Murali K. Narasimhan

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Side storage pods, equipment front end modules, and methods for ope...
- Patent number 11,749,537
- Issue date Sep 5, 2023
- Applied Materials, Inc.
- Patrick Pannese
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Oxidation inhibiting gas in a manufacturing system
- Patent number 11,569,102
- Issue date Jan 31, 2023
- Applied Materials, Inc.
- Murali Narasimhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High flow velocity, gas-purged, side storage pod apparatus, assembl...
- Patent number 11,244,844
- Issue date Feb 8, 2022
- Applied Materials, Inc.
- Paul B. Reuter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BEOL interconnect with carbon nanotubes
- Patent number 9,305,838
- Issue date Apr 5, 2016
- Applied Materials, Inc.
- Pravin K. Narwankar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Cobalt deposition on barrier surfaces
- Patent number 9,209,074
- Issue date Dec 8, 2015
- Applied Materials, Inc.
- Jiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt deposition on barrier surfaces
- Patent number 9,051,641
- Issue date Jun 9, 2015
- Applied Materials, Inc.
- Jiang Lu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High temperature tungsten metallization process
- Patent number 8,835,311
- Issue date Sep 16, 2014
- Applied Materials, Inc.
- Joshua Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu surface plasma treatment to improve gapfill window
- Patent number 8,764,961
- Issue date Jul 1, 2014
- Applied Materials, Inc.
- Qian Luo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods for contact clean
- Patent number 8,642,473
- Issue date Feb 4, 2014
- Applied Materials, Inc.
- Mei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature tungsten metallization process
- Patent number 8,617,985
- Issue date Dec 31, 2013
- Applied Materials, Inc.
- Joshua Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for integrating sheet resistance measurements...
- Patent number 7,050,160
- Issue date May 23, 2006
- KLA-Tencor Technologies Corporation
- Walter H. Johnson
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus of forming a sputtered doped seed layer
- Patent number 6,432,819
- Issue date Aug 13, 2002
- Applied Materials, Inc.
- Vikram Pavate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of enhancing hardness of sputter deposited copper films
- Patent number 6,391,163
- Issue date May 21, 2002
- Applied Materials, Inc.
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of improving adhesion of diffusion layers on fluorinated sil...
- Patent number 6,372,301
- Issue date Apr 16, 2002
- Applied Materials, Inc.
- Murali Narasimhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil for sputter deposition
- Patent number 6,315,872
- Issue date Nov 13, 2001
- Applied Materials, Inc.
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
External coating of tungsten or tantalum or other refractory metal...
- Patent number 6,277,253
- Issue date Aug 21, 2001
- Applied Materials, Inc.
- Murali Narasimhan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing metal sputtering target for use in DC magn...
- Patent number 6,228,186
- Issue date May 8, 2001
- Applied Materials, Inc.
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Target for use in magnetron sputtering of aluminum for forming meta...
- Patent number 6,171,455
- Issue date Jan 9, 2001
- Applied Materials Inc.
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper target for sputter deposition
- Patent number 6,139,701
- Issue date Oct 31, 2000
- Applied Materials, Inc.
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Target for use in magnetron sputtering of aluminum for forming meta...
- Patent number 6,126,791
- Issue date Oct 3, 2000
- Applied Materials, Inc.
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pedestal insulator for a pre-clean chamber
- Patent number 6,077,353
- Issue date Jun 20, 2000
- Applied Materials, Inc.
- Mohamed A. Al-Sharif
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustment of deposition uniformity in an inductively coupled plasm...
- Patent number 6,042,700
- Issue date Mar 28, 2000
- Applied Materials, Inc.
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Target for use in magnetron sputtering of aluminum for forming meta...
- Patent number 6,001,227
- Issue date Dec 14, 1999
- Applied Materials, Inc.
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Continuous process for forming improved titanium nitride barrier la...
- Patent number 5,972,178
- Issue date Oct 26, 1999
- Applied Materials, Inc.
- Murali K. Narasimhan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
OXIDATION INHIBITING GAS IN A MANUFACTURING SYSTEM
- Publication number 20210257233
- Publication date Aug 19, 2021
- Applied Materials, Inc.
- Murali Narasimhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FLOW VELOCITY, GAS-PURGED, SIDE STORAGE POD APPARATUS, ASSEMBL...
- Publication number 20200135521
- Publication date Apr 30, 2020
- Applied Materials, Inc.
- Paul B. Reuter
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
SIDE STORAGE PODS, EQUIPMENT FRONT END MODULES, AND METHODS FOR OPE...
- Publication number 20200135499
- Publication date Apr 30, 2020
- Applied Materials, Inc.
- Patrick Pannese
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
COBALT DEPOSITION ON BARRIER SURFACES
- Publication number 20150255333
- Publication date Sep 10, 2015
- APPLIED MATERIALS, INC.
- Jiang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE TUNGSTEN METALLIZATION PROCESS
- Publication number 20140187038
- Publication date Jul 3, 2014
- Applied Materials, Inc.
- Joshua COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PROVIDING PLASMA TO A PROCESS CHAMBER
- Publication number 20140165911
- Publication date Jun 19, 2014
- Applied Materials, Inc.
- CHIEN-TEH KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL Interconnect With Carbon Nanotubes
- Publication number 20130228933
- Publication date Sep 5, 2013
- Applied Materials, Inc.
- Pravin K. Narwankar
- B82 - NANO-TECHNOLOGY
Information Patent Application
HIGH TEMPERATURE TUNGSTEN METALLIZATION PROCESS
- Publication number 20130109172
- Publication date May 2, 2013
- JOSHUA COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU CLEAN PROCESS FOR METAL DEPOSITION CHAMBERS
- Publication number 20120237693
- Publication date Sep 20, 2012
- Applied Materials, Inc.
- Michael Jackson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR CONTACT CLEAN
- Publication number 20120225558
- Publication date Sep 6, 2012
- Applied Materials, Inc.
- MEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-CLEAN CHAMBER WITH REDUCED ION CURRENT
- Publication number 20110315319
- Publication date Dec 29, 2011
- Applied Materials, Inc.
- JOHN C. FORSTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU SURFACE PLASMA TREATMENT TO IMPROVE GAPFILL WINDOW
- Publication number 20100096273
- Publication date Apr 22, 2010
- Applied Materials, Inc.
- Qian Luo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COBALT DEPOSITION ON BARRIER SURFACES
- Publication number 20090053426
- Publication date Feb 26, 2009
- JIANG LU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus of forming a sputtered doped seed layer
- Publication number 20020182887
- Publication date Dec 5, 2002
- APPLIED MATERIALS, INC.
- Vikram Pavate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion of diffusion barrier and fluorinated silicon dioxide using...
- Publication number 20020102365
- Publication date Aug 1, 2002
- APPLIED MATERIALS, INC.
- Murali Narasimhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of metallization using a nickel-vanadium layer
- Publication number 20020093101
- Publication date Jul 18, 2002
- Subramoney Iyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of enhancing hardness of sputter deposited copper films
- Publication number 20020088716
- Publication date Jul 11, 2002
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Coil for sputter deposition
- Publication number 20020047116
- Publication date Apr 25, 2002
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Murali K. Narasimhan

Person

Patents Grantslast 30 patents

Side storage pods, equipment front end modules, and methods for ope...

Oxidation inhibiting gas in a manufacturing system

High flow velocity, gas-purged, side storage pod apparatus, assembl...

BEOL interconnect with carbon nanotubes

Cobalt deposition on barrier surfaces

Cobalt deposition on barrier surfaces

High temperature tungsten metallization process

Cu surface plasma treatment to improve gapfill window

Methods for contact clean

High temperature tungsten metallization process

Process and apparatus for integrating sheet resistance measurements...

Method and apparatus of forming a sputtered doped seed layer

Method of enhancing hardness of sputter deposited copper films

Method of improving adhesion of diffusion layers on fluorinated sil...

Coil for sputter deposition

External coating of tungsten or tantalum or other refractory metal...

Method for manufacturing metal sputtering target for use in DC magn...

Target for use in magnetron sputtering of aluminum for forming meta...

Copper target for sputter deposition

Target for use in magnetron sputtering of aluminum for forming meta...

Pedestal insulator for a pre-clean chamber

Adjustment of deposition uniformity in an inductively coupled plasm...

Target for use in magnetron sputtering of aluminum for forming meta...

Continuous process for forming improved titanium nitride barrier la...

Patents Applicationslast 30 patents

OXIDATION INHIBITING GAS IN A MANUFACTURING SYSTEM

HIGH FLOW VELOCITY, GAS-PURGED, SIDE STORAGE POD APPARATUS, ASSEMBL...

SIDE STORAGE PODS, EQUIPMENT FRONT END MODULES, AND METHODS FOR OPE...

COBALT DEPOSITION ON BARRIER SURFACES

HIGH TEMPERATURE TUNGSTEN METALLIZATION PROCESS

APPARATUS FOR PROVIDING PLASMA TO A PROCESS CHAMBER

BEOL Interconnect With Carbon Nanotubes

HIGH TEMPERATURE TUNGSTEN METALLIZATION PROCESS

IN-SITU CLEAN PROCESS FOR METAL DEPOSITION CHAMBERS

METHODS FOR CONTACT CLEAN

PRE-CLEAN CHAMBER WITH REDUCED ION CURRENT

CU SURFACE PLASMA TREATMENT TO IMPROVE GAPFILL WINDOW

COBALT DEPOSITION ON BARRIER SURFACES

Method and apparatus of forming a sputtered doped seed layer

Adhesion of diffusion barrier and fluorinated silicon dioxide using...

Method of metallization using a nickel-vanadium layer

Method of enhancing hardness of sputter deposited copper films

Coil for sputter deposition