Nagraj Shankar

Person

Tualatin, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Film stack simplification for high aspect ratio patterning and vert...
- Patent number 12,080,592
- Issue date Sep 3, 2024
- Lam Research Corporation
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride films with improved etch selectivity for 3D NAND integration
- Patent number 12,040,180
- Issue date Jul 16, 2024
- Lam Research Corporation
- Pramod Subramonium
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of etch-stop layer for enhanced patterning
- Patent number 11,869,770
- Issue date Jan 9, 2024
- Lam Research Corporation
- Nagraj Shankar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manifold valve for controlling multiple gases
- Patent number 11,859,282
- Issue date Jan 2, 2024
- Lam Research Corporation
- Damodar Rajaram Shanbhag
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manifold valve for multiple precursors
- Patent number 11,427,908
- Issue date Aug 30, 2022
- Lam Research Corporation
- Damodar Rajaram Shanbhag
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective deposition of etch-stop layer for enhanced patterning
- Patent number 11,094,542
- Issue date Aug 17, 2021
- Lam Research Corporation
- Nagraj Shankar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition with atomic layer etch reset
- Patent number 10,998,187
- Issue date May 4, 2021
- Lam Research Corporation
- Kapu Sirish Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing chamber with showerhead having cooled faceplate
- Patent number 10,900,124
- Issue date Jan 26, 2021
- Lam Research Corporation
- Damodar Rajaram Shanbhag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of aluminum oxide etch stop layers
- Patent number 10,804,144
- Issue date Oct 13, 2020
- Lam Research Corporation
- Meliha Gozde Rainville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Showerhead with air-gapped plenums and overhead isolation gas distr...
- Patent number 10,745,806
- Issue date Aug 18, 2020
- Lam Research Corporation
- Nagraj Shankar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of Aluminum oxide etch stop layers
- Patent number 10,665,501
- Issue date May 26, 2020
- Lam Research Corporation
- Meliha Gozde Rainville
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Oxidizing treatment of aluminum nitride films in semiconductor devi...
- Patent number 10,651,080
- Issue date May 12, 2020
- Lam Research Corporation
- Meliha Gozde Rainville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-treatment method to improve selectivity in a selective depositi...
- Patent number 10,643,889
- Issue date May 5, 2020
- Lam Rasearch Corporation
- Dennis Hausmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase encapsulation in 3D NAND fabrication
- Patent number 10,580,690
- Issue date Mar 3, 2020
- Lam Research Corporation
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of etch-stop layer for enhanced patterning
- Patent number 10,566,194
- Issue date Feb 18, 2020
- Lam Research Corporation
- Nagraj Shankar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective deposition with atomic layer etch reset
- Patent number 10,559,461
- Issue date Feb 11, 2020
- Lam Research Corporation
- Kapu Sirish Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Showerhead with air-gapped plenums and overhead isolation gas distr...
- Patent number 10,472,716
- Issue date Nov 12, 2019
- Lam Research Corporation
- Nagraj Shankar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite dielectric interface layers for interconnect structures
- Patent number 10,418,236
- Issue date Sep 17, 2019
- Lam Research Corporation
- Kapu Sirish Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liner and barrier applications for subtractive metal integration
- Patent number 10,199,235
- Issue date Feb 5, 2019
- Lam Research Corporation
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite dielectric interface layers for interconnect structures
- Patent number 10,049,869
- Issue date Aug 14, 2018
- Lam Research Corporation
- Kapu Sirish Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Staircase encapsulation in 3D NAND fabrication
- Patent number 10,002,787
- Issue date Jun 19, 2018
- Lam Research Corporation
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner and barrier applications for subtractive metal integration
- Patent number 9,899,234
- Issue date Feb 20, 2018
- Lam Research Corporation
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of aluminum oxide etch stop layers
- Patent number 9,859,153
- Issue date Jan 2, 2018
- Lam Research Corporation
- Meliha Gozde Rainville
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for formation of low-k aluminum-containing etch stop films
- Patent number 9,633,896
- Issue date Apr 25, 2017
- Lam Research Corporation
- Daniel Damjanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective formation of dielectric barriers for metal interconnects...
- Patent number 9,418,889
- Issue date Aug 16, 2016
- Lam Research Corporation
- Thomas Weller Mountsier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for purging and plasma suppression in a proces...
- Patent number 9,399,228
- Issue date Jul 26, 2016
- Novellus Systems, Inc.
- Patrick Breiling
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Sacrificial pre-metal dielectric for self-aligned contact scheme
- Patent number 9,379,210
- Issue date Jun 28, 2016
- Lam Research Corporation
- Thomas Weller Mountsier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High growth rate process for conformal aluminum nitride
- Patent number 9,214,334
- Issue date Dec 15, 2015
- Lam Research Corporation
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sacrificial pre-metal dielectric for self-aligned contact scheme
- Patent number 9,190,489
- Issue date Nov 17, 2015
- Lam Research Corporation
- Thomas Weller Mountsier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for selective deposition of cobalt in semicon...
- Patent number 9,153,482
- Issue date Oct 6, 2015
- Lam Research Corporation
- Thomas Joseph Knisley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...
- Publication number 20240387258
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACELESS SHOWERHEAD
- Publication number 20230366089
- Publication date Nov 16, 2023
- Lam Research Corporation
- Shriram Vasant Bapat
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANIFOLD VALVE FOR CONTROLLING MULTIPLE GASES
- Publication number 20220372619
- Publication date Nov 24, 2022
- LAM RESEARCH CORPORATION
- Damodar Rajaram Shanbhag
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...
- Publication number 20220051938
- Publication date Feb 17, 2022
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF ETCH-STOP LAYER FOR ENHANCED PATTERNING
- Publication number 20210358753
- Publication date Nov 18, 2021
- LAM RESEARCH CORPORATION
- Nagraj Shankar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE FILMS WITH IMPROVED ETCH SELECTIVITY FOR 3D NAND INTEGRATION
- Publication number 20210320004
- Publication date Oct 14, 2021
- LAM RESEARCH CORPORATION
- Pramod Subramonium
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANIFOLD VALVE FOR MULTIPLE PRECURSORS
- Publication number 20210040611
- Publication date Feb 11, 2021
- LAM RESEARCH CORPORATION
- Damodar Rajaram Shanbhag
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITION OF ALUMINUM OXIDE ETCH STOP LAYERS
- Publication number 20200251384
- Publication date Aug 6, 2020
- LAM RESEARCH CORPORATION
- Meliha Gozde Rainville
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE DEPOSITION OF ETCH-STOP LAYER FOR ENHANCED PATTERNING
- Publication number 20200168466
- Publication date May 28, 2020
- LAM RESEARCH CORPORATION
- Nagraj Shankar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE DEPOSITION WITH ATOMIC LAYER ETCH RESET
- Publication number 20200118809
- Publication date Apr 16, 2020
- LAM RESEARCH CORPORATION
- Kapu Sirish Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SHOWERHEAD WITH AIR-GAPPED PLENUMS AND OVERHEAD ISOLATION GAS DISTR...
- Publication number 20200063261
- Publication date Feb 27, 2020
- LAM RESEARCH CORPORATION
- Nagraj Shankar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRE-TREATMENT METHOD TO IMPROVE SELECTIVITY IN A SELECTIVE DEPOSITI...
- Publication number 20200043776
- Publication date Feb 6, 2020
- LAM RESEARCH CORPORATION
- Dennis HAUSMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING CHAMBER WITH SHOWERHEAD HAVING COOLED FACEPLATE
- Publication number 20190376183
- Publication date Dec 12, 2019
- LAM RESEARCH CORPORATION
- Damodar Rajaram Shanbhag
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SHOWERHEAD WITH AIR-GAPPED PLENUMS AND OVERHEAD ISOLATION GAS DISTR...
- Publication number 20190352777
- Publication date Nov 21, 2019
- LAM RESEARCH CORPORATION
- Nagraj Shankar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE DEPOSITION OF ETCH-STOP LAYER FOR ENHANCED PATTERNING
- Publication number 20190341256
- Publication date Nov 7, 2019
- LAM RESEARCH CORPORATION
- Nagraj Shankar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE DIELECTRIC INTERFACE LAYERS FOR INTERCONNECT STRUCTURES
- Publication number 20180342389
- Publication date Nov 29, 2018
- LAM RESEARCH CORPORATION
- Kapu Sirish Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STAIRCASE ENCAPSULATION IN 3D NAND FABRICATION
- Publication number 20180330985
- Publication date Nov 15, 2018
- LAM RESEARCH CORPORATION
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION WITH ATOMIC LAYER ETCH RESET
- Publication number 20180308680
- Publication date Oct 25, 2018
- LAM RESEARCH CORPORATION
- Kapu Sirish Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION
- Publication number 20180211846
- Publication date Jul 26, 2018
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITION OF ALUMINUM OXIDE ETCH STOP LAYERS
- Publication number 20180197770
- Publication date Jul 12, 2018
- LAM RESEARCH CORPORATION
- Meliha Gozde Rainville
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STAIRCASE ENCAPSULATION IN 3D NAND FABRICATION
- Publication number 20180144977
- Publication date May 24, 2018
- LAM RESEARCH CORPORATION
- Yongsik Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE DIELECTRIC INTERFACE LAYERS FOR INTERCONNECT STRUCTURES
- Publication number 20180096886
- Publication date Apr 5, 2018
- LAM RESEARCH CORPORATION
- Kapu Sirish Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDIZING TREATMENT OF ALUMINUM NITRIDE FILMS IN SEMICONDUCTOR DEVI...
- Publication number 20170309514
- Publication date Oct 26, 2017
- LAM RESEARCH CORPORATION
- Meliha Gozde Rainville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMATION OF LOW-K ALUMINUM-CONTAINING ETCH STOP FILMS
- Publication number 20170103914
- Publication date Apr 13, 2017
- LAM RESEARCH CORPORATION
- Daniel Damjanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL PRE-METAL DIELECTRIC FOR SELF-ALIGNED CONTACT SCHEME
- Publication number 20160071953
- Publication date Mar 10, 2016
- LAM RESEARCH CORPORATION
- Thomas Weller Mountsier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH GROWTH RATE PROCESS FOR CONFORMAL ALUMINUM NITRIDE
- Publication number 20160064211
- Publication date Mar 3, 2016
- LAM RESEARCH CORPORATION
- Shankar Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE FORMATION OF DIELECTRIC BARRIERS FOR METAL INTERCONNECTS...
- Publication number 20150380302
- Publication date Dec 31, 2015
- LAM RESEARCH CORPORATION
- Thomas Weller Mountsier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION
- Publication number 20150380272
- Publication date Dec 31, 2015
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH GROWTH RATE PROCESS FOR CONFORMAL ALUMINUM NITRIDE
- Publication number 20150235835
- Publication date Aug 20, 2015
- LAM RESEARCH CORPORATION
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR SELECTIVE DEPOSITION OF COBALT IN SEMICON...
- Publication number 20150221542
- Publication date Aug 6, 2015
- LAM RESEARCH CORPORATION
- Thomas Joseph Knisley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Nagraj Shankar

Person

Patents Grantslast 30 patents

Film stack simplification for high aspect ratio patterning and vert...

Nitride films with improved etch selectivity for 3D NAND integration

Selective deposition of etch-stop layer for enhanced patterning

Manifold valve for controlling multiple gases

Manifold valve for multiple precursors

Selective deposition of etch-stop layer for enhanced patterning

Selective deposition with atomic layer etch reset

Substrate processing chamber with showerhead having cooled faceplate

Deposition of aluminum oxide etch stop layers

Showerhead with air-gapped plenums and overhead isolation gas distr...

Deposition of Aluminum oxide etch stop layers

Oxidizing treatment of aluminum nitride films in semiconductor devi...

Pre-treatment method to improve selectivity in a selective depositi...

Staircase encapsulation in 3D NAND fabrication

Selective deposition of etch-stop layer for enhanced patterning

Selective deposition with atomic layer etch reset

Showerhead with air-gapped plenums and overhead isolation gas distr...

Composite dielectric interface layers for interconnect structures

Liner and barrier applications for subtractive metal integration

Composite dielectric interface layers for interconnect structures

Staircase encapsulation in 3D NAND fabrication

Liner and barrier applications for subtractive metal integration

Deposition of aluminum oxide etch stop layers

Methods for formation of low-k aluminum-containing etch stop films

Selective formation of dielectric barriers for metal interconnects...

Method and apparatus for purging and plasma suppression in a proces...

Sacrificial pre-metal dielectric for self-aligned contact scheme

High growth rate process for conformal aluminum nitride

Sacrificial pre-metal dielectric for self-aligned contact scheme

Methods and apparatus for selective deposition of cobalt in semicon...

Patents Applicationslast 30 patents

FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...

FACELESS SHOWERHEAD

MANIFOLD VALVE FOR CONTROLLING MULTIPLE GASES

FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...

SELECTIVE DEPOSITION OF ETCH-STOP LAYER FOR ENHANCED PATTERNING

NITRIDE FILMS WITH IMPROVED ETCH SELECTIVITY FOR 3D NAND INTEGRATION

MANIFOLD VALVE FOR MULTIPLE PRECURSORS

DEPOSITION OF ALUMINUM OXIDE ETCH STOP LAYERS

SELECTIVE DEPOSITION OF ETCH-STOP LAYER FOR ENHANCED PATTERNING

SELECTIVE DEPOSITION WITH ATOMIC LAYER ETCH RESET

SHOWERHEAD WITH AIR-GAPPED PLENUMS AND OVERHEAD ISOLATION GAS DISTR...

PRE-TREATMENT METHOD TO IMPROVE SELECTIVITY IN A SELECTIVE DEPOSITI...

SUBSTRATE PROCESSING CHAMBER WITH SHOWERHEAD HAVING COOLED FACEPLATE

SHOWERHEAD WITH AIR-GAPPED PLENUMS AND OVERHEAD ISOLATION GAS DISTR...

SELECTIVE DEPOSITION OF ETCH-STOP LAYER FOR ENHANCED PATTERNING

COMPOSITE DIELECTRIC INTERFACE LAYERS FOR INTERCONNECT STRUCTURES

STAIRCASE ENCAPSULATION IN 3D NAND FABRICATION

SELECTIVE DEPOSITION WITH ATOMIC LAYER ETCH RESET

LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION

DEPOSITION OF ALUMINUM OXIDE ETCH STOP LAYERS

STAIRCASE ENCAPSULATION IN 3D NAND FABRICATION

COMPOSITE DIELECTRIC INTERFACE LAYERS FOR INTERCONNECT STRUCTURES

OXIDIZING TREATMENT OF ALUMINUM NITRIDE FILMS IN SEMICONDUCTOR DEVI...

METHODS FOR FORMATION OF LOW-K ALUMINUM-CONTAINING ETCH STOP FILMS

SACRIFICIAL PRE-METAL DIELECTRIC FOR SELF-ALIGNED CONTACT SCHEME

HIGH GROWTH RATE PROCESS FOR CONFORMAL ALUMINUM NITRIDE

SELECTIVE FORMATION OF DIELECTRIC BARRIERS FOR METAL INTERCONNECTS...

LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION

HIGH GROWTH RATE PROCESS FOR CONFORMAL ALUMINUM NITRIDE

METHODS AND APPARATUS FOR SELECTIVE DEPOSITION OF COBALT IN SEMICON...