Mohamed A. RABIE

Person

Mechanicville, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Pic structure having barrier surrounding opening for optical elemen...
- Patent number 11,804,452
- Issue date Oct 31, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corner structures for an optical fiber groove and manufacturing met...
- Patent number 11,569,180
- Issue date Jan 31, 2023
- GLOBALFOUNDRIES U.S. INC.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC product comprising a single active fin FinFET device and an elec...
- Patent number 11,276,651
- Issue date Mar 15, 2022
- GLOBALFOUNDRIES U.S. INC.
- Anton Tokranov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corner structures for an optical fiber groove
- Patent number 11,145,606
- Issue date Oct 12, 2021
- GLOBALFOUNDRIES U.S. INC.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structures in semiconductor devices
- Patent number 10,923,397
- Issue date Feb 16, 2021
- GLOBALFOUNDRIES Inc.
- Mohamed A. Rabie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack trapping in semiconductor device structures
- Patent number 10,068,859
- Issue date Sep 4, 2018
- GLOBALFOUNDRIES Inc.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PIC STRUCTURE HAVING BARRIER SURROUNDING OPENING FOR OPTICAL ELEMEN...
- Publication number 20230030723
- Publication date Feb 2, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORNER STRUCTURES FOR AN OPTICAL FIBER GROOVE
- Publication number 20210375788
- Publication date Dec 2, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PRODUCT COMPRISING A SINGLE ACTIVE FIN FINFET DEVICE AND AN ELEC...
- Publication number 20210358865
- Publication date Nov 18, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Anton Tokranov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORNER STRUCTURES FOR AN OPTICAL FIBER GROOVE
- Publication number 20210305172
- Publication date Sep 30, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURES IN SEMICONDUCTOR DEVICES
- Publication number 20200176312
- Publication date Jun 4, 2020
- GLOBALFOUNDRIES INC.
- MOHAMED A. RABIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO MITIGATE CHIP PACKAGE INTERACTION RISK ON DIE CORNER USIN...
- Publication number 20170373019
- Publication date Dec 28, 2017
- GLOBALFOUNDRIES INC.
- Mohamed RABIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING TRANSIENT TSV-INDUCED IC SUBSTRATE NOISE AND RESULTING D...
- Publication number 20170033061
- Publication date Feb 2, 2017
- GLOBALFOUNDRIES INC.
- Mohamed RABIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF CANCELLING TSV-INDUCED SUBSTRATE STRESS
- Publication number 20150228555
- Publication date Aug 13, 2015
- GLOBALFOUNDRIES INC.
- Mohamed A. RABIE
- H01 - BASIC ELECTRIC ELEMENTS

Mohamed A. RABIE

Person

Patents Grantslast 30 patents

Pic structure having barrier surrounding opening for optical elemen...

Corner structures for an optical fiber groove and manufacturing met...

IC product comprising a single active fin FinFET device and an elec...

Corner structures for an optical fiber groove

Through-substrate via structures in semiconductor devices

Crack trapping in semiconductor device structures

Patents Applicationslast 30 patents

PIC STRUCTURE HAVING BARRIER SURROUNDING OPENING FOR OPTICAL ELEMEN...

CORNER STRUCTURES FOR AN OPTICAL FIBER GROOVE

IC PRODUCT COMPRISING A SINGLE ACTIVE FIN FINFET DEVICE AND AN ELEC...

CORNER STRUCTURES FOR AN OPTICAL FIBER GROOVE

THROUGH-SUBSTRATE VIA STRUCTURES IN SEMICONDUCTOR DEVICES

METHOD TO MITIGATE CHIP PACKAGE INTERACTION RISK ON DIE CORNER USIN...

MITIGATING TRANSIENT TSV-INDUCED IC SUBSTRATE NOISE AND RESULTING D...

STRUCTURE AND METHOD OF CANCELLING TSV-INDUCED SUBSTRATE STRESS