Mohit Mamodia

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package with cathodic protection for corrosion mitigation
- Patent number 10,998,275
- Issue date May 4, 2021
- Intel Corporation
- Kyle Yazzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with patterned protective material
- Patent number 10,957,656
- Issue date Mar 23, 2021
- Intel Corporation
- Kyle Yazzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal head with a thermal barrier for integrated circuit die proc...
- Patent number 10,499,461
- Issue date Dec 3, 2019
- Intel Corporation
- Mohit Mamodia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stiffener tape for electronic assembly
- Patent number 9,793,151
- Issue date Oct 17, 2017
- Intel Corporation
- Xavier Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures to mitigate contamination on a back side of a semiconduc...
- Patent number 9,698,108
- Issue date Jul 4, 2017
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-stacking using through-silicon vias on bumpless build-up layer...
- Patent number 9,406,618
- Issue date Aug 2, 2016
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming die backside coating structures with coreless packages
- Patent number 9,165,914
- Issue date Oct 20, 2015
- Intel Corporation
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-stacking using through-silicon vias on bumpless build-up layer...
- Patent number 8,786,066
- Issue date Jul 22, 2014
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating for a microelectronic device, treatment comprising same, an...
- Patent number 8,569,108
- Issue date Oct 29, 2013
- Intel Corporation
- Dingying Xu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Forming die backside coating structures with coreless packages
- Patent number 8,466,559
- Issue date Jun 18, 2013
- Intel Corporation
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment for a microelectronic device and method of resisting dama...
- Patent number 8,304,065
- Issue date Nov 6, 2012
- Leonel Arana
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Coating for a microelectronic device, treatment comprising same, an...
- Patent number 8,287,996
- Issue date Oct 16, 2012
- Intel Corporation
- Dingying Xu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH PATTERNED PROTECTIVE MATERIAL
- Publication number 20200357752
- Publication date Nov 12, 2020
- Intel Corporation
- Kyle Yazzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CATHODIC PROTECTION FOR CORROSION MITIGATION
- Publication number 20200006256
- Publication date Jan 2, 2020
- Intel Corporation
- Kyle Yazzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BICONTINUOUS POROUS CERAMIC COMPOSITE FOR SEMICONDUCTOR PACKAGE APP...
- Publication number 20190206753
- Publication date Jul 4, 2019
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE PINS WITH ETCHED TIPS FOR ELECTRICAL DIE TEST
- Publication number 20170276700
- Publication date Sep 28, 2017
- Joseph D. Stanford
- G01 - MEASURING TESTING
Information Patent Application
STRUCTURES TO MITIGATE CONTAMINATION ON A BACK SIDE OF A SEMICONDUC...
- Publication number 20170186707
- Publication date Jun 29, 2017
- Intel Corporation
- Xavier F. BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Head with a Thermal Barrier for Integrated Circuit Die Proc...
- Publication number 20170176516
- Publication date Jun 22, 2017
- Intel Corporation
- Mohit Mamodia
- G01 - MEASURING TESTING
Information Patent Application
ADHESIVE WITH TUNABLE ADHESION FOR HANDLING ULTRA-THIN WAFER
- Publication number 20170140971
- Publication date May 18, 2017
- NACHIKET R. RARAVIKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER TAPE FOR ELECTRONIC ASSEMBLY
- Publication number 20160172229
- Publication date Jun 16, 2016
- Intel Corporation
- Xavier Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...
- Publication number 20140327149
- Publication date Nov 6, 2014
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...
- Publication number 20140295621
- Publication date Oct 2, 2014
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES
- Publication number 20130252376
- Publication date Sep 26, 2013
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING FOR A MICROELECTRONIC DEVICE, TREATMENT COMPRISING SAME,AND...
- Publication number 20130017650
- Publication date Jan 17, 2013
- Dingying Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES
- Publication number 20120153494
- Publication date Jun 21, 2012
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...
- Publication number 20120074581
- Publication date Mar 29, 2012
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treatment for a microelectronic device and method of resisting dama...
- Publication number 20110159256
- Publication date Jun 30, 2011
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coating for a microelectronic device, treatment comprising same, an...
- Publication number 20110151624
- Publication date Jun 23, 2011
- Dingying Xu
- H01 - BASIC ELECTRIC ELEMENTS

Mohit Mamodia

Person

Patents Grantslast 30 patents

Package with cathodic protection for corrosion mitigation

Integrated circuit packages with patterned protective material

Thermal head with a thermal barrier for integrated circuit die proc...

Stiffener tape for electronic assembly

Structures to mitigate contamination on a back side of a semiconduc...

Die-stacking using through-silicon vias on bumpless build-up layer...

Forming die backside coating structures with coreless packages

Die-stacking using through-silicon vias on bumpless build-up layer...

Coating for a microelectronic device, treatment comprising same, an...

Forming die backside coating structures with coreless packages

Treatment for a microelectronic device and method of resisting dama...

Coating for a microelectronic device, treatment comprising same, an...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES WITH PATTERNED PROTECTIVE MATERIAL

PACKAGE WITH CATHODIC PROTECTION FOR CORROSION MITIGATION

BICONTINUOUS POROUS CERAMIC COMPOSITE FOR SEMICONDUCTOR PACKAGE APP...

PROBE PINS WITH ETCHED TIPS FOR ELECTRICAL DIE TEST

STRUCTURES TO MITIGATE CONTAMINATION ON A BACK SIDE OF A SEMICONDUC...

Thermal Head with a Thermal Barrier for Integrated Circuit Die Proc...

ADHESIVE WITH TUNABLE ADHESION FOR HANDLING ULTRA-THIN WAFER

STIFFENER TAPE FOR ELECTRONIC ASSEMBLY

DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...

DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...

FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES

COATING FOR A MICROELECTRONIC DEVICE, TREATMENT COMPRISING SAME,AND...

FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES

DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...

Treatment for a microelectronic device and method of resisting dama...

Coating for a microelectronic device, treatment comprising same, an...