Mitul B. Modi

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Open cavity bridge co-planar placement architectures and processes
- Patent number 12,176,268
- Issue date Dec 24, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No mold shelf package design and process flow for advanced package...
- Patent number 12,087,731
- Issue date Sep 10, 2024
- Intel Corporation
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy die structures of a packaged integrated circuit device
- Patent number 12,068,222
- Issue date Aug 20, 2024
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package architectures containing a die back side metal a...
- Patent number 12,040,246
- Issue date Jul 16, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open cavity bridge power delivery architectures and processes
- Patent number 12,027,448
- Issue date Jul 2, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with thermal insulation
- Patent number 11,942,393
- Issue date Mar 26, 2024
- Intel Corporation
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No mold shelf package design and process flow for advanced package...
- Patent number 11,901,333
- Issue date Feb 13, 2024
- Intel Corporation
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active package cooling structures using molded substrate packaging...
- Patent number 11,735,495
- Issue date Aug 22, 2023
- Intel Corporation
- Omkar Karhade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Stacked die cavity package
- Patent number 11,705,377
- Issue date Jul 18, 2023
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband multi-pin edge connector for radio frequency front end module
- Patent number 11,611,164
- Issue date Mar 21, 2023
- Intel Corporation
- Zhenguo Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled cooling fins in ultra-small systems
- Patent number 11,574,851
- Issue date Feb 7, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,545,407
- Issue date Jan 3, 2023
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin, hyper-density semiconductor packages
- Patent number 11,430,724
- Issue date Aug 30, 2022
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having passive support wafer
- Patent number 11,417,630
- Issue date Aug 16, 2022
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die cavity package
- Patent number 11,328,968
- Issue date May 10, 2022
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally coupled package-on-package semiconductor packages
- Patent number 11,222,877
- Issue date Jan 11, 2022
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding s...
- Patent number 11,024,559
- Issue date Jun 1, 2021
- Intel Corporation
- Joshua Heppner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive coating for a microelectronics package
- Patent number 10,910,314
- Issue date Feb 2, 2021
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,763,220
- Issue date Sep 1, 2020
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive coating for a microelectronics package
- Patent number 10,510,667
- Issue date Dec 17, 2019
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with conformal EMI shielding and related...
- Patent number 10,325,866
- Issue date Jun 18, 2019
- Intel Corporation
- Eric Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,229,887
- Issue date Mar 12, 2019
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetically shielded electronic devices and related systems...
- Patent number 10,224,290
- Issue date Mar 5, 2019
- Intel Corporation
- Rajendra Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die sidewall interconnects for 3D chip assemblies
- Patent number 10,199,354
- Issue date Feb 5, 2019
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with conformal EMI shielding and related...
- Patent number 9,847,304
- Issue date Dec 19, 2017
- Intel Corporation
- Eric Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Perforated conductive material for EMI shielding of semiconductor d...
- Patent number 9,704,811
- Issue date Jul 11, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill device and method
- Patent number 9,516,752
- Issue date Dec 6, 2016
- Intel Corporation
- Patricia A Brusso
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Underfill device and method
- Patent number 8,399,291
- Issue date Mar 19, 2013
- Intel Corporation
- Patricia A Brusso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant integrated circuit package substrate
- Patent number 7,745,917
- Issue date Jun 29, 2010
- Intel Corporation
- Biju Chandran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded capacitors for reducing package cracking
- Patent number 7,719,109
- Issue date May 18, 2010
- Intel Corporation
- Mitul Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20240332112
- Publication date Oct 3, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20240136326
- Publication date Apr 25, 2024
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
- Publication number 20240030116
- Publication date Jan 25, 2024
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20230238355
- Publication date Jul 27, 2023
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
- Publication number 20230138543
- Publication date May 4, 2023
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
- Publication number 20230089494
- Publication date Mar 23, 2023
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
- Publication number 20230092821
- Publication date Mar 23, 2023
- Intel Corporation
- Omkar G. Karhade
- G02 - OPTICS
Information Patent Application
NESTED GLASS PACKAGING ARCHITECTURE FOR HYBRID ELECTRICAL AND OPTIC...
- Publication number 20230080454
- Publication date Mar 16, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER
- Publication number 20220352121
- Publication date Nov 3, 2022
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
- Publication number 20220344247
- Publication date Oct 27, 2022
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE CAVITY PACKAGE
- Publication number 20220238402
- Publication date Jul 28, 2022
- Intel Corporation
- Mitul MODI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20220102234
- Publication date Mar 31, 2022
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY DIE STRUCTURES OF A PACKAGED INTEGRATED CIRCUIT DEVICE
- Publication number 20220102242
- Publication date Mar 31, 2022
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIR...
- Publication number 20220102231
- Publication date Mar 31, 2022
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY BRIDGE POWER DELIVERY ARCHITECTURES AND PROCESSES
- Publication number 20210305133
- Publication date Sep 30, 2021
- Intel Coporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY BRIDGE CO-PLANAR PLACEMENT ARCHITECTURES AND PROCESSES
- Publication number 20210305132
- Publication date Sep 30, 2021
- Intel Corporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH THERMAL INSULATION
- Publication number 20210242107
- Publication date Aug 5, 2021
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
KEEP OUT ZONE WITH HYDROPHOBIC SURFACE FOR INTEGRATED CIRCUIT (IC)...
- Publication number 20210233867
- Publication date Jul 29, 2021
- Intel Corporation
- Bassam ZIADEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20210104490
- Publication date Apr 8, 2021
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDEBAND MULTI-PIN EDGE CONNECTOR FOR RADIO FREQUENCY FRONT END MODULE
- Publication number 20200412041
- Publication date Dec 31, 2020
- Intel Corporation
- Zhenguo Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
- Publication number 20200273784
- Publication date Aug 27, 2020
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE PACKAGE THERMAL SPREADER AND EMI SHIELD COMPRISING GRAPHITE
- Publication number 20200273811
- Publication date Aug 27, 2020
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE PACKAGE COOLING STRUCTURES USING MOLDED SUBSTRATE PACKAGING...
- Publication number 20200273775
- Publication date Aug 27, 2020
- Intel Corporation
- Omkar Karhade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CRYSTALLINE CARBON HEAT SPREADING MATERIALS FOR IC DIE HOT SPOT RED...
- Publication number 20200273768
- Publication date Aug 27, 2020
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLED COOLING FINS IN ULTRA-SMALL SYSTEMS
- Publication number 20200273772
- Publication date Aug 27, 2020
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200227332
- Publication date Jul 16, 2020
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE CAVITY PACKAGE
- Publication number 20200185289
- Publication date Jun 11, 2020
- Intel Corporation
- Mitul MODI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COATING FOR A MICROELECTRONICS PACKAGE
- Publication number 20200118930
- Publication date Apr 16, 2020
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER
- Publication number 20190287942
- Publication date Sep 19, 2019
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20190157215
- Publication date May 23, 2019
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS

Mitul B. Modi

Person

Patents Grantslast 30 patents

Open cavity bridge co-planar placement architectures and processes

No mold shelf package design and process flow for advanced package...

Dummy die structures of a packaged integrated circuit device

Chip-scale package architectures containing a die back side metal a...

Open cavity bridge power delivery architectures and processes

Substrate with thermal insulation

No mold shelf package design and process flow for advanced package...

Active package cooling structures using molded substrate packaging...

Stacked die cavity package

Wideband multi-pin edge connector for radio frequency front end module

Coupled cooling fins in ultra-small systems

Thermal management solutions for integrated circuit packages

Ultra-thin, hyper-density semiconductor packages

Semiconductor package having passive support wafer

Stacked die cavity package

Thermally coupled package-on-package semiconductor packages

Semiconductor package with electromagnetic interference shielding s...

Conductive coating for a microelectronics package

Systems and methods for electromagnetic interference shielding

Conductive coating for a microelectronics package

Electronic device packages with conformal EMI shielding and related...

Systems and methods for electromagnetic interference shielding

Electromagnetically shielded electronic devices and related systems...

Die sidewall interconnects for 3D chip assemblies

Electronic device packages with conformal EMI shielding and related...

Perforated conductive material for EMI shielding of semiconductor d...

Underfill device and method

Underfill device and method

Compliant integrated circuit package substrate

Embedded capacitors for reducing package cracking

Patents Applicationslast 30 patents

CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES

NESTED GLASS PACKAGING ARCHITECTURE FOR HYBRID ELECTRICAL AND OPTIC...

SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER

ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES

STACKED DIE CAVITY PACKAGE

CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...

DUMMY DIE STRUCTURES OF A PACKAGED INTEGRATED CIRCUIT DEVICE

DUMMY DIE IN A RECESSED MOLD STRUCTURE OF A PACKAGED INTEGRATED CIR...

OPEN CAVITY BRIDGE POWER DELIVERY ARCHITECTURES AND PROCESSES

OPEN CAVITY BRIDGE CO-PLANAR PLACEMENT ARCHITECTURES AND PROCESSES

SUBSTRATE WITH THERMAL INSULATION

KEEP OUT ZONE WITH HYDROPHOBIC SURFACE FOR INTEGRATED CIRCUIT (IC)...

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

WIDEBAND MULTI-PIN EDGE CONNECTOR FOR RADIO FREQUENCY FRONT END MODULE

ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES

IC DIE PACKAGE THERMAL SPREADER AND EMI SHIELD COMPRISING GRAPHITE

ACTIVE PACKAGE COOLING STRUCTURES USING MOLDED SUBSTRATE PACKAGING...

CRYSTALLINE CARBON HEAT SPREADING MATERIALS FOR IC DIE HOT SPOT RED...

COUPLED COOLING FINS IN ULTRA-SMALL SYSTEMS

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

STACKED DIE CAVITY PACKAGE

CONDUCTIVE COATING FOR A MICROELECTRONICS PACKAGE

SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER

SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING