Myung Jin Yim

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package including an underfill material in a portion of an area bet...
- Patent number 9,374,902
- Issue date Jun 21, 2016
- Micron Technology, Inc.
- Myung Jin Yim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molding compound including a carbon nano-tube dispersion
- Patent number 9,041,228
- Issue date May 26, 2015
- Micron Technology, Inc.
- Myung Jin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including at least one topological feature on an encapsulan...
- Patent number 8,653,675
- Issue date Feb 18, 2014
- Micron Technology, Inc.
- James Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including an underfill material in a portion of an area bet...
- Patent number 8,451,620
- Issue date May 28, 2013
- Micron Technology, Inc.
- Myung Jin Yim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-die building block for stacked-die package
- Patent number 8,344,491
- Issue date Jan 1, 2013
- Micron Technology, Inc.
- Ravikumar Adimula
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Forming a carbon nano-tube dispersion
- Publication number 20150246479
- Publication date Sep 3, 2015
- Micron Technology, Inc.
- Myung, Jin Yim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PACKAGE INCLUDING AN UNDERFILL MATERIAL IN A PORTION OF AN AREA BET...
- Publication number 20130258578
- Publication date Oct 3, 2013
- Micron Technology, Inc.
- Myung Jin Yim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE INCLUDING AT LEAST ONE TOPOLOGICAL FEATURE ON AN ENCAPSULAN...
- Publication number 20110127642
- Publication date Jun 2, 2011
- James Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING AN UNDERFILL MATERIAL IN A PORTION OF AN AREA BET...
- Publication number 20110128711
- Publication date Jun 2, 2011
- Myung Jin Yim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROTECTIVE THIN FILM COATING IN CHIP PACKAGING
- Publication number 20100164083
- Publication date Jul 1, 2010
- Numonyx B.V.
- Myung Jin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH METAL BUMPS
- Publication number 20100167466
- Publication date Jul 1, 2010
- Ravikumar Adimula
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-DIE BUILDING BLOCK FOR STACKED-DIE PACKAGE
- Publication number 20100164085
- Publication date Jul 1, 2010
- Ravikumar Adimula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING COMPOUND INCLUDING A CARBON NANO-TUBE DISPERSION
- Publication number 20100155934
- Publication date Jun 24, 2010
- Myung Jin Yim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Package on Package Assembly using Electrically Conductive Adhesive...
- Publication number 20100148359
- Publication date Jun 17, 2010
- Nanette Quevedo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Temperature Board Level Assembly Using Anisotropically Conducti...
- Publication number 20100123258
- Publication date May 20, 2010
- Myung Jin Yim
- B32 - LAYERED PRODUCTS

Myung Jin Yim

Person

Patents Grantslast 30 patents

Package including an underfill material in a portion of an area bet...

Molding compound including a carbon nano-tube dispersion

Package including at least one topological feature on an encapsulan...

Package including an underfill material in a portion of an area bet...

Multi-die building block for stacked-die package

Patents Applicationslast 30 patents

Forming a carbon nano-tube dispersion

PACKAGE INCLUDING AN UNDERFILL MATERIAL IN A PORTION OF AN AREA BET...

PACKAGE INCLUDING AT LEAST ONE TOPOLOGICAL FEATURE ON AN ENCAPSULAN...

PACKAGE INCLUDING AN UNDERFILL MATERIAL IN A PORTION OF AN AREA BET...

PROTECTIVE THIN FILM COATING IN CHIP PACKAGING

SEMICONDUCTOR PACKAGE SUBSTRATE WITH METAL BUMPS

MULTI-DIE BUILDING BLOCK FOR STACKED-DIE PACKAGE

MOLDING COMPOUND INCLUDING A CARBON NANO-TUBE DISPERSION

Package on Package Assembly using Electrically Conductive Adhesive...

Low Temperature Board Level Assembly Using Anisotropically Conducti...