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Munenori Hidaka

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  • Miyazaki, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of forming dummy wafer
    • Patent number 7,060,622
    • Issue date Jun 13, 2006
    • Oki Electric Industry Co., Ltd.
    • Yuichiro Miyamori
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    ETCHING METHOD
    • Publication number 20070167011
    • Publication date Jul 19, 2007
    • Oki Electric Industry Co., Ltd.
    • Munenori HIDAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of forming dummy wafer
    • Publication number 20040063324
    • Publication date Apr 1, 2004
    • Yuichiro Miyamori
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...