Mu Hwan Seo

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Aspen Heights, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having reduced thickness
- Patent number 7,321,162
- Issue date Jan 22, 2008
- Amkor Technology, Inc.
- Tae Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having reduced thickness
- Patent number 7,115,445
- Issue date Oct 3, 2006
- Amkor Technology, Inc.
- Tae Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe and semiconductor package with improved solder joint stre...
- Patent number 7,102,208
- Issue date Sep 5, 2006
- Amkor Technology, Inc.
- Tae Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having reduced thickness
- Patent number 6,696,747
- Issue date Feb 24, 2004
- Amkor Technology, Inc.
- Tae Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having increased moisture path and increased s...
- Patent number 6,525,406
- Issue date Feb 25, 2003
- Amkor Technology, Inc.
- Young Suk Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a semiconductor package having improved defect te...
- Patent number 6,475,827
- Issue date Nov 5, 2002
- Amkor Technology, Inc.
- Tae Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package Having Reduced Thickness
- Publication number 20080283979
- Publication date Nov 20, 2008
- Tae Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having reduced thickness
- Publication number 20040150086
- Publication date Aug 5, 2004
- Tae Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS