Mohammed Rabiul Islam

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Photonic semiconductor device and method
- Patent number 12,092,862
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mohammed Rabiul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit (3D IC) low-dropout (LDO) regu...
- Patent number 12,046,580
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous packaging integration of photonic and electronic elem...
- Patent number 11,966,090
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic cell structures and related methods
- Patent number 11,816,412
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kumar Lalgudi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structures and methods for high speed interconnection in photonic s...
- Patent number 11,808,977
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Weiwei Song
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Photonic semiconductor device and method
- Patent number 11,703,639
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mohammed Rabiul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for high speed interconnection in photonic s...
- Patent number 11,550,102
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Weiwei Song
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Photonic semiconductor device and method
- Patent number 11,215,753
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mohammed Rabiul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper interconnect using a multi-platen chemi...
- Patent number 6,573,173
- Issue date Jun 3, 2003
- Motorola, Inc.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a dual inlaid copper interconnect structure
- Patent number 6,551,919
- Issue date Apr 22, 2003
- Motorola, Inc.
- Suresh Venkatesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper interconnect using a multi-platen chemi...
- Patent number 6,444,569
- Issue date Sep 3, 2002
- Motorola, Inc.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a dual inlaid copper interconnect structure
- Patent number 6,326,301
- Issue date Dec 4, 2001
- Motorola, Inc.
- Suresh Venkatesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper layer over a semiconductor wafer
- Patent number 6,297,155
- Issue date Oct 2, 2001
- Motorola Inc.
- Cindy Reidsema Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper interconnect using a multi-platen chemi...
- Patent number 6,274,478
- Issue date Aug 14, 2001
- Motorola, Inc.
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Photonic Semiconductor Device And Method
- Publication number 20240369761
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mohammed Rabiul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) LOW-DROPOUT (LDO) REGU...
- Publication number 20240347513
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEM...
- Publication number 20240241329
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Stefan RUSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR HIGH SPEED INTERCONNECTION IN PHOTONIC S...
- Publication number 20230393337
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Weiwei Song
- G02 - OPTICS
Information Patent Application
Photonic Semiconductor Device And Method
- Publication number 20230305226
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mohammed Rabiul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR LATCH-UP PREVENTION
- Publication number 20230237237
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chia Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRUCTURES AND METHODS FOR HIGH SPEED INTERCONNECTION IN PHOTONIC S...
- Publication number 20230114059
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Weiwei Song
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LOGIC CELL STRUCTURES AND RELATED METHODS
- Publication number 20220335191
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- KUMAR LALGUDI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Three-dimensional Integrated Circuit (3D IC) Low-dropout (LDO) Regu...
- Publication number 20220302089
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEM...
- Publication number 20220283387
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Stefan RUSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Semiconductor Device And Method
- Publication number 20220128759
- Publication date Apr 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mohammed Rabiul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR HIGH SPEED INTERCONNECTION IN PHOTONIC S...
- Publication number 20220066099
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Weiwei Song
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20210271020
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mohammed Rabiul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR LATCH-UP PREVENTION
- Publication number 20210117605
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chia Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for forming a copper interconnect using a multi-platen chemi...
- Publication number 20020151167
- Publication date Oct 17, 2002
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a dual inlaid copper interconnect structure
- Publication number 20020039836
- Publication date Apr 4, 2002
- Suresh Venkatesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a copper interconnect using a multi-platen chemi...
- Publication number 20010027083
- Publication date Oct 4, 2001
- Janos Farkas
- H01 - BASIC ELECTRIC ELEMENTS

Mohammed Rabiul Islam

Person

Patents Grantslast 30 patents

Photonic semiconductor device and method

Three-dimensional integrated circuit (3D IC) low-dropout (LDO) regu...

Heterogeneous packaging integration of photonic and electronic elem...

Logic cell structures and related methods

Structures and methods for high speed interconnection in photonic s...

Photonic semiconductor device and method

Structures and methods for high speed interconnection in photonic s...

Photonic semiconductor device and method

Method for forming a copper interconnect using a multi-platen chemi...

Method for forming a dual inlaid copper interconnect structure

Method for forming a copper interconnect using a multi-platen chemi...

Method for forming a dual inlaid copper interconnect structure

Method for forming a copper layer over a semiconductor wafer

Method for forming a copper interconnect using a multi-platen chemi...

Patents Applicationslast 30 patents

Photonic Semiconductor Device And Method

THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) LOW-DROPOUT (LDO) REGU...

HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEM...

STRUCTURES AND METHODS FOR HIGH SPEED INTERCONNECTION IN PHOTONIC S...

Photonic Semiconductor Device And Method

METHOD AND SYSTEM FOR LATCH-UP PREVENTION

STRUCTURES AND METHODS FOR HIGH SPEED INTERCONNECTION IN PHOTONIC S...

LOGIC CELL STRUCTURES AND RELATED METHODS

Three-dimensional Integrated Circuit (3D IC) Low-dropout (LDO) Regu...

HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEM...

Photonic Semiconductor Device And Method

STRUCTURES AND METHODS FOR HIGH SPEED INTERCONNECTION IN PHOTONIC S...

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD

METHOD AND SYSTEM FOR LATCH-UP PREVENTION

Method for forming a copper interconnect using a multi-platen chemi...

Method for forming a dual inlaid copper interconnect structure

Method for forming a copper interconnect using a multi-platen chemi...