Munekazu Tanaka

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of mounting semiconductor device
- Patent number 5,431,863
- Issue date Jul 11, 1995
- Nitto Denko Corporation
- Amane Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed substrate
- Patent number 5,374,469
- Issue date Dec 20, 1994
- Nitto Denko Corporation
- Atsushi Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, film carrier, semiconductor device made by using...
- Patent number 5,072,289
- Issue date Dec 10, 1991
- Nitto Denko Corporation
- Masakazu Sugimoto
- H01 - BASIC ELECTRIC ELEMENTS