Nancy R. Klymko

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of repairing process induced dielectric damage by the use of...
- Patent number 7,838,428
- Issue date Nov 23, 2010
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming nitride films with high compressive stress for im...
- Patent number 7,804,136
- Issue date Sep 28, 2010
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of oxidation-resistant seed layer for interconnect applic...
- Patent number 7,585,765
- Issue date Sep 8, 2009
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming nitride films with high compressive stress for im...
- Patent number 7,491,660
- Issue date Feb 17, 2009
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming nitride films with high compressive stress for im...
- Patent number 7,462,527
- Issue date Dec 9, 2008
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of oxidation-resistant seed layer for interconnect applic...
- Patent number 7,276,796
- Issue date Oct 2, 2007
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IM...
- Publication number 20080045039
- Publication date Feb 21, 2008
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IM...
- Publication number 20080036007
- Publication date Feb 14, 2008
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF OXIDATION-RESISTANT SEED LAYER FOR INTERCONNECT APPLIC...
- Publication number 20070275557
- Publication date Nov 29, 2007
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING PROCESS INDUCED DIELECTRIC DAMAGE BY THE USE OF...
- Publication number 20070224824
- Publication date Sep 27, 2007
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF OXIDATION-RESISTANT SEED LAYER FOR INTERCONNECT APPLIC...
- Publication number 20070216031
- Publication date Sep 20, 2007
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IM...
- Publication number 20070007548
- Publication date Jan 11, 2007
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS

Nancy R. Klymko

Person

Patents Grantslast 30 patents

Method of repairing process induced dielectric damage by the use of...

Method of forming nitride films with high compressive stress for im...

Formation of oxidation-resistant seed layer for interconnect applic...

Method of forming nitride films with high compressive stress for im...

Method of forming nitride films with high compressive stress for im...

Formation of oxidation-resistant seed layer for interconnect applic...

Patents Applicationslast 30 patents

METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IM...

METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IM...

FORMATION OF OXIDATION-RESISTANT SEED LAYER FOR INTERCONNECT APPLIC...

METHOD OF REPAIRING PROCESS INDUCED DIELECTRIC DAMAGE BY THE USE OF...

FORMATION OF OXIDATION-RESISTANT SEED LAYER FOR INTERCONNECT APPLIC...

METHOD OF FORMING NITRIDE FILMS WITH HIGH COMPRESSIVE STRESS FOR IM...