Mukul P. Renavikar

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
BGA STIM package architecture for high performance systems
- Patent number 11,817,364
- Issue date Nov 14, 2023
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 10,049,971
- Issue date Aug 14, 2018
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 9,613,933
- Issue date Apr 4, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of adding dopants to conductive interconnect structures in...
- Patent number 9,394,619
- Issue date Jul 19, 2016
- Intel Corporation
- Rajen S. Sidhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solder deposition and thermal processing of thin-die thermal interf...
- Patent number 8,733,620
- Issue date May 27, 2014
- Intel Corporation
- Mukul Renavikar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate metallization and ball attach metallurgy with a novel dop...
- Patent number 8,701,281
- Issue date Apr 22, 2014
- Intel Corporation
- Rajen S. Sidhu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint reliability in microelectronic packaging
- Patent number 8,436,470
- Issue date May 7, 2013
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming a semiconductor package including a thermal interface material
- Patent number 8,409,929
- Issue date Apr 2, 2013
- Intel Corporation
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a semiconductor package including a thermal interface material
- Patent number 8,030,757
- Issue date Oct 4, 2011
- Intel Corporation
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joint reliability in microelectronic packaging
- Patent number 8,018,063
- Issue date Sep 13, 2011
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint reliability in microelectronic packaging
- Patent number 7,700,476
- Issue date Apr 20, 2010
- Intel Corporation
- Daewoong Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrating a heat spreader with an interface material having reduc...
- Patent number 7,553,702
- Issue date Jun 30, 2009
- Intel Corporation
- Thomas J Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader with intermetallic layer and method for ma...
- Patent number 7,485,495
- Issue date Feb 3, 2009
- Intel Corporation
- Mukul P. Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader and method for using
- Patent number 7,239,517
- Issue date Jul 3, 2007
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer memory device with electron traps
- Patent number 7,205,595
- Issue date Apr 17, 2007
- Intel Corporation
- Mukul P. Renavikar
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated heat spreader with intermetallic layer and method for ma...
- Patent number 7,183,641
- Issue date Feb 27, 2007
- Intel Corporation
- Mukul P. Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming an intermediate layer in interconnect joints and structures...
- Patent number 7,087,521
- Issue date Aug 8, 2006
- Intel Corporation
- Mukul P. Renavikar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR A SILICON DIE PREPARATION INCLUDING AUXETI...
- Publication number 20240222182
- Publication date Jul 4, 2024
- Intel Corporation
- Amey Anant Apte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS
- Publication number 20240030086
- Publication date Jan 25, 2024
- Intel Corporation
- Rajasekaran SWAMINATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS
- Publication number 20190393121
- Publication date Dec 26, 2019
- Rajasekaran SWAMINATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSIVE COMPOSITE FILM FOR APPLICATION TO THE BACKSIDE OF A MI...
- Publication number 20190057936
- Publication date Feb 21, 2019
- Intel Corporation
- Mohit GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20170207152
- Publication date Jul 20, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ON SUBSTRATE PACKAGE
- Publication number 20170053858
- Publication date Feb 23, 2017
- Intel Corporation
- Jan Krajniak
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20150255415
- Publication date Sep 10, 2015
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ADDING DOPANTS TO CONDUCTIVE INTERCONNECT STRUCTURES IN...
- Publication number 20140268534
- Publication date Sep 18, 2014
- Rajen S. Sidhu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SOLDER PASTE MATERIAL TECHNOLOGY FOR ELIMINATION OF HIGH WARPAGE SU...
- Publication number 20140175160
- Publication date Jun 26, 2014
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Forming A Semiconductor Package Including A Thermal Interface Material
- Publication number 20110312131
- Publication date Dec 22, 2011
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE METALLIZATION AND BALL ATTACH METALLURGY WITH A NOVEL DOP...
- Publication number 20110147066
- Publication date Jun 23, 2011
- Rajen S. Sidhu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING
- Publication number 20110051376
- Publication date Mar 3, 2011
- INTEL, INC.
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING
- Publication number 20100044848
- Publication date Feb 25, 2010
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Forming a semiconductor package including a thermal interface material
- Publication number 20090001557
- Publication date Jan 1, 2009
- Mukul Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder joint reliability in microelectronic packaging
- Publication number 20080115968
- Publication date May 22, 2008
- Daewoong Suh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Microelectronic package and method of forming same
- Publication number 20070228111
- Publication date Oct 4, 2007
- Ganesh V. Vasudevanpillai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED HEAT SPREADER AND METHOD FOR USING
- Publication number 20070206356
- Publication date Sep 6, 2007
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder deposition and thermal processing of thin-die thermal interf...
- Publication number 20070131737
- Publication date Jun 14, 2007
- Intel Corporation
- Mukul Renavikar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED HEAT SPREADER WITH INTERMETALLIC LAYER AND METHOD FOR MA...
- Publication number 20070117270
- Publication date May 24, 2007
- Mukul P. Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated heat spreader and method for using
- Publication number 20060227510
- Publication date Oct 12, 2006
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated heat spreader with intermetallic layer and method for ma...
- Publication number 20060220226
- Publication date Oct 5, 2006
- Intel Corporation
- Mukul P. Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING AN INTERMEDIATE LAYER IN INTERCONNECT JOINTS AND STRUCTURES...
- Publication number 20060110916
- Publication date May 25, 2006
- Mukul P. Renavikar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Creation of electron traps in metal nitride and metal oxide electro...
- Publication number 20050227377
- Publication date Oct 13, 2005
- Mukul P. Renavikar
- G11 - INFORMATION STORAGE

Mukul P. Renavikar

Person

Patents Grantslast 30 patents

BGA STIM package architecture for high performance systems

Package structure to enhance yield of TMI interconnections

Package structure to enhance yield of TMI interconnections

Methods of adding dopants to conductive interconnect structures in...

Solder deposition and thermal processing of thin-die thermal interf...

Substrate metallization and ball attach metallurgy with a novel dop...

Solder joint reliability in microelectronic packaging

Forming a semiconductor package including a thermal interface material

Forming a semiconductor package including a thermal interface material

Solder joint reliability in microelectronic packaging

Solder joint reliability in microelectronic packaging

Integrating a heat spreader with an interface material having reduc...

Integrated heat spreader with intermetallic layer and method for ma...

Integrated heat spreader and method for using

Polymer memory device with electron traps

Integrated heat spreader with intermetallic layer and method for ma...

Forming an intermediate layer in interconnect joints and structures...

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR A SILICON DIE PREPARATION INCLUDING AUXETI...

BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS

BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS

TRANSMISSIVE COMPOSITE FILM FOR APPLICATION TO THE BACKSIDE OF A MI...

Package Structure To Enhance Yield of TMI Interconnections

SUBSTRATE ON SUBSTRATE PACKAGE

Package Structure To Enhance Yield of TMI Interconnections

METHODS OF ADDING DOPANTS TO CONDUCTIVE INTERCONNECT STRUCTURES IN...

SOLDER PASTE MATERIAL TECHNOLOGY FOR ELIMINATION OF HIGH WARPAGE SU...

Forming A Semiconductor Package Including A Thermal Interface Material

SUBSTRATE METALLIZATION AND BALL ATTACH METALLURGY WITH A NOVEL DOP...

SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING

SOLDER JOINT RELIABILITY IN MICROELECTRONIC PACKAGING

Forming a semiconductor package including a thermal interface material

Solder joint reliability in microelectronic packaging

Microelectronic package and method of forming same

INTEGRATED HEAT SPREADER AND METHOD FOR USING

Solder deposition and thermal processing of thin-die thermal interf...

INTEGRATED HEAT SPREADER WITH INTERMETALLIC LAYER AND METHOD FOR MA...

Integrated heat spreader and method for using

Integrated heat spreader with intermetallic layer and method for ma...

FORMING AN INTERMEDIATE LAYER IN INTERCONNECT JOINTS AND STRUCTURES...

Creation of electron traps in metal nitride and metal oxide electro...