Naga Sivakumar Yagnamurthy

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package that includes lamination layer
- Patent number 10,985,080
- Issue date Apr 20, 2021
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with patterned protective material
- Patent number 10,957,656
- Issue date Mar 23, 2021
- Intel Corporation
- Kyle Yazzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming trenches in packages structures and structures f...
- Patent number 10,231,338
- Issue date Mar 12, 2019
- Intel Corporation
- Naga Sivakumar Yagnamurthy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH PATTERNED PROTECTIVE MATERIAL
- Publication number 20200357752
- Publication date Nov 12, 2020
- Intel Corporation
- Kyle Yazzie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE THAT INCLUDES LAMINATION LAYER
- Publication number 20180350709
- Publication date Dec 6, 2018
- Intel Corporation
- Pramod Malatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING TRENCHES IN PACKAGES STRUCTURES AND STRUCTURES F...
- Publication number 20160381800
- Publication date Dec 29, 2016
- Intel Corporation
- Naga Sivakumar Yagnamurthy
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL