Claims
- 1. A method of mounting a semiconductor device on an outer substrate comprising the steps of:
- providing said semiconductor device comprising a film carrier, said film carrier comprising an insulating film having a bonding area and a connecting lead on one surface thereof to be in contact with a land on said outer substrate, and a semiconductor element junctioned with said film carrier; and
- mounting said semiconductor device on said substrate by:
- forming at least one opening in said insulating film within said bonding area and in an area near said bonding area; and
- electrically connecting said connecting lead to said land on said outer substrate by forcing an adhesive through said opening formed in said bonding area and in said area near said bonding area of said insulating film to bond said insulating film to said outer substrate, wherein said adhesive has a glass transition temperature of 150.degree. C. or lower.
- 2. A method as claimed in claim 1, wherein said opening is an aperture formed in said insulating film proximal said connecting lead.
- 3. A method as claimed in claim 1, wherein said insulating film has a layer of adhesive on a surface opposite said connecting lead.
- 4. A method as claimed in claim 1, wherein said insulating film is a polyimide film.
- 5. A method as claimed in claim 3, wherein said adhesive is forced into said opening in said insulating film by heat-pressing.
- 6. A method as claimed in claim 1, wherein said adhesive is forced into said opening in said insulating film by injection.
- 7. A method as claimed in claim 1, wherein said opening is formed by irradiation by a laser.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3-027871 |
Jan 1991 |
JPX |
|
Parent Case Info
This is a Continuation of application Ser. No. 07/826,417, filed Jan. 27, 1992, now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4017495 |
Jaffe et al. |
Apr 1977 |
|
4746392 |
Hoppe |
May 1988 |
|
Continuations (1)
|
Number |
Date |
Country |
Parent |
826417 |
Jan 1992 |
|