Mostafa Aghazadeh

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid metal thermal interface material application
- Patent number 11,679,407
- Issue date Jun 20, 2023
- Intel Corporation
- Kyle Jordan Arrington
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Processor card assembly including a heat sink attachment plate and...
- Patent number 5,838,542
- Issue date Nov 17, 1998
- Intel Corporation
- Darul J. Nelson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit solder-rack interconnect module
- Patent number 5,808,875
- Issue date Sep 15, 1998
- Intel Corporation
- John Francis McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for optimizing operating parameters of an integrated circ...
- Patent number 5,621,245
- Issue date Apr 15, 1997
- Intel Corporation
- Willy Agatstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus for dissipating heat in a hinged computing device
- Patent number 5,621,613
- Issue date Apr 15, 1997
- Intel Corporation
- Kevin Haley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of optimizing operating parameters of an integrated circuit...
- Patent number 5,556,811
- Issue date Sep 17, 1996
- Intel Corporation
- Willy Agatstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dissipation of heat through keyboard using a heat pipe
- Patent number 5,513,070
- Issue date Apr 30, 1996
- Intel Corporation
- Hong Xie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heatspreader for cavity down multi-chip module with flip chip
- Patent number 5,289,337
- Issue date Feb 22, 1994
- Intel Corporation
- Mostafa Aghazadeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING
- Publication number 20240006358
- Publication date Jan 4, 2024
- Intel Corporation
- Zhihua Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL THERMAL INTERFACE MATERIAL APPLICATION
- Publication number 20210101175
- Publication date Apr 8, 2021
- Kyle Jordan Arrington
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Mostafa Aghazadeh

Person

Patents Grantslast 30 patents

Liquid metal thermal interface material application

Processor card assembly including a heat sink attachment plate and...

Integrated circuit solder-rack interconnect module

Apparatus for optimizing operating parameters of an integrated circ...

Apparatus for dissipating heat in a hinged computing device

Method of optimizing operating parameters of an integrated circuit...

Dissipation of heat through keyboard using a heat pipe

Heatspreader for cavity down multi-chip module with flip chip

Patents Applicationslast 30 patents

SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING

LIQUID METAL THERMAL INTERFACE MATERIAL APPLICATION