Mun Leong LOKE

Person

Bukit Mertajam, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Flip chip assembly process for ultra thin substrate and package on...
- Patent number 9,397,016
- Issue date Jul 19, 2016
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly process for ultra thin substrate and package on...
- Patent number 8,847,368
- Issue date Sep 30, 2014
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly process for ultra thin substrate and package on...
- Patent number 8,258,019
- Issue date Sep 4, 2012
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package warpage control
- Patent number 7,208,342
- Issue date Apr 24, 2007
- Intel Corporation
- Michael Keat Lye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of thinning a wafer utilizing a laminated reinforcing layer...
- Patent number 6,713,366
- Issue date Mar 30, 2004
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP CARRIER HAVING VARIABLY-SIZED PADS
- Publication number 20170170108
- Publication date Jun 15, 2017
- Intel Corporation
- Chee Ling WONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...
- Publication number 20150076692
- Publication date Mar 19, 2015
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...
- Publication number 20120319276
- Publication date Dec 20, 2012
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...
- Publication number 20090321928
- Publication date Dec 31, 2009
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded flip chip package with enhanced mold-die adhesion
- Publication number 20090309238
- Publication date Dec 17, 2009
- Mun Leong Loke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WARPAGE CONTROL
- Publication number 20070205501
- Publication date Sep 6, 2007
- Intel Corporation
- Michael Keat Lye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WARPAGE CONTROL
- Publication number 20070155059
- Publication date Jul 5, 2007
- Intel Corporation
- Michael Keat Lye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package warpage control
- Publication number 20050266607
- Publication date Dec 1, 2005
- Intel Corporation
- Michael Keat Lye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF THINNING A WAFER UTILIZING A LAMINATED REINFORCING LAYER...
- Publication number 20030235937
- Publication date Dec 25, 2003
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS

Mun Leong LOKE

Person

Patents Grantslast 30 patents

Flip chip assembly process for ultra thin substrate and package on...

Flip chip assembly process for ultra thin substrate and package on...

Flip chip assembly process for ultra thin substrate and package on...

Package warpage control

Method of thinning a wafer utilizing a laminated reinforcing layer...

Patents Applicationslast 30 patents

CHIP CARRIER HAVING VARIABLY-SIZED PADS

FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...

FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...

FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...

Molded flip chip package with enhanced mold-die adhesion

PACKAGE WARPAGE CONTROL

PACKAGE WARPAGE CONTROL

Package warpage control

METHOD OF THINNING A WAFER UTILIZING A LAMINATED REINFORCING LAYER...