Nancy Carolyn LaBianca

Person

Yalesville, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Tunable radiation source
- Patent number 8,785,217
- Issue date Jul 22, 2014
- International Business Machines Corporation
- Michael A. Gaynes
- G01 - MEASURING TESTING
Information Patent Grant
SER testing for an IC chip using hot underfill
- Patent number 8,288,177
- Issue date Oct 16, 2012
- International Business Machines Corporation
- Michael Gaynes
- G01 - MEASURING TESTING
Information Patent Grant
Negative thermal expansion system (NTES) device for TCE compensatio...
- Patent number 8,241,957
- Issue date Aug 14, 2012
- International Business Machines Corporation
- Gareth Geoffrey Hougham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip-level underfill method of manufacture
- Patent number 7,951,648
- Issue date May 31, 2011
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative thermal expansion system (NTEs) device for TCE compensatio...
- Patent number 7,883,919
- Issue date Feb 8, 2011
- International Business Machines Corporation
- Gareth Geoffrey Hougham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Underfilling with acid-cleavable acetal and ketal epoxy oligomers
- Patent number 7,776,993
- Issue date Aug 17, 2010
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method and system for collecting alignment data from coated chips o...
- Patent number 7,773,220
- Issue date Aug 10, 2010
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete placement of radiation sources on integrated circuit devices
- Patent number 7,649,257
- Issue date Jan 19, 2010
- International Business Machines Corporation
- Michael S. Gordon
- G01 - MEASURING TESTING
Information Patent Grant
Negative thermal expansion system (NTEs) device for TCE compensatio...
- Patent number 7,556,979
- Issue date Jul 7, 2009
- International Business Machines Corporation
- Gareth Geoffrey Hougham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Negative thermal expansion system (NTEs) device for TCE compensatio...
- Patent number 7,417,315
- Issue date Aug 26, 2008
- International Business Machines Corporation
- Gareth Geoffrey Hougham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging integrated circuits for accelerated detection of transien...
- Patent number 7,238,547
- Issue date Jul 3, 2007
- International Business Machines Corporation
- Jerry D. Ackaret
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heterogeneous thermal interface for cooling
- Patent number 7,219,713
- Issue date May 22, 2007
- International Business Machines Corporation
- Jeffrey D. Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for chip-cooling
- Patent number 7,063,127
- Issue date Jun 20, 2006
- International Business Machines Corporation
- Jeffrey D. Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayer wafer-level underfill
- Patent number 6,924,171
- Issue date Aug 2, 2005
- International Business Machines Corporation
- Stephen L. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acid-cleavable acetal and ketal based epoxy oligomers
- Patent number 6,919,420
- Issue date Jul 19, 2005
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Reworkable and thermally conductive adhesive and use thereof
- Patent number 6,777,817
- Issue date Aug 17, 2004
- International Business Machines Corporation
- Stephen Buchwalter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Reworkable and thermally conductive adhesive and use thereof
- Patent number 6,617,698
- Issue date Sep 9, 2003
- International Business Machines Corporation
- Stephen Buchwalter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive polyimide-precursor formulation
- Patent number 6,013,414
- Issue date Jan 11, 2000
- International Business Machines Corporation
- Jeffrey Donald Gelorme
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive polyimide-precursor formulation
- Patent number 6,010,832
- Issue date Jan 4, 2000
- International Business Machines Corporation
- Jeffrey Donald Gelorme
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Strippable photoimageable compositions
- Patent number 5,879,859
- Issue date Mar 9, 1999
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photoresist for use in ink jet printers and other micro-machining a...
- Patent number 5,859,655
- Issue date Jan 12, 1999
- International Business Machines Corporation
- Jeffrey Donald Gelorme
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Gel for localized removal of reworkable encapsulant
- Patent number 5,858,943
- Issue date Jan 12, 1999
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polyamic acid and polyimide from fluorinated reactant
- Patent number 5,780,199
- Issue date Jul 14, 1998
- International Business Machines Corporation
- Marie Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyamic acid and polyimide from fluorinated reactant
- Patent number 5,464,927
- Issue date Nov 7, 1995
- International Business Machines Corporation
- Marie Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermal stabilization of photoresist images
- Patent number 4,806,455
- Issue date Feb 21, 1989
- MacDermid, Incorporated
- Nancy C. LaBianca
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
TUNABLE RADIATION SOURCE
- Publication number 20130062740
- Publication date Mar 14, 2013
- International Business Machines Corporation
- Michael A. Gaynes
- G01 - MEASURING TESTING
Information Patent Application
SER Testing for an IC Chip Using Hot Underfill
- Publication number 20120045853
- Publication date Feb 23, 2012
- International Business Machines Corporation
- Michael Gaynes
- G01 - MEASURING TESTING
Information Patent Application
Negative Thermal Expansion System (NTES) Device for TCE Compensatio...
- Publication number 20110034047
- Publication date Feb 10, 2011
- International Business Machines Corporation
- Gareth Geoffrey HOUGHAM
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP-LEVEL UNDERFILL PROCESS AND STRUCTURES THEREOF
- Publication number 20100003786
- Publication date Jan 7, 2010
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Negative Thermal Expansion System (NTES) Device for TCE Compensatio...
- Publication number 20090263991
- Publication date Oct 22, 2009
- Gareth Geoffrey Hougham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR COLLECTING ALIGNMENT DATA FROM COATED CHIPS O...
- Publication number 20090251698
- Publication date Oct 8, 2009
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCREET PLACEMENT OF RADIATION SOURCES ON INTEGRATED CIRCUIT DEVICES
- Publication number 20090236699
- Publication date Sep 24, 2009
- Michael S. Gordon
- G01 - MEASURING TESTING
Information Patent Application
WAFER-LEVEL UNDERFILL PROCESS USING OVER-BUMP-APPLIED RESIN
- Publication number 20090108472
- Publication date Apr 30, 2009
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment Marks on the Edge of Wafers and Methods for Same
- Publication number 20090102070
- Publication date Apr 23, 2009
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC WAVEGUIDE STRUCTURE WITH PLANARIZED SIDEWALL CLADDING LAYER
- Publication number 20080310808
- Publication date Dec 18, 2008
- International Business Machines Corporation
- David Michael Fried
- G02 - OPTICS
Information Patent Application
Marks for the Alignment of Wafer-Level Underfilled Silicon Chips an...
- Publication number 20080265445
- Publication date Oct 30, 2008
- International Business Machines Corporation
- Claudius Feger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Negative Thermal Expansion System (NTES) Device for TCE Compensatio...
- Publication number 20080048305
- Publication date Feb 28, 2008
- Gareth Geoffrey Hougham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaging integrated circuits for accelerated detection of transien...
- Publication number 20060220654
- Publication date Oct 5, 2006
- International Business Machines Corporation
- Theodore H. Zabel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Heterogeneous thermal interface for cooling
- Publication number 20060157223
- Publication date Jul 20, 2006
- Jeffrey D. Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for chip cooling using a liquid metal thermal...
- Publication number 20060131738
- Publication date Jun 22, 2006
- Bruce K. Furman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reworkable b-stageable adhesive and use in waferlevel underfill
- Publication number 20050250248
- Publication date Nov 10, 2005
- Stephen Leslie Buchwalter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method and apparatus for chip-cooling
- Publication number 20050061474
- Publication date Mar 24, 2005
- Jeffrey D. Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reworkable b-stageable adhesive and use in waferlevel underfill
- Publication number 20040110010
- Publication date Jun 10, 2004
- Stephen Leslie Buchwalter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Negative thermal expansion system (NTEs) device for TCE compensatio...
- Publication number 20040110322
- Publication date Jun 10, 2004
- International Business Machines Corporation
- Gareth Geoffrey Hougham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Reworkable and thermally conductive adhesive and use thereof
- Publication number 20040041280
- Publication date Mar 4, 2004
- International Business Machines Corporation
- Stephen L. Buchwalter
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Reworkable and thermally conductive adhesive and use thereof
- Publication number 20020171132
- Publication date Nov 21, 2002
- International Business Machines Corporation
- Stephen Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bilayer wafer-level underfill
- Publication number 20020109228
- Publication date Aug 15, 2002
- Stephen L. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS

Nancy Carolyn LaBianca

Person

Patents Grantslast 30 patents

Tunable radiation source

SER testing for an IC chip using hot underfill

Negative thermal expansion system (NTES) device for TCE compensatio...

Chip-level underfill method of manufacture

Negative thermal expansion system (NTEs) device for TCE compensatio...

Underfilling with acid-cleavable acetal and ketal epoxy oligomers

Method and system for collecting alignment data from coated chips o...

Discrete placement of radiation sources on integrated circuit devices

Negative thermal expansion system (NTEs) device for TCE compensatio...

Negative thermal expansion system (NTEs) device for TCE compensatio...

Packaging integrated circuits for accelerated detection of transien...

Heterogeneous thermal interface for cooling

Method and apparatus for chip-cooling

Bilayer wafer-level underfill

Acid-cleavable acetal and ketal based epoxy oligomers

Reworkable and thermally conductive adhesive and use thereof

Reworkable and thermally conductive adhesive and use thereof

Photosensitive polyimide-precursor formulation

Photosensitive polyimide-precursor formulation

Strippable photoimageable compositions

Photoresist for use in ink jet printers and other micro-machining a...

Gel for localized removal of reworkable encapsulant

Polyamic acid and polyimide from fluorinated reactant

Polyamic acid and polyimide from fluorinated reactant

Thermal stabilization of photoresist images

Patents Applicationslast 30 patents

TUNABLE RADIATION SOURCE

SER Testing for an IC Chip Using Hot Underfill

Negative Thermal Expansion System (NTES) Device for TCE Compensatio...

CHIP-LEVEL UNDERFILL PROCESS AND STRUCTURES THEREOF

Negative Thermal Expansion System (NTES) Device for TCE Compensatio...

METHOD AND SYSTEM FOR COLLECTING ALIGNMENT DATA FROM COATED CHIPS O...

DISCREET PLACEMENT OF RADIATION SOURCES ON INTEGRATED CIRCUIT DEVICES

WAFER-LEVEL UNDERFILL PROCESS USING OVER-BUMP-APPLIED RESIN

Alignment Marks on the Edge of Wafers and Methods for Same

PHOTONIC WAVEGUIDE STRUCTURE WITH PLANARIZED SIDEWALL CLADDING LAYER

Marks for the Alignment of Wafer-Level Underfilled Silicon Chips an...

Negative Thermal Expansion System (NTES) Device for TCE Compensatio...

Packaging integrated circuits for accelerated detection of transien...

Heterogeneous thermal interface for cooling

Method and apparatus for chip cooling using a liquid metal thermal...

Reworkable b-stageable adhesive and use in waferlevel underfill

Method and apparatus for chip-cooling

Reworkable b-stageable adhesive and use in waferlevel underfill

Negative thermal expansion system (NTEs) device for TCE compensatio...

Reworkable and thermally conductive adhesive and use thereof

Reworkable and thermally conductive adhesive and use thereof

Bilayer wafer-level underfill