Momtchil Stavrev

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die bond pad with insulating separator
- Patent number 10,249,583
- Issue date Apr 2, 2019
- Infineon Technologies AG
- Christian Bretthauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for production of a semiconductor structure
- Patent number 7,141,507
- Issue date Nov 28, 2006
- Infineon Technologies AG
- Oliver Genz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing an etching mask on a microstructure, in parti...
- Patent number 7,037,777
- Issue date May 2, 2006
- Infineon Technologies AG
- Hans-Peter Moll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a contact hole plane in a memory module
- Patent number 7,018,781
- Issue date Mar 28, 2006
- Infineon Technologies, AG
- Hans-Georg Fröhlich
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Die Bond Pad with Insulating Separator
- Publication number 20190088604
- Publication date Mar 21, 2019
- INFINEON TECHNOLOGIES AG
- Christian Bretthauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20150147839
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Alessia Scire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for an integrated semiconductor structure and...
- Publication number 20080150141
- Publication date Jun 26, 2008
- Werner Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gap-filling for isolation
- Publication number 20060003546
- Publication date Jan 5, 2006
- Andreas Klipp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method for a semiconductor structure
- Publication number 20050245042
- Publication date Nov 3, 2005
- Moritz Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for production of a semiconductor structure
- Publication number 20050196952
- Publication date Sep 8, 2005
- Infineon Technologies AG
- Oliver Genz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a contact hole plane in a memory module
- Publication number 20050003308
- Publication date Jan 6, 2005
- Infineon Technologies AG
- Hans-Georg Frohlich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing an etching mask on a microstructure, in parti...
- Publication number 20040203238
- Publication date Oct 14, 2004
- Hans-Peter Moll
- H01 - BASIC ELECTRIC ELEMENTS

Momtchil Stavrev

Person

Patents Grantslast 30 patents

Semiconductor die bond pad with insulating separator

Method for production of a semiconductor structure

Process for producing an etching mask on a microstructure, in parti...

Method for fabricating a contact hole plane in a memory module

Patents Applicationslast 30 patents

Semiconductor Die Bond Pad with Insulating Separator

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

Manufacturing method for an integrated semiconductor structure and...

Gap-filling for isolation

Fabrication method for a semiconductor structure

Method for production of a semiconductor structure

Method for fabricating a contact hole plane in a memory module

Process for producing an etching mask on a microstructure, in parti...