupling condenser 68 is formed by a ground metal layer 65, a dielectric layer 66, and an electric power metal layer 67. The ground metal layer 65 is formed on a rear surface of the semiconductor element 36. The electric power metal layer 67 is formed on an upper surface of the second semiconductor element 33. The dielectric layer 66 is provided between the ground metal layer 65 and the electric power metal layer 67. Thus, since the decoupling condenser 68 is provided between the second semiconductor element 33 and the semiconductor element 36, it is possible to improve an electric characteristic when a high frequency signal is used.
In the semiconductor devices 30G through 30I, while high functionality can be achieved by making the semiconductor elements 32 through 36 form stacking structures, the number of wiring is increased. However, in these embodiments, a part of the pads of the semiconductor elements is connected to the rear surface of the supporting board 40A via the slit forming part 50 by the wires 38 and the rear surface of the supporting board 40A is applied as the wiring area. Therefore, in these embodiments, it is possible to respond to the increase of the wirings. The slit forming part 50 may be changed to the notch part if necessary.
Next, a tenth embodiment of the present invention is discussed with reference to
In the above-discussed semiconductor devices 30A through 30I, the slit forming part 50 is provided in the vicinity of the edge part of the supporting board in the narrow wiring arrangement area formed on the supporting board or the notch forming part 60 is provided at the edge part of the supporting board in the narrow wiring arrangement area formed on the supporting board or the notch forming part 60. Via such a slit forming part 50 or the notch forming part 50, the pads of the corresponding semiconductor element are connected to the rear surface of the supporting board by the wires 38. Under this structure, it is possible to make the semiconductor devices 30A through 30I miniaturized and have high densities.
On the other hand, in a semiconductor device 30J of the tenth embodiment of the present invention, selected ones among plural outside connection pads of the semiconductor element 32, which is flip-chip mounted on a supporting board 40E, regardless of positions of the pads, are connected to the rear surface 45 of the supporting board 40E via the slit forming part 50C provided in the supporting board 40E by the wires 38. An electric power conductive layer (or ground conductive layer) 70 is selectively provided on the rear surface 45 of the supporting board 40E and the wires 38 are connected to the electric power conductive layer (or ground conductive layer) 70.
In other words, as shown in
Under this structure, as shown in
In this embodiment, the electric power conductive layer is used as a conductive layer formed on the rear surface of the supporting board 40E. However, the present invention is not limited to this. A ground conductive layer may be provided on the rear surface of the supporting board 40E. In this case, a ground pad of the first semiconductor element 32 is connected to the ground conductive layer via the wire 38.
As shown in
In the example shown in
In the example shown
A side of the semiconductor element 32 where the slit forming part or the notch forming part is formed is selected as follows. That is, a single side or two sides are selected from three sides corresponding to the wirings arrangement areas 43A through 43D around the semiconductor element 32 other than the largest wiring arrangement area at the supporting board where the semiconductor element 32 is mounted. In this case, the side of the semiconductor element 32 corresponding to the narrowest wirings arrangement area has a priority to be selected. Next, the side of the semiconductor element 32 corresponding to the second narrowest wirings arrangement area is selected.
The example shown in
In the examples shown in
In the examples shown in
Forming positions of the slit forming part and the notch forming part are not limited to the structures shown in
Next, an example of a manufacturing method of the semiconductor device of the embodiment of the present invention is discussed. In the following explanation, an example of a manufacturing method of the semiconductor device 30K shown in
Under this structure, pads formed in a position corresponding to a relatively wide wirings arrangement area of the supporting board 40C among the pads of the first semiconductor element 32 are flip-chip bonded to the supporting board 40C by bumps 37.
On the other hand, pads formed in a position corresponding to a narrow wirings arrangement area of the supporting board 40C are connected (wire bonded) to the rear surface side bonding pads 46A on the rear surface of the supporting board 40C via the notch forming part 60 by the wires 38. In addition, the second semiconductor element 33 is flip-chip bonded to the supporting board 40C. In addition, the first and second semiconductor elements 32 and 33 are sealed by the sealing resin part 55.
The semiconductor device 30K having the above-mentioned structure is manufactured by processes of step 10 through step 60 shown in
First, as shown in
The supporting board sheet 75 is formed by a multilayer wiring technique so as to have the outside connection electrodes 48, the surface side bonding pads, the rear surface side bonding pads, surface side wirings, rear surface side wiring, bonding pads, and through hole forming parts. The slit forming part 50 is also formed in the supporting board sheet 75 in advance by a press process. At this time, positioning-hole forming parts 76 for positioning the supporting board sheet 75 are also formed.
Next, the first semiconductor elements 32 and the second semiconductor elements 33 are flip-chip bonded on the supporting board sheet 75 in step 20.
Here, the pads formed in positions facing the relatively wide wirings arrangement area of the first semiconductor element 32 are flip-chip bonded to pads on the supporting board sheet 75 via the bumps 37. On the other hand, the pads formed in positions facing the narrow wirings arrangement area of the first semiconductor element 32 face the slit forming part 50 formed in the supporting board sheet 75.
In step 30, a wire bonding process is implemented so that the semiconductor element 32 and the rear surface of the supporting board sheet 75 are connected by the wires 38.
In the process in step 20, designated pads of the semiconductor element 32 are positioned in the slit forming part 50. Via the slit forming part 50, the wire 38 connect the pads of the semiconductor element 32 and the rear surface side bonding pads (not shown in
In step 40, a resin sealing process is implemented. Epoxy resin is supplied by using a transfer molding method in the resin sealing process, so that the sealing resin part 55 is formed. When the sealing resin part 55 is formed, a part of the sealing resin enters the rear surface 45 of the supporting board sheet 75 via the slit forming part 50 so as to seal the wires 38 and form the projection part 55A.
In step 50, as shown in
After the dicing process is completed, in step 60 solder balls as the outside connection terminals 52 are provided on the pads on the rear surface of the supporting board 40C and thereby the semiconductor device 30K shown in
According to the manufacturing method of this example, a part of plural pads formed on the semiconductor element 32, namely the pads facing the narrow wiring arrangement area, are positioned so as to face the slit forming part 50 formed in the supporting board sheet 75. In addition, the pads of the semiconductor element are connected to the rear surface side bonding pads formed on the rear surface 45 of the supporting board sheet 75 via the slit forming part 50 by wire bonding.
Because of this, even if the semiconductor element 32 is provided on the front surface 44 of the supporting board sheet 75, the pads formed on the semiconductor element 32 can be easily and securely wire-connected to the rear surface side bonding pads formed on the rear surface 45 of the supporting board sheet 75.
In the above-discussed example, the solder ball is used as the outside connection terminal having a projection configuration. However, the present invention is not limited to this example. For example, a gold (Au) bump can be applied, if necessary, as the outside connection terminal.
The present invention is not limited to these embodiments, but variations and modifications may be made without departing from the scope of the present invention.
This application is a U.S. continuation application filed under 35 USC 111(a) claiming benefit under 35 USC 120 and 365(c) of PCT application JP04/013629, filed Sep. 17, 2004. The foregoing application is hereby incorporated herein by reference.
Number | Date | Country | |
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Parent | PCT/JP04/13629 | Sep 2004 | US |
Child | 11703702 | Feb 2007 | US |