Mitsuyoshi Endo

Person

Ebina, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor light emitting device and method for manufacturing same
- Patent number 9,887,328
- Issue date Feb 6, 2018
- Kabushiki Kaisha Toshiba
- Hideyuki Tomizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method for manufacturing same
- Patent number 9,755,127
- Issue date Sep 5, 2017
- Kabushiki Kaisha Toshiba
- Miyuki Shimojuku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 9,735,325
- Issue date Aug 15, 2017
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method of manufacturing the...
- Patent number 9,595,631
- Issue date Mar 14, 2017
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method for manufacturing same
- Patent number 9,543,484
- Issue date Jan 10, 2017
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,312,207
- Issue date Apr 12, 2016
- Kabushiki Kaisha Toshiba
- Satoshi Wakatsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack including inspection circuit, inspection method and inspectio...
- Patent number 9,229,052
- Issue date Jan 5, 2016
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- G01 - MEASURING TESTING
Information Patent Grant
Substrate bonding method and substrate bonding apparatus
- Patent number 9,209,097
- Issue date Dec 8, 2015
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and manufacturing apparatus
- Patent number 9,123,717
- Issue date Sep 1, 2015
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,884,396
- Issue date Nov 11, 2014
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and laminate structure including the same
- Patent number 8,766,407
- Issue date Jul 1, 2014
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable capacity element
- Patent number 8,427,808
- Issue date Apr 23, 2013
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,324,715
- Issue date Dec 4, 2012
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna device and radio communication device
- Patent number 7,768,456
- Issue date Aug 3, 2010
- Kabushiki Kaisha Toshiba
- Yukako Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting electronic device
- Patent number 7,370,412
- Issue date May 13, 2008
- Kabushiki Kaisha Toshiba
- Toshiro Hiraoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, semiconductor package member, and semiconduct...
- Patent number 7,095,112
- Issue date Aug 22, 2006
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated-chip semiconductor device
- Patent number 6,861,738
- Issue date Mar 1, 2005
- Kabushiki Kaisha Toshiba
- Katsuhiko Oyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,617,678
- Issue date Sep 9, 2003
- Kabushiki Kaisha Toshiba
- Takashi Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a tab chip on a tape carrier with lead...
- Patent number 5,969,413
- Issue date Oct 19, 1999
- Kabushiki Kaishi Toshiba
- Keiichi Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an aluminum nitride substrate
- Patent number 5,703,397
- Issue date Dec 30, 1997
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board
- Patent number 5,176,309
- Issue date Jan 5, 1993
- Kabushiki Kaisha Toshiba
- Akihiro Horiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride sintered body having conductive metallized layer
- Patent number 4,770,953
- Issue date Sep 13, 1988
- Kabushiki Kaisha Toshiba
- Akihiro Horiguchi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170077367
- Publication date Mar 16, 2017
- KABUSHIKI KAISHA TOSHIBA
- MIYUKI SHIMOJUKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...
- Publication number 20160268471
- Publication date Sep 15, 2016
- KABUSHIKI KAISHA TOSHIBA
- Mitsuyoshi ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR FORMING PHOSPHOR...
- Publication number 20160233389
- Publication date Aug 11, 2016
- KABUSHIKI KAISHA TOSHIBA
- Hideto FURUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE, AND MANUFACTURING...
- Publication number 20160079112
- Publication date Mar 17, 2016
- Kabushiki Kaisha Toshiba
- Shuji ITONAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160079491
- Publication date Mar 17, 2016
- KABUSHIKI KAISHA TOSHIBA
- Mitsuyoshi ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20150262913
- Publication date Sep 17, 2015
- Kabushiki Kaisha Toshiba
- Satoshi WAKATSUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD AND SUBSTRATE BONDING APPARATUS
- Publication number 20150140689
- Publication date May 21, 2015
- Kabushiki Kaisha Toshiba
- Mitsuyoshi ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150069437
- Publication date Mar 12, 2015
- KABUSHIKI KAISHA TOSHIBA
- Hideyuki TOMIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140285273
- Publication date Sep 25, 2014
- Mitsuyoshi ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Publication number 20140242779
- Publication date Aug 28, 2014
- Kabushiki Kaisha Toshiba
- Kenro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK INCLUDING INSPECTION CIRCUIT, INSPECTION METHOD AND INSPECTIO...
- Publication number 20140210497
- Publication date Jul 31, 2014
- Mitsuyoshi ENDO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130168832
- Publication date Jul 4, 2013
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND LAMINATE STRUCTURE INCLUDING THE SAME
- Publication number 20130049210
- Publication date Feb 28, 2013
- Kabushiki Kaisha Toshiba
- Mitsuyoshi ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120248579
- Publication date Oct 4, 2012
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120248624
- Publication date Oct 4, 2012
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120038029
- Publication date Feb 16, 2012
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE CAPACITY ELEMENT
- Publication number 20110007448
- Publication date Jan 13, 2011
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna device and radio communication device
- Publication number 20080231518
- Publication date Sep 25, 2008
- Kabushiki Kaisha Toshiba
- Yukako Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device module
- Publication number 20040112633
- Publication date Jun 17, 2004
- Mitsuyoshi Endo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, semiconductor package member, and semiconduct...
- Publication number 20040056341
- Publication date Mar 25, 2004
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for connecting electronic device
- Publication number 20040009683
- Publication date Jan 15, 2004
- Kabushiki Kaisha Toshiba
- Toshiro Hiraoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20020195698
- Publication date Dec 26, 2002
- Takashi Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated-chip semiconductor device
- Publication number 20020180030
- Publication date Dec 5, 2002
- KABUSHIKI KAISHA TOAHIBA
- Katsuhiko Oyama
- H01 - BASIC ELECTRIC ELEMENTS

Mitsuyoshi Endo

Person

Patents Grantslast 30 patents

Semiconductor light emitting device and method for manufacturing same

Semiconductor light emitting device and method for manufacturing same

Semiconductor device and manufacturing method of semiconductor device

Semiconductor light emitting device and method of manufacturing the...

Semiconductor light emitting device and method for manufacturing same

Semiconductor device

Stack including inspection circuit, inspection method and inspectio...

Substrate bonding method and substrate bonding apparatus

Semiconductor device manufacturing method and manufacturing apparatus

Semiconductor device and manufacturing method thereof

Semiconductor wafer and laminate structure including the same

Variable capacity element

Semiconductor device and method of manufacturing the same

Antenna device and radio communication device

Method for connecting electronic device

Semiconductor device, semiconductor package member, and semiconduct...

Laminated-chip semiconductor device

Semiconductor device

Semiconductor device having a tab chip on a tape carrier with lead...

Semiconductor package having an aluminum nitride substrate

Method of manufacturing circuit board

Aluminum nitride sintered body having conductive metallized layer

Patents Applicationslast 30 patents

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR FORMING PHOSPHOR...

MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE, AND MANUFACTURING...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Semiconductor Device

SUBSTRATE BONDING METHOD AND SUBSTRATE BONDING APPARATUS

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS

STACK INCLUDING INSPECTION CIRCUIT, INSPECTION METHOD AND INSPECTIO...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER AND LAMINATE STRUCTURE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

VARIABLE CAPACITY ELEMENT

Antenna device and radio communication device

Electronic device module

Semiconductor device, semiconductor package member, and semiconduct...

Method for connecting electronic device

Semiconductor device

Laminated-chip semiconductor device