Naoaki Ogure

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Composite nanoparticles method for producing the same
- Patent number 7,799,425
- Issue date Sep 21, 2010
- Ebara Corporation
- Yusuke Chikamori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate plating method and apparatus
- Patent number 7,033,463
- Issue date Apr 25, 2006
- Ebara Corporation
- Akihisa Hongo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for forming thin film of metal
- Patent number 6,972,256
- Issue date Dec 6, 2005
- Ebara Corporation
- Akira Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate plating apparatus
- Patent number 6,929,722
- Issue date Aug 16, 2005
- Ebara Corporation
- Akihisa Hongo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating, modification and etching of substrate surface with particl...
- Patent number 6,921,722
- Issue date Jul 26, 2005
- Ebara Corporation
- Naoaki Ogure
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate plating apparatus and method
- Patent number 6,793,794
- Issue date Sep 21, 2004
- Ebara Corporation
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of forming embedded copper interconnections and embedded cop...
- Patent number 6,787,467
- Issue date Sep 7, 2004
- Ebara Corporation
- Naoaki Ogure
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and apparatus for forming interconnection
- Patent number 6,730,596
- Issue date May 4, 2004
- Ebara Corporation
- Akira Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method, interconnection forming method, and apparatus for c...
- Patent number 6,709,555
- Issue date Mar 23, 2004
- Ebara Corporation
- Naoaki Ogure
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate coated with a conductive layer and manufacturing method t...
- Patent number 6,651,871
- Issue date Nov 25, 2003
- Ebara Corporation
- Naoaki Ogure
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for protection of substrate surface
- Patent number 6,573,201
- Issue date Jun 3, 2003
- Ebara Corporation
- Naoaki Ogure
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plating substrate and plating facility
- Patent number 6,558,518
- Issue date May 6, 2003
- Ebara Corporation
- Satoshi Sendai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate plating apparatus
- Patent number 6,495,004
- Issue date Dec 17, 2002
- Ebara Corporation
- Fumio Kuriyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate coated with a conductive layer and manufacturing method t...
- Patent number 6,486,413
- Issue date Nov 26, 2002
- Ebara Corporation
- Naoaki Ogure
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High energy sputtering method for forming interconnects
- Patent number 6,458,694
- Issue date Oct 1, 2002
- Ebara Corporation
- Naoaki Ogure
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sliding member and process for producing the same
- Patent number 6,455,475
- Issue date Sep 24, 2002
- Ebara Corporation
- Naoaki Ogure
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Dresser for polishing cloth and method for manufacturing such dress...
- Patent number 6,432,257
- Issue date Aug 13, 2002
- Ebara Corporation
- Hiroshi Nagasaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method of forming embedded copper interconnections and embedded cop...
- Patent number 6,391,775
- Issue date May 21, 2002
- Ebara Corporation
- Naoaki Ogure
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing substrate
- Patent number 6,387,182
- Issue date May 14, 2002
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate plating device
- Patent number 6,365,017
- Issue date Apr 2, 2002
- Ebara Corporation
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate plating apparatus
- Patent number 6,294,059
- Issue date Sep 25, 2001
- Ebara Corporation
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of forming embedded copper interconnections and embedded cop...
- Patent number 6,147,408
- Issue date Nov 14, 2000
- Ebara Corporation
- Naoaki Ogure
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron-beam irradiation apparatus
- Patent number 6,054,714
- Issue date Apr 25, 2000
- Ebara Corporation
- Masahiro Izutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid material vaporizer apparatus and gas ejection device
- Patent number 6,036,783
- Issue date Mar 14, 2000
- Ebara Corporation
- Yukio Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Device containing solar cell panel and storage battery
- Patent number 6,005,183
- Issue date Dec 21, 1999
- Ebara Corporation
- Yuichi Akai
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Vaporizer apparatus
- Patent number 5,862,605
- Issue date Jan 26, 1999
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Spin dryer apparatus
- Patent number 5,829,156
- Issue date Nov 3, 1998
- Ebara Corporation
- Mitsunao Shibasaki
- F26 - DRYING
Information Patent Grant
Method of and apparatus for continuously producing a solid material
- Patent number 5,820,649
- Issue date Oct 13, 1998
- Ebara Corporation
- Naoaki Ogure
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for filling small holes or covering small recesses in the su...
- Patent number 5,705,230
- Issue date Jan 6, 1998
- Ebara Corporation
- Toru Matanabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing wiring in groove
- Patent number 5,656,542
- Issue date Aug 12, 1997
- Kabushiki Kaisha Toshiba
- Masahiro Miyata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Submerged Electrode and Material Thereof
- Publication number 20080271911
- Publication date Nov 6, 2008
- EBARA CORPORATION
- Naoaki Ogure
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
Substrate plating method and apparatus
- Publication number 20060144714
- Publication date Jul 6, 2006
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Bonding apparatus and bonding method
- Publication number 20060118598
- Publication date Jun 8, 2006
- EBARA CORPORATION
- Yusuke Chikamori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Joining method and apparatus
- Publication number 20060076387
- Publication date Apr 13, 2006
- Naoaki Ogure
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reactive detection chip and spotter suitable for manufacturing the...
- Publication number 20050254998
- Publication date Nov 17, 2005
- EBARA CORPORATION
- Kenro Nakamura
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Bonding material and bonding method
- Publication number 20040245648
- Publication date Dec 9, 2004
- Hiroshi Nagasawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate plating apparatus
- Publication number 20040163947
- Publication date Aug 26, 2004
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate coated with a conductive layer and manufacturing method t...
- Publication number 20030059541
- Publication date Mar 27, 2003
- EBARA CORPORATION
- Naoaki Ogure
- G02 - OPTICS
Information Patent Application
Method and apparatus for forming thin film of metal
- Publication number 20020160103
- Publication date Oct 31, 2002
- Akira Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate plating apparatus
- Publication number 20020139683
- Publication date Oct 3, 2002
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of forming embedded copper interconnections and embedded cop...
- Publication number 20020111022
- Publication date Aug 15, 2002
- Naoaki Ogure
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for forming interconnect
- Publication number 20020009883
- Publication date Jan 24, 2002
- Naoaki Ogure
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate plating apparatus
- Publication number 20020005359
- Publication date Jan 17, 2002
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Coating, modification and etching of substrate surface with particl...
- Publication number 20010055649
- Publication date Dec 27, 2001
- Naoaki Ogure
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Naoaki Ogure

Person

Patents Grantslast 30 patents

Composite nanoparticles method for producing the same

Substrate plating method and apparatus

Method and apparatus for forming thin film of metal

Substrate plating apparatus

Coating, modification and etching of substrate surface with particl...

Substrate plating apparatus and method

Method of forming embedded copper interconnections and embedded cop...

Method of and apparatus for forming interconnection

Plating method, interconnection forming method, and apparatus for c...

Substrate coated with a conductive layer and manufacturing method t...

Method and apparatus for protection of substrate surface

Method and apparatus for plating substrate and plating facility

Substrate plating apparatus

Substrate coated with a conductive layer and manufacturing method t...

High energy sputtering method for forming interconnects

Sliding member and process for producing the same

Dresser for polishing cloth and method for manufacturing such dress...

Method of forming embedded copper interconnections and embedded cop...

Apparatus and method for processing substrate

Substrate plating device

Substrate plating apparatus

Method of forming embedded copper interconnections and embedded cop...

Electron-beam irradiation apparatus

Liquid material vaporizer apparatus and gas ejection device

Device containing solar cell panel and storage battery

Vaporizer apparatus

Spin dryer apparatus

Method of and apparatus for continuously producing a solid material

Method for filling small holes or covering small recesses in the su...

Method for manufacturing wiring in groove

Patents Applicationslast 30 patents

Submerged Electrode and Material Thereof

Substrate plating method and apparatus

Bonding apparatus and bonding method

Joining method and apparatus

Reactive detection chip and spotter suitable for manufacturing the...

Bonding material and bonding method

Substrate plating apparatus

Substrate coated with a conductive layer and manufacturing method t...

Method and apparatus for forming thin film of metal

Substrate plating apparatus

Method of forming embedded copper interconnections and embedded cop...

Method and apparatus for forming interconnect

Substrate plating apparatus

Coating, modification and etching of substrate surface with particl...