Mohit Bhatia

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,887,962
- Issue date Jan 30, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,804,441
- Issue date Oct 31, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip semiconductor package including a bridge die disposed in...
- Patent number 11,791,274
- Issue date Oct 17, 2023
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,735,558
- Issue date Aug 22, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,521,931
- Issue date Dec 6, 2022
- Intel Corporation
- Jason M. Gamba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,373,972
- Issue date Jun 28, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SLIT FIDUCIALS FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT
- Publication number 20250006651
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING
- Publication number 20250006678
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCAL...
- Publication number 20250006695
- Publication date Jan 2, 2025
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING
- Publication number 20240006358
- Publication date Jan 4, 2024
- Intel Corporation
- Zhihua Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20230420376
- Publication date Dec 28, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURE INCLUDING ACTIVE BASE SUBSTRATE WITH THRO...
- Publication number 20230299049
- Publication date Sep 21, 2023
- Intel Corporation
- Nitin A. Deshpande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20220270998
- Publication date Aug 25, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391268
- Publication date Dec 16, 2021
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391273
- Publication date Dec 16, 2021
- Interl Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391266
- Publication date Dec 16, 2021
- Intel Corporation
- Jason M. Gamba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391295
- Publication date Dec 16, 2021
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20210391294
- Publication date Dec 16, 2021
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Mohit Bhatia

Person

Patents Grantslast 30 patents

Microelectronic structures including bridges

Microelectronic structures including bridges

Multichip semiconductor package including a bridge die disposed in...

Microelectronic structures including bridges

Microelectronic structures including bridges

Microelectronic structures including bridges

Patents Applicationslast 30 patents

SLIT FIDUCIALS FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT

PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING

PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCAL...

SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

MICROELECTRONIC STRUCTURE INCLUDING ACTIVE BASE SUBSTRATE WITH THRO...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES