Mohammad Kamruzzaman CHOWDHURY

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making high critical temperature metal nitride layer
- Patent number 12,096,701
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Zihao Yang
Information Patent Grant
Method of making high critical temperature metal nitride layer
- Patent number 12,052,935
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Zihao Yang
Information Patent Grant
Method of making high critical temperature metal nitride layer
- Patent number 11,678,589
- Issue date Jun 13, 2023
- Applied Materials, Inc.
- Zihao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Counter based time compensation to reduce process shifting in react...
- Patent number 10,400,327
- Issue date Sep 3, 2019
- Applied Materials, Inc.
- Mohammad Kamruzzaman Chowdhury
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etch-resistant water soluble mask for hybrid wafer dicing using las...
- Patent number 9,721,839
- Issue date Aug 1, 2017
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer mask including non-photodefinable laser energy absorbin...
- Patent number 9,620,379
- Issue date Apr 11, 2017
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser and plasma etch wafer dicing with partial pre-curing of UV re...
- Patent number 9,252,057
- Issue date Feb 2, 2016
- Applied Materials, Inc.
- Mohammad Kamruzzaman Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform masking for wafer dicing using laser and plasma etch
- Patent number 9,048,309
- Issue date Jun 2, 2015
- Applied Materials, Inc.
- Mohammad Kamruzzaman Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser and plasma etch wafer dicing with a double sided UV-curable a...
- Patent number 8,969,177
- Issue date Mar 3, 2015
- Applied Materials, Inc.
- Mohammad Kamruzzaman Chowdhury
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser and plasma etch wafer dicing using UV-curable adhesive film
- Patent number 8,946,057
- Issue date Feb 3, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Substrate Handling System, Method, and Apparatus
- Publication number 20240044002
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Abhishek CHOWDHURY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MAKING HIGH CRITICAL TEMPERATURE METAL NITRIDE LAYER
- Publication number 20230329125
- Publication date Oct 12, 2023
- Applied Materials, Inc.
- Zihao Yang
Information Patent Application
METHOD OF MAKING HIGH CRITICAL TEMPERATURE METAL NITRIDE LAYER
- Publication number 20220013707
- Publication date Jan 13, 2022
- Applied Materials, Inc.
- Zihao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING HIGH CRITICAL TEMPERATURE METAL NITRIDE LAYER
- Publication number 20220013708
- Publication date Jan 13, 2022
- Applied Materials, Inc.
- Zihao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH-RESISTANT WATER SOLUBLE MASK FOR HYBRID WAFER DICING USING LAS...
- Publication number 20160365283
- Publication date Dec 15, 2016
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUNTER BASED TIME COMPENSATION TO REDUCE PROCESS SHIFTING IN REACT...
- Publication number 20160222503
- Publication date Aug 4, 2016
- Applied Materials, Inc.
- Mohammad Kamruzzaman Chowdhury
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-LAYER MASK INCLUDING NON-PHOTODEFINABLE LASER ENERGY ABSORBIN...
- Publication number 20160035577
- Publication date Feb 4, 2016
- Applied Materials, Inc.
- Wei-Sheng LEI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER AND PLASMA ETCH WAFER DICING WITH A DOUBLE SIDED UV-CURABLE A...
- Publication number 20150122419
- Publication date May 7, 2015
- Mohammad Kamruzzaman CHOWDHURY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER AND PLASMA ETCH WAFER DICING WITH PARTIAL PRE-CURING OF UV RE...
- Publication number 20140106542
- Publication date Apr 17, 2014
- Mohammad Kamruzzaman Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM MASKING FOR WAFER DICING USING LASER AND PLASMA ETCH
- Publication number 20140017879
- Publication date Jan 16, 2014
- Mohammad Kamruzzaman Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER AND PLASMA ETCH WAFER DICING WITH A DOUBLE SIDED UV-CURABLE A...
- Publication number 20140004685
- Publication date Jan 2, 2014
- Mohammad Kamruzzaman CHOWDHURY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER AND PLASMA ETCH WAFER DICING USING UV-CURABLE ADHESIVE FILM
- Publication number 20130280890
- Publication date Oct 24, 2013
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS

Mohammad Kamruzzaman CHOWDHURY

Person

Patents Grantslast 30 patents

Method of making high critical temperature metal nitride layer

Method of making high critical temperature metal nitride layer

Method of making high critical temperature metal nitride layer

Counter based time compensation to reduce process shifting in react...

Etch-resistant water soluble mask for hybrid wafer dicing using las...

Multi-layer mask including non-photodefinable laser energy absorbin...

Laser and plasma etch wafer dicing with partial pre-curing of UV re...

Uniform masking for wafer dicing using laser and plasma etch

Laser and plasma etch wafer dicing with a double sided UV-curable a...

Laser and plasma etch wafer dicing using UV-curable adhesive film

Patents Applicationslast 30 patents

Substrate Handling System, Method, and Apparatus

METHOD OF MAKING HIGH CRITICAL TEMPERATURE METAL NITRIDE LAYER

METHOD OF MAKING HIGH CRITICAL TEMPERATURE METAL NITRIDE LAYER

METHOD OF MAKING HIGH CRITICAL TEMPERATURE METAL NITRIDE LAYER

ETCH-RESISTANT WATER SOLUBLE MASK FOR HYBRID WAFER DICING USING LAS...

COUNTER BASED TIME COMPENSATION TO REDUCE PROCESS SHIFTING IN REACT...

MULTI-LAYER MASK INCLUDING NON-PHOTODEFINABLE LASER ENERGY ABSORBIN...

LASER AND PLASMA ETCH WAFER DICING WITH A DOUBLE SIDED UV-CURABLE A...

LASER AND PLASMA ETCH WAFER DICING WITH PARTIAL PRE-CURING OF UV RE...

UNIFORM MASKING FOR WAFER DICING USING LASER AND PLASMA ETCH

LASER AND PLASMA ETCH WAFER DICING WITH A DOUBLE SIDED UV-CURABLE A...

LASER AND PLASMA ETCH WAFER DICING USING UV-CURABLE ADHESIVE FILM