Mitsuyoshi Makida

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ultrasonic bonding device and ultrasonic bonding method
- Patent number 11,541,477
- Issue date Jan 3, 2023
- TDK Corporation
- Seijiro Sunaga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic mounting apparatus
- Patent number 7,828,190
- Issue date Nov 9, 2010
- TDK Corporation
- Yuji Saito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20230382069
- Publication date Nov 30, 2023
- TDK Corporation
- Yohei SATO
- B30 - PRESSES
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20230381903
- Publication date Nov 30, 2023
- TDK Corporation
- Yohei SATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20230382070
- Publication date Nov 30, 2023
- TDK Corporation
- Yohei SATO
- B30 - PRESSES
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20230381904
- Publication date Nov 30, 2023
- TDK Corporation
- Yohei SATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STAMP TOOL, TRANSFER DEVICE, AND ELEMENT ARRAY MANUFACTURING METHOD
- Publication number 20230187258
- Publication date Jun 15, 2023
- TDK Corporation
- Seijiro SUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAMP TOOL HOLDING APPARATUS, STAMP TOOL POSITIONING APPARATUS, MUL...
- Publication number 20230140856
- Publication date May 11, 2023
- TDK Corporation
- Seijiro SUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEMENT ARRAY PRESSURIZING DEVICE, MANUFACTURING DEVICE, AND MANUFA...
- Publication number 20230093241
- Publication date Mar 23, 2023
- TDK Corporation
- Hiroshi KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC BONDING DEVICE AND ULTRASONIC BONDING METHOD
- Publication number 20190375041
- Publication date Dec 12, 2019
- TDK Corporation
- Seijiro SUNAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC MOUNTING APPARATUS
- Publication number 20090255979
- Publication date Oct 15, 2009
- TDK Corporation
- Yuji Saito
- H01 - BASIC ELECTRIC ELEMENTS

Mitsuyoshi Makida

Person

Patents Grantslast 30 patents

Ultrasonic bonding device and ultrasonic bonding method

Ultrasonic mounting apparatus

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS

STAMP TOOL, TRANSFER DEVICE, AND ELEMENT ARRAY MANUFACTURING METHOD

STAMP TOOL HOLDING APPARATUS, STAMP TOOL POSITIONING APPARATUS, MUL...

ELEMENT ARRAY PRESSURIZING DEVICE, MANUFACTURING DEVICE, AND MANUFA...

ULTRASONIC BONDING DEVICE AND ULTRASONIC BONDING METHOD

ULTRASONIC MOUNTING APPARATUS