Motohiro Arifuku

Person

Kuki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit connection material, circuit member connecting structure an...
- Patent number 8,558,118
- Issue date Oct 15, 2013
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit connection material, circuit member connecting structure an...
- Patent number 8,541,688
- Issue date Sep 24, 2013
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit connecting material, film-form circuit connecting material...
- Patent number 8,501,045
- Issue date Aug 6, 2013
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit connection material, circuit member connecting structure an...
- Patent number 8,497,431
- Issue date Jul 30, 2013
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit connecting material, film-form circuit connecting material...
- Patent number 8,202,622
- Issue date Jun 19, 2012
- Hitachi Chemical Co., Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 8,142,605
- Issue date Mar 27, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit connecting method
- Patent number 8,132,319
- Issue date Mar 13, 2012
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring terminal-connecting adhesive
- Patent number 8,120,189
- Issue date Feb 21, 2012
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive, method of connecting wiring terminals and wiring structure
- Patent number 8,115,322
- Issue date Feb 14, 2012
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit connecting material, film-like circuit connecting material...
- Patent number 8,043,709
- Issue date Oct 25, 2011
- Hitachi Chemical Co., Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,968,196
- Issue date Jun 28, 2011
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,967,943
- Issue date Jun 28, 2011
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,879,956
- Issue date Feb 1, 2011
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring structure having a wiring-terminal-connecting adhesive compr...
- Patent number 7,777,335
- Issue date Aug 17, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,629,050
- Issue date Dec 8, 2009
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,629,056
- Issue date Dec 8, 2009
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,618,713
- Issue date Nov 17, 2009
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronic circuit including circuit-connecting material
- Patent number 7,604,868
- Issue date Oct 20, 2009
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,553,890
- Issue date Jun 30, 2009
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive, method of connecting wiring terminals and wiring structure
- Patent number 7,241,644
- Issue date Jul 10, 2007
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring-connecting material and wiring-connected board production pr...
- Patent number 7,141,645
- Issue date Nov 28, 2006
- Hitachi Chemical Company, Ltd.
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive agent, method of connecting wiring terminals and wiring st...
- Patent number 6,939,913
- Issue date Sep 6, 2005
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for repairing circuit connection part, and structure and met...
- Patent number 6,818,086
- Issue date Nov 16, 2004
- Hitachi Chemical Co., Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit connecting material, and structure and method of connecting...
- Patent number 6,777,464
- Issue date Aug 17, 2004
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring-connecting material and process for producing circuit board...
- Patent number 6,762,249
- Issue date Jul 13, 2004
- Hitachi Chemical Company, Ltd.
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, CIRCUIT C...
- Publication number 20130140083
- Publication date Jun 6, 2013
- Hitachi Chemical Company, Ltd.
- Hiroyuki Izawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL...
- Publication number 20120138868
- Publication date Jun 7, 2012
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE PARTICLES
- Publication number 20120097902
- Publication date Apr 26, 2012
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE MATERIAL REEL
- Publication number 20120015126
- Publication date Jan 19, 2012
- Hitachi Chemical Company, Ltd.
- Takashi Tatsuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE MATERIAL REEL
- Publication number 20110300326
- Publication date Dec 8, 2011
- Hitachi Chemical Company, Ltd.
- Takashi Tatsuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT ME...
- Publication number 20110267791
- Publication date Nov 3, 2011
- Hitachi Chemical Company, Ltd.
- Katsuhiko Tomisaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...
- Publication number 20110247870
- Publication date Oct 13, 2011
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...
- Publication number 20110247757
- Publication date Oct 13, 2011
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...
- Publication number 20110114893
- Publication date May 19, 2011
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE
- Publication number 20100330364
- Publication date Dec 30, 2010
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE
- Publication number 20100326596
- Publication date Dec 30, 2010
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PR...
- Publication number 20100307805
- Publication date Dec 9, 2010
- Hitachi Chemical Company, Ltd.
- Takashi Nakazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE
- Publication number 20100277884
- Publication date Nov 4, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PR...
- Publication number 20100265685
- Publication date Oct 21, 2010
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT CONNECTING METHOD
- Publication number 20100263208
- Publication date Oct 21, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER...
- Publication number 20100243303
- Publication date Sep 30, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AN...
- Publication number 20100212943
- Publication date Aug 26, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AN...
- Publication number 20100208444
- Publication date Aug 19, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT M...
- Publication number 20100139947
- Publication date Jun 10, 2010
- HITACHI CHEMICAL COMPANY, LTD.
- Kazuyoshi Kojima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FILMY ADHESIVE FOR CIRCUIT CONNECTION
- Publication number 20100140556
- Publication date Jun 10, 2010
- Hitachi Chemical Company, Ltd.
- Kazuyoshi Kojima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AN...
- Publication number 20100108365
- Publication date May 6, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT CONNECTION STRUCTURE
- Publication number 20100025097
- Publication date Feb 4, 2010
- Hitachi Chemical Company, Ltd.
- Kazuyoshi Kojima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...
- Publication number 20090321116
- Publication date Dec 31, 2009
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...
- Publication number 20080064233
- Publication date Mar 13, 2008
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...
- Publication number 20080054225
- Publication date Mar 6, 2008
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...
- Publication number 20080057742
- Publication date Mar 6, 2008
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...
- Publication number 20070299172
- Publication date Dec 27, 2007
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Wiring-connecting material and wiring-connected board production pr...
- Publication number 20060252843
- Publication date Nov 9, 2006
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Circuit connecting material, film-like circuit connecting material...
- Publication number 20060100314
- Publication date May 11, 2006
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic circuit including circuit-connecting material
- Publication number 20060060969
- Publication date Mar 23, 2006
- Hitachi Chemical Co., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Motohiro Arifuku

Person

Patents Grantslast 30 patents

Circuit connection material, circuit member connecting structure an...

Circuit connection material, circuit member connecting structure an...

Circuit connecting material, film-form circuit connecting material...

Circuit connection material, circuit member connecting structure an...

Circuit connecting material, film-form circuit connecting material...

Circuit-connecting material and circuit terminal connected structur...

Circuit connecting method

Wiring terminal-connecting adhesive

Adhesive, method of connecting wiring terminals and wiring structure

Circuit connecting material, film-like circuit connecting material...

Circuit-connecting material and circuit terminal connected structur...

Circuit-connecting material and circuit terminal connected structur...

Circuit-connecting material and circuit terminal connected structur...

Wiring structure having a wiring-terminal-connecting adhesive compr...

Circuit-connecting material and circuit terminal connected structur...

Circuit-connecting material and circuit terminal connected structur...

Circuit-connecting material and circuit terminal connected structur...

Electronic circuit including circuit-connecting material

Circuit-connecting material and circuit terminal connected structur...

Adhesive, method of connecting wiring terminals and wiring structure

Wiring-connecting material and wiring-connected board production pr...

Adhesive agent, method of connecting wiring terminals and wiring st...

Method for repairing circuit connection part, and structure and met...

Circuit connecting material, and structure and method of connecting...

Wiring-connecting material and process for producing circuit board...

Patents Applicationslast 30 patents

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, CIRCUIT C...

CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL...

ANISOTROPIC CONDUCTIVE PARTICLES

ADHESIVE MATERIAL REEL

ADHESIVE MATERIAL REEL

CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT ME...

CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...

CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...

ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE

ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE

CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PR...

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE

WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PR...

CIRCUIT CONNECTING METHOD

CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER...

CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AN...

CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AN...

CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT M...

FILMY ADHESIVE FOR CIRCUIT CONNECTION

CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AN...

CIRCUIT CONNECTION STRUCTURE

CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...

Wiring-connecting material and wiring-connected board production pr...

Circuit connecting material, film-like circuit connecting material...

Electronic circuit including circuit-connecting material