Naoki Matsuda

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus, substrate processing method, substr...
- Patent number 11,426,834
- Issue date Aug 30, 2022
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Insertion position correction in an electronic component insertion...
- Patent number 10,712,381
- Issue date Jul 14, 2020
- Taiyo Yuden Co., Ltd.
- Hideaki Tago
- G01 - MEASURING TESTING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 10,493,588
- Issue date Dec 3, 2019
- Ebara Corporation
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing method, substr...
- Patent number 10,486,285
- Issue date Nov 26, 2019
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate gripping apparatus
- Patent number 9,892,953
- Issue date Feb 13, 2018
- Ebara Corporation
- Mitsuru Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, substrate processing method, substr...
- Patent number 9,687,957
- Issue date Jun 27, 2017
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing method, substr...
- Patent number 9,358,662
- Issue date Jun 7, 2016
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate gripping apparatus
- Patent number 9,269,605
- Issue date Feb 23, 2016
- Ebara Corporation
- Mitsuru Miyazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 9,144,881
- Issue date Sep 29, 2015
- Ebara Corporation
- Hidetaka Nakao
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 8,979,615
- Issue date Mar 17, 2015
- Ebara Corporation
- Masaya Seki
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing method, substr...
- Patent number 8,795,032
- Issue date Aug 5, 2014
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Plating apparatus
- Patent number 7,297,210
- Issue date Nov 20, 2007
- Ebara Corporation
- Akihisa Hongo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for forming interconnects
- Patent number 6,811,658
- Issue date Nov 2, 2004
- Ebara Corporation
- Akihisa Hongo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for cleaning a substrate such as a semiconductor wafer
- Patent number 6,494,220
- Issue date Dec 17, 2002
- Ebara Corporation
- Naoki Matsuda
- B08 - CLEANING
Information Patent Grant
Cleaning apparatus
- Patent number 6,308,361
- Issue date Oct 30, 2001
- Ebara Corporation
- Naoki Matsuda
- B08 - CLEANING
Information Patent Grant
Apparatus for cleaning substrate
- Patent number 6,248,009
- Issue date Jun 19, 2001
- Ebara Corporation
- Kenya Ito
- B08 - CLEANING
Information Patent Grant
Cleaning apparatus and cleaning member rinsing apparatus
- Patent number 6,141,812
- Issue date Nov 7, 2000
- Ebara Corporation
- Naoki Matsuda
- B08 - CLEANING
Information Patent Grant
Cleaning apparatus
- Patent number 6,092,542
- Issue date Jul 25, 2000
- Ebara Corporation
- Naoki Matsuda
- B08 - CLEANING
Information Patent Grant
Thin-film vapor deposition apparatus
- Patent number 5,935,337
- Issue date Aug 10, 1999
- Ebara Corporation
- Noriyuki Takeuchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Luminance/chrominance separating apparatus
- Patent number 5,231,476
- Issue date Jul 27, 1993
- Kabushiki Kaisha Toshiba
- Masahiko Mawatari
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...
- Publication number 20200047309
- Publication date Feb 13, 2020
- Mitsuru MIYAZAKI
- B24 - GRINDING POLISHING
Information Patent Application
INSERTION POSITION CORRECTION IN AN ELECTRONIC COMPONENT INSERTION...
- Publication number 20180334334
- Publication date Nov 22, 2018
- Taiyo Yuden Co., Ltd.
- HIDEAKI TAGO
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...
- Publication number 20170252894
- Publication date Sep 7, 2017
- EBARA CORPORATION
- Mitsuru Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE GRIPPING APPARATUS
- Publication number 20160133503
- Publication date May 12, 2016
- EBARA CORPORATION
- Mitsuru Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20150151398
- Publication date Jun 4, 2015
- EBARA CORPORATION
- Masaya SEKI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...
- Publication number 20150050863
- Publication date Feb 19, 2015
- EBARA CORPORATION
- Mitsuru MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...
- Publication number 20140302676
- Publication date Oct 9, 2014
- Mitsuru MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20140242885
- Publication date Aug 28, 2014
- Hidetaka Nakao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE GRIPPING APPARATUS
- Publication number 20140197610
- Publication date Jul 17, 2014
- EBARA CORPORATION
- Mitsuru Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAREHOLDER MANAGEMENT APPARATUS, SHAREHOLDER MANAGEMENT METHOD, AN...
- Publication number 20130096992
- Publication date Apr 18, 2013
- INVESTOR NETWORKS INC.
- Mitsuo Sugimoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20120244787
- Publication date Sep 27, 2012
- Masaya SEKI
- B24 - GRINDING POLISHING
Information Patent Application
Liquid-scattering prevention cup, substrate processing apparatus an...
- Publication number 20100154837
- Publication date Jun 24, 2010
- EBARA CORPORATION
- Takahiro Ogawa
- B08 - CLEANING
Information Patent Application
Substrate processing apparatus, substrate processing method, substr...
- Publication number 20090305612
- Publication date Dec 10, 2009
- EBARA CORPORATION
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Application
Substrate cleaning apparatus
- Publication number 20090101181
- Publication date Apr 23, 2009
- EBARA CORPORATION
- Shinya Morisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate processing apparatus
- Publication number 20050236268
- Publication date Oct 27, 2005
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating device and method
- Publication number 20040234696
- Publication date Nov 25, 2004
- Akihisa Hongo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for forming interconnects, and polishing liqui...
- Publication number 20040200728
- Publication date Oct 14, 2004
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus
- Publication number 20040194698
- Publication date Oct 7, 2004
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for forming interconnects, and polishing liqui...
- Publication number 20020088709
- Publication date Jul 11, 2002
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Naoki Matsuda

Person

Patents Grantslast 30 patents

Substrate processing apparatus, substrate processing method, substr...

Insertion position correction in an electronic component insertion...

Polishing apparatus and polishing method

Substrate processing apparatus, substrate processing method, substr...

Substrate gripping apparatus

Substrate processing apparatus, substrate processing method, substr...

Substrate processing apparatus, substrate processing method, substr...

Substrate gripping apparatus

Polishing apparatus and polishing method

Polishing apparatus and polishing method

Substrate processing apparatus, substrate processing method, substr...

Plating apparatus

Apparatus for forming interconnects

Apparatus for cleaning a substrate such as a semiconductor wafer

Cleaning apparatus

Apparatus for cleaning substrate

Cleaning apparatus and cleaning member rinsing apparatus

Cleaning apparatus

Thin-film vapor deposition apparatus

Luminance/chrominance separating apparatus

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...

INSERTION POSITION CORRECTION IN AN ELECTRONIC COMPONENT INSERTION...

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...

SUBSTRATE GRIPPING APPARATUS

POLISHING APPARATUS AND POLISHING METHOD

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SUBSTR...

POLISHING APPARATUS AND POLISHING METHOD

SUBSTRATE GRIPPING APPARATUS

SHAREHOLDER MANAGEMENT APPARATUS, SHAREHOLDER MANAGEMENT METHOD, AN...

POLISHING APPARATUS AND POLISHING METHOD

Liquid-scattering prevention cup, substrate processing apparatus an...

Substrate processing apparatus, substrate processing method, substr...

Substrate cleaning apparatus

Substrate processing apparatus

Plating device and method

Method and apparatus for forming interconnects, and polishing liqui...

Plating apparatus

Method and apparatus for forming interconnects, and polishing liqui...