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Methods for bonding substrates
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Patent number 10,131,126
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Issue date Nov 20, 2018
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Applied Materials, Inc.
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Kadthala Ramaya Narendrnath
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B32 - LAYERED PRODUCTS
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Methods for bonding substrates
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Patent number 9,627,231
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Issue date Apr 18, 2017
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Applied Materials, Inc.
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Kadthala Ramaya Narendrnath
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H01 - BASIC ELECTRIC ELEMENTS
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Electrostatic chuck
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Patent number D708651
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Issue date Jul 8, 2014
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Applied Materials, Inc.
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Daniel Martin
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D15 - Machines not elsewhere specified