Mitsutane KOKUBU

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Package substrate processing method
- Patent number 11,101,151
- Issue date Aug 24, 2021
- Disco Corporation
- Kenji Takenouchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER GRINDING METHOD
- Publication number 20240335918
- Publication date Oct 10, 2024
- Disco Corporation
- Kenji TAKENOUCHI
- B24 - GRINDING POLISHING
Information Patent Application
PACKAGE SUBSTRATE PROCESSING METHOD
- Publication number 20200058525
- Publication date Feb 20, 2020
- Disco Corporation
- Kenji TAKENOUCHI
- H01 - BASIC ELECTRIC ELEMENTS