Mohan Prashanth Javare Gowda

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Patents Applicationslast 30 patents

Information Patent Application
STIFFENER ASSEMBLY
- Publication number 20250210428
- Publication date Jun 26, 2025
- Intel Corporation
- Mohan Prashanth Javare Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL ON A SURFACE OF A DIE IN A CAVITY
- Publication number 20250112202
- Publication date Apr 3, 2025
- Intel Corporation
- Abdallah BACHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS THROUGH A DIE THAT ARE ELECTRICALLY ISOLATED FROM ACTIVE CIRCU...
- Publication number 20250112139
- Publication date Apr 3, 2025
- Intel Corporation
- Abdallah BACHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS
- Publication number 20230317551
- Publication date Oct 5, 2023
- Intel Corporation
- Vishnu Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN CLIENT FORM FACTOR ASSEMBLY
- Publication number 20230317705
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACK COOLING WINGS
- Publication number 20230317681
- Publication date Oct 5, 2023
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS