Mudasir Ahmad

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heat activated multiphase fluid-operated pump for motor temperature...
- Patent number 12,142,749
- Issue date Nov 12, 2024
- Hamfop Technologies LLC
- Mudasir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-activated pump with integrated evaporator for electronic chip...
- Patent number 12,133,363
- Issue date Oct 29, 2024
- Hamfop Technologies LLC
- Mudasir Ahmad
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat activated multiphase fluid-operated pump for battery temperatu...
- Patent number 11,990,598
- Issue date May 21, 2024
- Hamfop Technologies LLC
- Mudasir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-activated multiphase fluid-operated pump
- Patent number 11,898,578
- Issue date Feb 13, 2024
- Hamfop Technologies LLC
- Mudasir Ahmad
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Heat-activated multiphase fluid-operated pump for geothermal temper...
- Patent number 11,874,022
- Issue date Jan 16, 2024
- Hamfop Technologies LLC
- Mudasir Ahmad
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Heat-activated multiphase fluid-operated pump for electronics waste...
- Patent number 11,737,240
- Issue date Aug 22, 2023
- Hamfop Technologies LLC
- Mudasir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener for providing uniformity in microelectronic packages
- Patent number 10,468,318
- Issue date Nov 5, 2019
- Cisco Technology, Inc.
- Mudasir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation in hermetically-sealed packaged devices
- Patent number 10,260,782
- Issue date Apr 16, 2019
- Cisco Technology, Inc.
- Jovica Savic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to prevent laser kink failures
- Patent number 10,230,212
- Issue date Mar 12, 2019
- Cisco Technology, Inc.
- Mudasir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser with pre-distorted grating
- Patent number 10,186,839
- Issue date Jan 22, 2019
- Cisco Technology, Inc.
- Chiyu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation in hermetically-sealed packaged devices
- Patent number 9,688,453
- Issue date Jun 27, 2017
- Cisco Technology, Inc.
- Jovica Savic
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Electronic devices mounted on multiple substrates
- Patent number 9,204,548
- Issue date Dec 1, 2015
- Cisco Technology, Inc.
- Mudasir Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Real time strain sensing solution
- Patent number 9,086,267
- Issue date Jul 21, 2015
- Cisco Technology, Inc.
- Mudasir Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for supporting a computer chip on a printed ci...
- Patent number 8,962,388
- Issue date Feb 24, 2015
- Cisco Technology, Inc.
- Mohan R. Nagar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package lid configured for package coplanarity
- Patent number 8,952,523
- Issue date Feb 10, 2015
- Cisco Technology, Inc.
- Mudasir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid for an electrical hardware component
- Patent number 8,736,044
- Issue date May 27, 2014
- Cisco Technology, Inc.
- Mudasir Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for supporting a computer chip on a printed ci...
- Patent number 8,081,484
- Issue date Dec 20, 2011
- Cisco Technology, Inc.
- Mohan R. Nagar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive dome probes for measuring system level multi-GHZ signals
- Patent number 7,797,663
- Issue date Sep 14, 2010
- Cisco Technology, Inc.
- Steven C. Bird
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for strain monitoring of printed circuit board...
- Patent number 7,621,190
- Issue date Nov 24, 2009
- Cisco Technology, Inc.
- Mudasir Ahmad
- G01 - MEASURING TESTING
Information Patent Grant
Techniques for providing electrical and thermal conductivity betwee...
- Patent number 7,604,491
- Issue date Oct 20, 2009
- Cisco Technology, Inc.
- Mudasir Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device, apparatus, method and assembly for coupling an electrical c...
- Patent number 7,277,297
- Issue date Oct 2, 2007
- Cisco Technology, Inc.
- Mudasir Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for thermally coupling a heat sink to a circu...
- Patent number 7,019,976
- Issue date Mar 28, 2006
- Cisco Technology, Inc.
- Mudasir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for cooling a circuit board component
- Patent number 6,728,104
- Issue date Apr 27, 2004
- Cisco Technology, Inc.
- Mudasir Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STIFFENER FOR PROVIDING UNIFORMITY IN MICROELECTRONIC PACKAGES
- Publication number 20190237371
- Publication date Aug 1, 2019
- Cisco Technology, Inc.
- Mudasir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO PREVENT LASER KINK FAILURES
- Publication number 20190207363
- Publication date Jul 4, 2019
- Cisco Technology, Inc.
- Mudasir Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION IN HERMETICALLY-SEALED PACKAGED DEVICES
- Publication number 20170234584
- Publication date Aug 17, 2017
- Cisco Technology, Inc.
- Jovica Savic
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Heat Dissipation in Hermetically-Sealed Packaged Devices
- Publication number 20160229618
- Publication date Aug 11, 2016
- Cisco Technology, Inc.
- Jovica Savic
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHOD AND APPARATUS FOR SUPPORTING A COMPUTER CHIP ON A PRINTED CI...
- Publication number 20150173177
- Publication date Jun 18, 2015
- Cisco Technology, Inc.
- Mohan R. Nagar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Real Time Strain Sensing Solution
- Publication number 20150059487
- Publication date Mar 5, 2015
- Cisco Technology, Inc.
- Mudasir Ahmad
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM IN PACKAGE MODULE ASSEMBLY
- Publication number 20130284796
- Publication date Oct 31, 2013
- Cisco Technology, Inc.
- Mohan R. Nagar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES MOUNTED ON MULTIPLE SUBSTRATES
- Publication number 20130242496
- Publication date Sep 19, 2013
- Cisco Technology, Inc.
- Mudasir Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR SUPPORTING A COMPUTER CHIP ON A PRINTED CI...
- Publication number 20120113608
- Publication date May 10, 2012
- Cisco Technology, Inc.
- Mohan R. Nagar
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated Circuit Package Lid Configured For Package Coplanarity
- Publication number 20120074557
- Publication date Mar 29, 2012
- Cisco Technology, Inc.
- Mudasir Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID FOR AN ELECTRICAL HARDWARE COMPONENT
- Publication number 20120018872
- Publication date Jan 26, 2012
- Mudasir Ahmad
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ATTACHING A LEAD-FREE COMPONENT TO A PRINTED CIRCUIT BOARD UNDER LE...
- Publication number 20090310318
- Publication date Dec 17, 2009
- Cisco Technology, Inc.
- Mudasir Ahmad
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE DOME PROBES FOR MEASURING SYSTEM LEVEL MULTI-GHZ SIGNALS
- Publication number 20080250377
- Publication date Oct 9, 2008
- Steven C. Bird
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and apparatus for supporting a computer chip on a printed ci...
- Publication number 20080130241
- Publication date Jun 5, 2008
- Cisco Technology, Inc.
- Mohan R. Nagar
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and apparatus for strain monitoring of printed circuit board...
- Publication number 20070205791
- Publication date Sep 6, 2007
- Cisco Technology, Inc.
- Mudasir Ahmad
- G01 - MEASURING TESTING
Information Patent Application
Device, apparatus, method and assembly for coupling an electrical c...
- Publication number 20060193118
- Publication date Aug 31, 2006
- Mudasir Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Mudasir Ahmad

Person

Patents Grantslast 30 patents

Heat activated multiphase fluid-operated pump for motor temperature...

Heat-activated pump with integrated evaporator for electronic chip...

Heat activated multiphase fluid-operated pump for battery temperatu...

Heat-activated multiphase fluid-operated pump

Heat-activated multiphase fluid-operated pump for geothermal temper...

Heat-activated multiphase fluid-operated pump for electronics waste...

Stiffener for providing uniformity in microelectronic packages

Heat dissipation in hermetically-sealed packaged devices

Method and apparatus to prevent laser kink failures

Laser with pre-distorted grating

Heat dissipation in hermetically-sealed packaged devices

Electronic devices mounted on multiple substrates

Real time strain sensing solution

Method and apparatus for supporting a computer chip on a printed ci...

Integrated circuit package lid configured for package coplanarity

Lid for an electrical hardware component

Method and apparatus for supporting a computer chip on a printed ci...

Conductive dome probes for measuring system level multi-GHZ signals

Method and apparatus for strain monitoring of printed circuit board...

Techniques for providing electrical and thermal conductivity betwee...

Device, apparatus, method and assembly for coupling an electrical c...

Methods and apparatus for thermally coupling a heat sink to a circu...

Methods and apparatus for cooling a circuit board component

Patents Applicationslast 30 patents

STIFFENER FOR PROVIDING UNIFORMITY IN MICROELECTRONIC PACKAGES

METHOD AND APPARATUS TO PREVENT LASER KINK FAILURES

HEAT DISSIPATION IN HERMETICALLY-SEALED PACKAGED DEVICES

Heat Dissipation in Hermetically-Sealed Packaged Devices

METHOD AND APPARATUS FOR SUPPORTING A COMPUTER CHIP ON A PRINTED CI...

Real Time Strain Sensing Solution

SYSTEM IN PACKAGE MODULE ASSEMBLY

ELECTRONIC DEVICES MOUNTED ON MULTIPLE SUBSTRATES

METHOD AND APPARATUS FOR SUPPORTING A COMPUTER CHIP ON A PRINTED CI...

Integrated Circuit Package Lid Configured For Package Coplanarity

LID FOR AN ELECTRICAL HARDWARE COMPONENT

ATTACHING A LEAD-FREE COMPONENT TO A PRINTED CIRCUIT BOARD UNDER LE...

CONDUCTIVE DOME PROBES FOR MEASURING SYSTEM LEVEL MULTI-GHZ SIGNALS

Method and apparatus for supporting a computer chip on a printed ci...

Method and apparatus for strain monitoring of printed circuit board...

Device, apparatus, method and assembly for coupling an electrical c...