Namwoong Paik

Person

Lawrenceville, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect bump structures for photo detectors
- Patent number 10,957,733
- Issue date Mar 23, 2021
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for high density flip chip interconnection
- Patent number 10,879,204
- Issue date Dec 29, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect bump structures for photo detectors
- Patent number 10,727,267
- Issue date Jul 28, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for high density flip chip interconnection
- Patent number 10,622,324
- Issue date Apr 14, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for interconnecting focal plane arrays
- Patent number 10,566,371
- Issue date Feb 18, 2020
- Sensors Unlimited, Inc.
- Namwoong Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mesas and implants in two-dimensional arrays
- Patent number 10,468,437
- Issue date Nov 5, 2019
- Sensors Unlimited, Inc.
- Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for interconnecting focal plane arrays
- Patent number 10,096,639
- Issue date Oct 9, 2018
- Sensors Unlimited, Inc.
- Namwoong Paik
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BROADBAND SILICON SENSOR
- Publication number 20250040265
- Publication date Jan 30, 2025
- SRI International
- John McCarten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIME CENTERED HIGH-DYNAMIC-RANGE READOUT
- Publication number 20230134194
- Publication date May 4, 2023
- SRI International
- John P McCarten
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SENSOR WITH UPCONVERSION LAYER
- Publication number 20230041955
- Publication date Feb 9, 2023
- SRI International
- Namwoong Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
- Publication number 20200312900
- Publication date Oct 1, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES FOR HIGH DENSITY FLIP CHIP INTERCONNECTION
- Publication number 20200227370
- Publication date Jul 16, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
- Publication number 20200083272
- Publication date Mar 12, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION
- Publication number 20200052012
- Publication date Feb 13, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MESAS AND IMPLANTS IN TWO-DIMENSIONAL ARRAYS
- Publication number 20190296058
- Publication date Sep 26, 2019
- Sensors Unlimited, Inc.
- Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES FOR HIGH DENSITY FLIP CHIP INTERCONNECTION
- Publication number 20190244924
- Publication date Aug 8, 2019
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES FOR INTERCONNECTING FOCAL PLANE ARRAYS
- Publication number 20190006409
- Publication date Jan 3, 2019
- Sensors Unlimited, Inc.
- Namwoong Paik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES FOR INTERCONNECTING FOCAL PLANE ARRAYS
- Publication number 20180102391
- Publication date Apr 12, 2018
- Sensors Unlimited, Inc.
- Namwoong Paik
- H01 - BASIC ELECTRIC ELEMENTS

Namwoong Paik

Person

Patents Grantslast 30 patents

Interconnect bump structures for photo detectors

Bump structures for high density flip chip interconnection

Interconnect bump structures for photo detectors

Bump structures for high density flip chip interconnection

Bump structures for interconnecting focal plane arrays

Mesas and implants in two-dimensional arrays

Bump structures for interconnecting focal plane arrays

Patents Applicationslast 30 patents

BROADBAND SILICON SENSOR

TIME CENTERED HIGH-DYNAMIC-RANGE READOUT

SENSOR WITH UPCONVERSION LAYER

INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS

BUMP STRUCTURES FOR HIGH DENSITY FLIP CHIP INTERCONNECTION

INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS

MESA TRENCH ETCH WITH STACKED SIDEWALL PASSIVATION

MESAS AND IMPLANTS IN TWO-DIMENSIONAL ARRAYS

BUMP STRUCTURES FOR HIGH DENSITY FLIP CHIP INTERCONNECTION

BUMP STRUCTURES FOR INTERCONNECTING FOCAL PLANE ARRAYS

BUMP STRUCTURES FOR INTERCONNECTING FOCAL PLANE ARRAYS