Mu-Hsuan Chan

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of electronic package
- Patent number 10,403,567
- Issue date Sep 3, 2019
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 9,899,303
- Issue date Feb 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating package structure
- Patent number 9,768,140
- Issue date Sep 19, 2017
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 9,754,898
- Issue date Sep 5, 2017
- Siliconware Precision Industries Co., Ltd.
- Mu-Hsuan Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive via structure and fabrication method thereof
- Patent number 9,607,941
- Issue date Mar 28, 2017
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,515,040
- Issue date Dec 6, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 9,418,874
- Issue date Aug 16, 2016
- Siliconware Precision Industries Co., Ltd.
- Wan-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor structure having conductive b...
- Patent number 9,349,705
- Issue date May 24, 2016
- Siliconware Precision Industries Co., Ltd.
- Chien-Feng Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 9,337,061
- Issue date May 10, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,087,780
- Issue date Jul 21, 2015
- Siliconware Precision Industries Co., Ltd.
- Wan-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump structure with a plurality of metal layers
- Patent number 8,952,537
- Issue date Feb 10, 2015
- Siliconware Precision Industries Co., Ltd.
- Chien-Feng Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,829,687
- Issue date Sep 9, 2014
- Siliconware Precision Industries Co., Ltd.
- Mu-Hsuan Chan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF ELECTRONIC PACKAGE
- Publication number 20180130727
- Publication date May 10, 2018
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160111359
- Publication date Apr 21, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING PACKAGE STRUCTURE
- Publication number 20160049376
- Publication date Feb 18, 2016
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160013146
- Publication date Jan 14, 2016
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE VIA STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150294938
- Publication date Oct 15, 2015
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20150255311
- Publication date Sep 10, 2015
- Siliconware Precision Industries Co., Ltd.
- Wan-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20150162301
- Publication date Jun 11, 2015
- Siliconware Precision Industries Co., Ltd.
- Huei-Nuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE B...
- Publication number 20150155258
- Publication date Jun 4, 2015
- Siliconware Precision Industries Co., Ltd.
- Chien-Feng Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20140342505
- Publication date Nov 20, 2014
- Siliconware Precision Industries Co., Ltd.
- Yan-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140084455
- Publication date Mar 27, 2014
- Siliconware Precision Industries Co., Ltd.
- Mu-Hsuan Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140084484
- Publication date Mar 27, 2014
- Mu-Hsuan Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140027926
- Publication date Jan 30, 2014
- Siliconware Precision Industries Co., Ltd.
- Wang-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUMP STRUCTURE AND METHOD OF FABRICATING A SEMICONDUCTOR...
- Publication number 20140008787
- Publication date Jan 9, 2014
- Siliconware Precision Industries Co., Ltd.
- Chien-Feng Chan
- H01 - BASIC ELECTRIC ELEMENTS

Mu-Hsuan Chan

Person

Patents Grantslast 30 patents

Fabrication method of electronic package

Electronic package and fabrication method thereof

Method for fabricating package structure

Semiconductor package and fabrication method thereof

Conductive via structure and fabrication method thereof

Package structure and fabrication method thereof

Method of fabricating semiconductor package

Method of fabricating a semiconductor structure having conductive b...

Fabrication method of semiconductor package

Semiconductor package and method of fabricating the same

Conductive bump structure with a plurality of metal layers

Semiconductor package and fabrication method thereof

Patents Applicationslast 30 patents

FABRICATION METHOD OF ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

METHOD FOR FABRICATING PACKAGE STRUCTURE

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

CONDUCTIVE VIA STRUCTURE AND FABRICATION METHOD THEREOF

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

METHOD OF FABRICATING A SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE B...

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

CONDUCTIVE BUMP STRUCTURE AND METHOD OF FABRICATING A SEMICONDUCTOR...