Mitsuyuki Takada

Person

Amagasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Cu/Mo/Cu clad mounting for high frequency devices
- Patent number 5,773,879
- Issue date Jun 30, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Tosihiro Fusayasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Evaluation board for evaluating electrical characteristics of an IC...
- Patent number 5,672,965
- Issue date Sep 30, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Kazuhiko Kurafuchi
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for inspecting on-off states of a scattering-type liquid...
- Patent number 5,459,594
- Issue date Oct 17, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Kunifumi Nakanishi
- G02 - OPTICS
Information Patent Grant
Wiring panel including wiring having a surface-reforming layer and...
- Patent number 5,175,399
- Issue date Dec 29, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Mitsumasa Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having a metal substrate
- Patent number 5,173,844
- Issue date Dec 22, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Kohei Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with high heat dissipations characteristic
- Patent number 5,081,562
- Issue date Jan 14, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Kohei Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for preparing a combined wiring substrate
- Patent number 5,069,745
- Issue date Dec 3, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Hirofumi Ohuchida
- G02 - OPTICS
Information Patent Grant
Electrode structure for a thick film resistor
- Patent number 5,059,941
- Issue date Oct 22, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Eishi Gofuku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a circuit board
- Patent number 4,993,148
- Issue date Feb 19, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Kohei Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing hybrid integrated circuit substrate
- Patent number 4,963,389
- Issue date Oct 16, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating hybrid integrated circuit
- Patent number 4,946,709
- Issue date Aug 7, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging semiconductor device
- Patent number 4,942,140
- Issue date Jul 17, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Hideaki Ootsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing hybrid integrated circuits
- Patent number 4,914,815
- Issue date Apr 10, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating hybrid integrated circuit
- Patent number 4,898,805
- Issue date Feb 6, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling electric resistance of a compound-type resis...
- Patent number 4,785,157
- Issue date Nov 15, 1988
- Mitsubishi Denki Kabushiki Kaisha
- Eishi Gofuku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit substrate and method of manufacturing the...
- Patent number 4,783,642
- Issue date Nov 8, 1988
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multilayer circuit board
- Patent number 4,752,555
- Issue date Jun 21, 1988
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit substrate and method of manufacturing the...
- Patent number 4,685,203
- Issue date Aug 11, 1987
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite having conductive layer on resin layer and method of manu...
- Patent number 4,645,734
- Issue date Feb 24, 1987
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite and circuit board having conductive layer on resin layer...
- Patent number 4,643,798
- Issue date Feb 17, 1987
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing multilayer circuit board
- Patent number 4,629,681
- Issue date Dec 16, 1986
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS

Mitsuyuki Takada

Person

Patents Grantslast 30 patents

Cu/Mo/Cu clad mounting for high frequency devices

Evaluation board for evaluating electrical characteristics of an IC...

Apparatus for inspecting on-off states of a scattering-type liquid...

Wiring panel including wiring having a surface-reforming layer and...

Integrated circuit device having a metal substrate

Circuit board with high heat dissipations characteristic

Process for preparing a combined wiring substrate

Electrode structure for a thick film resistor

Method of manufacturing a circuit board

Method for producing hybrid integrated circuit substrate

Method for fabricating hybrid integrated circuit

Method of packaging semiconductor device

Method for manufacturing hybrid integrated circuits

Method for fabricating hybrid integrated circuit

Method for controlling electric resistance of a compound-type resis...

Hybrid integrated circuit substrate and method of manufacturing the...

Method of manufacturing multilayer circuit board

Hybrid integrated circuit substrate and method of manufacturing the...

Composite having conductive layer on resin layer and method of manu...

Composite and circuit board having conductive layer on resin layer...

Method of manufacturing multilayer circuit board