Monika AGARWAL

Person

  • Fremont, CA, US

Patents Grantslast 30 patents

  • Information Patent Grant

    Methods for bonding substrates

    • Patent number 10,131,126
    • Issue date Nov 20, 2018
    • Applied Materials, Inc.
    • Kadthala Ramaya Narendrnath
    • B32 - LAYERED PRODUCTS
  • Information Patent Grant

    Methods for bonding substrates

    • Patent number 9,627,231
    • Issue date Apr 18, 2017
    • Applied Materials, Inc.
    • Kadthala Ramaya Narendrnath
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electrostatic chuck

    • Patent number D708651
    • Issue date Jul 8, 2014
    • Applied Materials, Inc.
    • Daniel Martin
    • D15 - Machines not elsewhere specified

Patents Applicationslast 30 patents