Naoki Nakamura

Person

Hachioji, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Recording medium recording via lifetime calculation program, via li...
- Patent number 10,929,585
- Issue date Feb 23, 2021
- Fujitsu Limited
- Mitsunori Abe
- G01 - MEASURING TESTING
Information Patent Grant
Method for outputting impact degree and information processing device
- Patent number 10,783,309
- Issue date Sep 22, 2020
- Fujitsu Limited
- Mitsunori Abe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed wiring board, crack prediction device, and crack prediction...
- Patent number 10,605,851
- Issue date Mar 31, 2020
- Fujitsu Limited
- Shigeo Iriguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, electronic device, and manufacturing method
- Patent number 9,763,331
- Issue date Sep 12, 2017
- Fujitsu Limited
- Yoshiyuki Hiroshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, crack prediction device, and crack prediction...
- Patent number 9,709,619
- Issue date Jul 18, 2017
- Fujitsu Limited
- Shigeo Iriguchi
- G01 - MEASURING TESTING
Information Patent Grant
Substrate with embedded component
- Patent number 9,591,763
- Issue date Mar 7, 2017
- Fujitsu Limited
- Mitsunori Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Placement apparatus and a suction nozzle for an optical component
- Patent number 9,572,293
- Issue date Feb 14, 2017
- Fujitsu Limited
- Yoshiyuki Hiroshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed board
- Patent number 9,295,155
- Issue date Mar 22, 2016
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical coupling structure and optical transmission apparatus
- Patent number 9,188,743
- Issue date Nov 17, 2015
- Fujitsu Limitd
- Kohei Choraku
- G02 - OPTICS
Information Patent Grant
Light emitting member mounting method and apparatus
- Patent number 8,777,091
- Issue date Jul 15, 2014
- Fujitsu Limited
- Yoshiyuki Hiroshima
- G02 - OPTICS
Information Patent Grant
Printed wiring board reliably achieving electric connection with el...
- Patent number 8,305,767
- Issue date Nov 6, 2012
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed board
- Patent number 8,269,114
- Issue date Sep 18, 2012
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board reliably achieving electric connection with el...
- Patent number 8,233,286
- Issue date Jul 31, 2012
- Fujitsu Limited
- Naoki Nakamura
Information Patent Grant
Printed wiring board
- Patent number 7,679,006
- Issue date Mar 16, 2010
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing wiring board
- Patent number 7,549,222
- Issue date Jun 23, 2009
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board including via contributing to superior charac...
- Patent number 7,372,143
- Issue date May 13, 2008
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring base board, method of producing thereof, and electronic device
- Patent number 7,317,166
- Issue date Jan 8, 2008
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board, manufacturing method therefor and test app...
- Patent number 7,284,311
- Issue date Oct 23, 2007
- Fujitsu Limited
- Naoki Nakamura
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer wiring board, manufacturing method therefor and test app...
- Patent number 7,091,716
- Issue date Aug 15, 2006
- Fujitsu Limited
- Naoki Nakamura
- G01 - MEASURING TESTING
Information Patent Grant
Method of making a multilayer wiring board
- Patent number 7,047,634
- Issue date May 23, 2006
- Fujitsu Limited
- Naoki Nakamura
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR OUTPUTTING IMPACT DEGREE AND INFORMATION PROCESSING DEVICE
- Publication number 20200026816
- Publication date Jan 23, 2020
- Fujitsu Limited
- Mitsunori Abe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RECORDING MEDIUM RECORDING VIA LIFETIME CALCULATION PROGRAM, VIA LI...
- Publication number 20190220564
- Publication date Jul 18, 2019
- Fujitsu Limited
- Mitsunori ABE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...
- Publication number 20170285096
- Publication date Oct 5, 2017
- Fujitsu Limited
- Shigeo IRIGUCHI
- G01 - MEASURING TESTING
Information Patent Application
RIGID FLEXIBLE BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170196077
- Publication date Jul 6, 2017
- Fujitsu Limited
- Shigeo Iriguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD, SEMICONDUCTOR APPARATUS, AND METHOD OF MA...
- Publication number 20170006699
- Publication date Jan 5, 2017
- Fujitsu Limited
- Daisuke Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH EMBEDDED COMPONENT
- Publication number 20160324005
- Publication date Nov 3, 2016
- Fujitsu Limited
- Mitsunori Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD
- Publication number 20160309593
- Publication date Oct 20, 2016
- Fujitsu Limited
- Yoshiyuki Hiroshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLACEMENT APPARATUS FOR OPTICAL COMPONENT, SUCTION NOZZLE FOR OPTIC...
- Publication number 20140283380
- Publication date Sep 25, 2014
- Fujitsu Limited
- Yoshiyuki HIROSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...
- Publication number 20140077834
- Publication date Mar 20, 2014
- Shigeo IRIGUCHI
- G01 - MEASURING TESTING
Information Patent Application
LIGHT EMITTING MEMBER MOUNTING METHOD AND APPARATUS
- Publication number 20130256387
- Publication date Oct 3, 2013
- Fujitsu Limited
- Yoshiyuki HIROSHIMA
- G02 - OPTICS
Information Patent Application
OPTICAL COUPLING STRUCTURE AND OPTICAL TRANSMISSION APPARATUS
- Publication number 20130243376
- Publication date Sep 19, 2013
- Kohei Choraku
- G02 - OPTICS
Information Patent Application
FLEXIBLE PRINTED BOARD
- Publication number 20120312586
- Publication date Dec 13, 2012
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD UNIT, ELECTRONIC APPARA...
- Publication number 20120234587
- Publication date Sep 20, 2012
- Fujitsu Limited
- Naoki NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD USING FLEXIBLE INTERCONNECT STRUCT...
- Publication number 20110286188
- Publication date Nov 24, 2011
- Fujitsu Limited
- Ryo KANAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD UNIT, ELECTRONIC DEVICE AND METHOD OF FABRICA...
- Publication number 20110240355
- Publication date Oct 6, 2011
- Fujitsu Limited
- Naoki NAKAMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD
- Publication number 20110240352
- Publication date Oct 6, 2011
- Fujitsu Limited
- Naoki NAKAMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME...
- Publication number 20110132654
- Publication date Jun 9, 2011
- Fujitsu Limited
- Nobuo TAKETOMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED BOARD
- Publication number 20100212938
- Publication date Aug 26, 2010
- FUJITSU LIMITED
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board, multilayer wiring board unit and electroni...
- Publication number 20090236143
- Publication date Sep 24, 2009
- FUJITSU LIMITED
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board reliably achieving electric connection with el...
- Publication number 20080080153
- Publication date Apr 3, 2008
- FUJITSU LIMITED
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board
- Publication number 20080000681
- Publication date Jan 3, 2008
- Fujitsu Limited
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring base board, method of producing thereof, and electronic device
- Publication number 20060118329
- Publication date Jun 8, 2006
- FUJITSU LIMITED
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring base board, method of producing thereof, and electronic device
- Publication number 20050247482
- Publication date Nov 10, 2005
- FUJITSU LIMITED
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board, manufacturing method therefor and test app...
- Publication number 20050246891
- Publication date Nov 10, 2005
- FUJITSU LIMITED
- Naoki Nakamura
- G01 - MEASURING TESTING
Information Patent Application
Printed circuit board including via contributing to superior charac...
- Publication number 20050230813
- Publication date Oct 20, 2005
- FUJITSU LIMITED
- Naoki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board, manufacturing method therefor and test app...
- Publication number 20040066634
- Publication date Apr 8, 2004
- FUJITSU LIMITED
- Naoki Nakamura
- G01 - MEASURING TESTING
Information Patent Application
Multilayer wiring board, manufacturing method therefor and test app...
- Publication number 20040063340
- Publication date Apr 1, 2004
- FUJITSU LIMITED
- Naoki Nakamura
- G01 - MEASURING TESTING
Information Patent Application
Multilayer wiring board, manufacturing method therefor and test app...
- Publication number 20030159852
- Publication date Aug 28, 2003
- FUJITSU LIMITED
- Naoki Nakamura
- G01 - MEASURING TESTING

Naoki Nakamura

Person

Patents Grantslast 30 patents

Recording medium recording via lifetime calculation program, via li...

Method for outputting impact degree and information processing device

Printed wiring board, crack prediction device, and crack prediction...

Printed circuit board, electronic device, and manufacturing method

Printed wiring board, crack prediction device, and crack prediction...

Substrate with embedded component

Placement apparatus and a suction nozzle for an optical component

Flexible printed board

Optical coupling structure and optical transmission apparatus

Light emitting member mounting method and apparatus

Printed wiring board reliably achieving electric connection with el...

Flexible printed board

Printed wiring board reliably achieving electric connection with el...

Printed wiring board

Method of producing wiring board

Printed circuit board including via contributing to superior charac...

Wiring base board, method of producing thereof, and electronic device

Multilayer wiring board, manufacturing method therefor and test app...

Multilayer wiring board, manufacturing method therefor and test app...

Method of making a multilayer wiring board

Patents Applicationslast 30 patents

METHOD FOR OUTPUTTING IMPACT DEGREE AND INFORMATION PROCESSING DEVICE

RECORDING MEDIUM RECORDING VIA LIFETIME CALCULATION PROGRAM, VIA LI...

PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...

RIGID FLEXIBLE BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER CIRCUIT BOARD, SEMICONDUCTOR APPARATUS, AND METHOD OF MA...

SUBSTRATE WITH EMBEDDED COMPONENT

PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD

PLACEMENT APPARATUS FOR OPTICAL COMPONENT, SUCTION NOZZLE FOR OPTIC...

PRINTED WIRING BOARD, CRACK PREDICTION DEVICE, AND CRACK PREDICTION...

LIGHT EMITTING MEMBER MOUNTING METHOD AND APPARATUS

OPTICAL COUPLING STRUCTURE AND OPTICAL TRANSMISSION APPARATUS

FLEXIBLE PRINTED BOARD

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD UNIT, ELECTRONIC APPARA...

MULTILAYER PRINTED CIRCUIT BOARD USING FLEXIBLE INTERCONNECT STRUCT...

PRINTED CIRCUIT BOARD UNIT, ELECTRONIC DEVICE AND METHOD OF FABRICA...

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD

MULTILAYER PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME...

FLEXIBLE PRINTED BOARD

Multilayer wiring board, multilayer wiring board unit and electroni...

Printed wiring board reliably achieving electric connection with el...

Printed wiring board

Wiring base board, method of producing thereof, and electronic device

Wiring base board, method of producing thereof, and electronic device

Multilayer wiring board, manufacturing method therefor and test app...

Printed circuit board including via contributing to superior charac...

Multilayer wiring board, manufacturing method therefor and test app...

Multilayer wiring board, manufacturing method therefor and test app...

Multilayer wiring board, manufacturing method therefor and test app...