Myeong Ho Hong

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package substrate and method of manufacturing semicon...
- Patent number 11,594,505
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Tae Ho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate and method of manufacturing semicon...
- Patent number 11,114,397
- Issue date Sep 7, 2021
- Samsung Electronics Co., Ltd.
- Tae Ho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,026,681
- Issue date Jul 17, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Tae Ho Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed circuit board including flame reta...
- Patent number 8,840,967
- Issue date Sep 23, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jae-Choon Cho
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing printed circuit board using imprinting
- Patent number 8,216,503
- Issue date Jul 10, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jae-Choon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing substrate by imprinting
- Patent number 8,187,518
- Issue date May 29, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Choon-Keun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of printed circuit board using an ink jet
- Patent number 7,653,990
- Issue date Feb 2, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Choon-Keun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING SEMICON...
- Publication number 20210375805
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Tae Ho KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING SEMICON...
- Publication number 20200312801
- Publication date Oct 1, 2020
- Samsung Electronics Co., Ltd.
- Tae Ho KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180082933
- Publication date Mar 22, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Tae Ho KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE FOR PACKAGE
- Publication number 20150198888
- Publication date Jul 16, 2015
- Samsung Electro-mechanics Co., Ltd.
- Chang Bo LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20150053456
- Publication date Feb 26, 2015
- Samsung Electro-Mechanics Co., Ltd.
- CHANG BO LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CORELESS SUBSTRATE
- Publication number 20120324723
- Publication date Dec 27, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myeong Ho Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20120111728
- Publication date May 10, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Suk Hyeon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD INCLUDING FLAME RETA...
- Publication number 20120064231
- Publication date Mar 15, 2012
- Jae-Choon Cho
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Printed circuit board
- Publication number 20090183903
- Publication date Jul 23, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Choon-Keun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flame retardant resin composition for printed circuit board and pri...
- Publication number 20080090084
- Publication date Apr 17, 2008
- Samsung Electro-Mechanics CO., LTD.
- Jae-Choon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a stamper
- Publication number 20080054518
- Publication date Mar 6, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Seung-Hyun RA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Manufacturing method of printed circuit board
- Publication number 20080016686
- Publication date Jan 24, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Choon-Keun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing printed circuit board
- Publication number 20080012168
- Publication date Jan 17, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Senug-Hyun Ra
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for manufacturing printed circuit board using imprinting
- Publication number 20080008824
- Publication date Jan 10, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jae-Choon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing substrate by imprinting
- Publication number 20070207297
- Publication date Sep 6, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Choon-Keun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating printed circuit board using imprinting process
- Publication number 20070020397
- Publication date Jan 25, 2007
- Samsung Electro-Mechanics CO., LTD.
- Jae Choon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Imprinting mold for printed circuit board having excellent durabili...
- Publication number 20060222833
- Publication date Oct 5, 2006
- Samsung Electro-mechanics Co., Ltd.
- Il Sang Maeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Myeong Ho Hong

Person

Patents Grantslast 30 patents

Semiconductor package substrate and method of manufacturing semicon...

Semiconductor package substrate and method of manufacturing semicon...

Fan-out semiconductor package

Method for manufacturing printed circuit board including flame reta...

Method for manufacturing printed circuit board using imprinting

Method for manufacturing substrate by imprinting

Manufacturing method of printed circuit board using an ink jet

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING SEMICON...

SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING SEMICON...

FAN-OUT SEMICONDUCTOR PACKAGE

METHOD FOR MANUFACTURING SUBSTRATE FOR PACKAGE

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING CORELESS SUBSTRATE

METHOD OF MANUFACTURING CIRCUIT BOARD

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD INCLUDING FLAME RETA...

Printed circuit board

Flame retardant resin composition for printed circuit board and pri...

Method of manufacturing a stamper

Manufacturing method of printed circuit board

Method for manufacturing printed circuit board

Method for manufacturing printed circuit board using imprinting

Method for manufacturing substrate by imprinting

Method of fabricating printed circuit board using imprinting process

Imprinting mold for printed circuit board having excellent durabili...