Moriji Matsumoto

Person

Kanagawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plating solution, semiconductor device and method for manufacturing...
- Patent number 7,344,986
- Issue date Mar 18, 2008
- Ebara Corporation
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device, method for manufacturing the same, and platin...
- Patent number 7,279,408
- Issue date Oct 9, 2007
- Ebara Corporation
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and substrate plating apparatus
- Patent number 7,208,074
- Issue date Apr 24, 2007
- Ebara Corporation
- Koji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and platin...
- Patent number 7,060,618
- Issue date Jun 13, 2006
- Ebara Corporation
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless Ni-B plating liquid, electronic device and method for m...
- Patent number 6,936,302
- Issue date Aug 30, 2005
- Ebara Corporation
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus and method
- Patent number 6,858,084
- Issue date Feb 22, 2005
- Ebara Corporation
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating liquid and semiconductor device
- Patent number 6,821,902
- Issue date Nov 23, 2004
- Ebara Corporation
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating liquid and semiconductor device
- Patent number 6,717,189
- Issue date Apr 6, 2004
- Ebara Corporation
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless Ni—B plating liquid, electronic device and meth...
- Patent number 6,706,422
- Issue date Mar 16, 2004
- Ebara Corporation
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and substrate plating apparatus
- Patent number 6,689,257
- Issue date Feb 10, 2004
- Ebara Corporation
- Koji Mishima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device, method for manufacturing the same, and platin...
- Publication number 20080011228
- Publication date Jan 17, 2008
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor device, method for manufacturing the same, and platin...
- Publication number 20060040487
- Publication date Feb 23, 2006
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate processing apparatus and substrate plating apparatus
- Publication number 20060027452
- Publication date Feb 9, 2006
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for forming protective film and electroless plating bath
- Publication number 20050282384
- Publication date Dec 22, 2005
- Hidemi Nawafune
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plating apparatus and method
- Publication number 20050074559
- Publication date Apr 7, 2005
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20040235237
- Publication date Nov 25, 2004
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plating solution, semiconductor device and method for manufacturing...
- Publication number 20040235298
- Publication date Nov 25, 2004
- Hiroaki Inoue
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Catalyst-imparting treatment solution and electroless plating method
- Publication number 20040186008
- Publication date Sep 23, 2004
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless Ni-B plating liquid, electronic device and method for m...
- Publication number 20040182277
- Publication date Sep 23, 2004
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless plating method and device, and substrate processing met...
- Publication number 20040170766
- Publication date Sep 2, 2004
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless plating liquid and semiconductor device
- Publication number 20040157441
- Publication date Aug 12, 2004
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate processing apparatus and substrate plating apparatus
- Publication number 20040134789
- Publication date Jul 15, 2004
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor device, method for manufacturing the same, and platin...
- Publication number 20030075808
- Publication date Apr 24, 2003
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plating apparatus and method
- Publication number 20030019426
- Publication date Jan 30, 2003
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless plating liquid and semiconductor device
- Publication number 20020185658
- Publication date Dec 12, 2002
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless Ni-B plating liquid, electronic device and method for m...
- Publication number 20020100391
- Publication date Aug 1, 2002
- Hiroaki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for forming interconnects and semiconductor device
- Publication number 20020090814
- Publication date Jul 11, 2002
- Hiroaki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate processing apparatus and substrate plating apparatus
- Publication number 20020000371
- Publication date Jan 3, 2002
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor substrate processing apparatus and method
- Publication number 20010024691
- Publication date Sep 27, 2001
- Norio Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Moriji Matsumoto

Person

Patents Grantslast 30 patents

Plating solution, semiconductor device and method for manufacturing...

Semiconductor device, method for manufacturing the same, and platin...

Substrate processing apparatus and substrate plating apparatus

Semiconductor device, method for manufacturing the same, and platin...

Electroless Ni-B plating liquid, electronic device and method for m...

Plating apparatus and method

Electroless plating liquid and semiconductor device

Electroless plating liquid and semiconductor device

Electroless Ni&#x02014;B plating liquid, electronic device and meth...

Substrate processing apparatus and substrate plating apparatus

Patents Applicationslast 30 patents

Semiconductor device, method for manufacturing the same, and platin...

Semiconductor device, method for manufacturing the same, and platin...

Substrate processing apparatus and substrate plating apparatus

Method for forming protective film and electroless plating bath

Plating apparatus and method

Semiconductor device and method for manufacturing the same

Plating solution, semiconductor device and method for manufacturing...

Catalyst-imparting treatment solution and electroless plating method

Electroless Ni-B plating liquid, electronic device and method for m...

Electroless plating method and device, and substrate processing met...

Electroless plating liquid and semiconductor device

Substrate processing apparatus and substrate plating apparatus

Semiconductor device, method for manufacturing the same, and platin...

Plating apparatus and method

Electroless plating liquid and semiconductor device

Electroless Ni-B plating liquid, electronic device and method for m...

Method for forming interconnects and semiconductor device

Substrate processing apparatus and substrate plating apparatus

Semiconductor substrate processing apparatus and method

Electroless Ni—B plating liquid, electronic device and meth...