Nai-Hao Kao

Person

Taichung Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Flip-chip semiconductor package and chip carrier for preventing cor...
- Patent number 8,207,620
- Issue date Jun 26, 2012
- Siliconware Precision Industries Co., Ltd.
- Yuan-Lin Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity-down ball grid array semiconductor package with heat spreader
- Patent number 6,819,565
- Issue date Nov 16, 2004
- Siliconware Precision Industries Co., Ltd.
- Nai-Hao Kao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274495
- Publication date Aug 15, 2024
- Siliconware Precision Industries Co., Ltd.
- Shuai-Lin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274505
- Publication date Aug 15, 2024
- Siliconware Precision Industries Co., Ltd.
- Shuai-Lin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145455
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Meng-Jie LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230378072
- Publication date Nov 23, 2023
- Siliconware Precision Industries Co., Ltd.
- Shuai-Lin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACK STRUCTURE, METHOD FOR FABRICATING THE SAME, AND CARRI...
- Publication number 20200328142
- Publication date Oct 15, 2020
- Siliconware Precision Industries Co., Ltd.
- Don-Son Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip semiconductor package and chip carrier thereof
- Publication number 20080017983
- Publication date Jan 24, 2008
- Siliconware Precision Industries Co., Ltd.
- Yuan-Lin Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity-down ball grid array semiconductor package with heat spreader
- Publication number 20040070948
- Publication date Apr 15, 2004
- Siliconware Precision Industries, Ltd. Taiwan
- Nai-Hao Kao
- H01 - BASIC ELECTRIC ELEMENTS

Nai-Hao Kao

Person

Patents Grantslast 30 patents

Flip-chip semiconductor package and chip carrier for preventing cor...

Cavity-down ball grid array semiconductor package with heat spreader

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STACK STRUCTURE, METHOD FOR FABRICATING THE SAME, AND CARRI...

Flip-chip semiconductor package and chip carrier thereof

Cavity-down ball grid array semiconductor package with heat spreader